DE69115834D1 - Vorrichtungen von Infrarot-Detektoren - Google Patents

Vorrichtungen von Infrarot-Detektoren

Info

Publication number
DE69115834D1
DE69115834D1 DE69115834T DE69115834T DE69115834D1 DE 69115834 D1 DE69115834 D1 DE 69115834D1 DE 69115834 T DE69115834 T DE 69115834T DE 69115834 T DE69115834 T DE 69115834T DE 69115834 D1 DE69115834 D1 DE 69115834D1
Authority
DE
Germany
Prior art keywords
devices
infrared detectors
detectors
infrared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115834T
Other languages
English (en)
Other versions
DE69115834T2 (de
Inventor
Ian Martin Baker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Marconi Ltd, Marconi Co Ltd filed Critical GEC Marconi Ltd
Publication of DE69115834D1 publication Critical patent/DE69115834D1/de
Application granted granted Critical
Publication of DE69115834T2 publication Critical patent/DE69115834T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14649—Infrared imagers
    • H01L27/1465—Infrared imagers of the hybrid type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Light Receiving Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE69115834T 1990-10-17 1991-10-08 Vorrichtungen von Infrarot-Detektoren Expired - Fee Related DE69115834T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9022464A GB2248964A (en) 1990-10-17 1990-10-17 Plural-wavelength infrared detector devices

Publications (2)

Publication Number Publication Date
DE69115834D1 true DE69115834D1 (de) 1996-02-08
DE69115834T2 DE69115834T2 (de) 1996-05-23

Family

ID=10683814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115834T Expired - Fee Related DE69115834T2 (de) 1990-10-17 1991-10-08 Vorrichtungen von Infrarot-Detektoren

Country Status (6)

Country Link
US (1) US5239179A (de)
EP (1) EP0481552B1 (de)
JP (1) JP2556944B2 (de)
DE (1) DE69115834T2 (de)
GB (1) GB2248964A (de)
IL (1) IL99730A (de)

Families Citing this family (59)

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GB9116307D0 (en) * 1991-07-29 1991-11-06 Philips Electronic Associated Infrared detectors
GB9204078D0 (en) * 1992-02-26 1992-04-08 Philips Electronics Uk Ltd Infrared detector manufacture
US5633498A (en) * 1993-03-29 1997-05-27 Lucent Technologies Inc. Thermodynamically optimal infrared collector with directional reduction of concentration
KR960705347A (ko) * 1993-09-17 1996-10-09 루이스 지 지아호스 고체 상태 이메이저상의 마이크로렌즈 형성 방법(forming microlenses on solid state imager)
FR2713017B1 (fr) * 1993-11-23 1996-01-12 Commissariat Energie Atomique Détecteur de rayonnements dans deux bandes de longueurs d'ondes et procédé de fabrication de ce détecteur.
EP0680163A3 (de) * 1994-04-25 1996-07-03 At & T Corp Integrierter Detektor/Fotosender mit nicht abbildenden Direktor.
US5900630A (en) * 1994-06-27 1999-05-04 Raytheon Company Radiation detection apparatus
US5583340A (en) * 1995-06-08 1996-12-10 The United States Of America, As Represented By The Secretary Of Commerce Coupling apparatus for multimode infrared detectors
FR3026562A1 (fr) * 1995-08-30 2016-04-01 Commissariat Energie Atomique Detecteur infrarouge mulispectral.
US7495220B2 (en) 1995-10-24 2009-02-24 Bae Systems Information And Electronics Systems Integration Inc. Uncooled infrared sensor
IL124443A (en) * 1995-11-15 2001-11-25 Lockheed Martin Ir Imaging Sys Dual-band multi-level microbridge detector
EP0865672B1 (de) * 1995-12-04 2000-08-30 Lockheed-Martin IR Imaging Systems Infrarot-strahlungsdetektor mit verkleinerter wirksamer fläche
US5694056A (en) * 1996-04-01 1997-12-02 Xilinx, Inc. Fast pipeline frame full detector
US5721429A (en) * 1996-07-23 1998-02-24 Hughes Electronics Self-focusing detector pixel structure having improved sensitivity
FR2756666B1 (fr) * 1996-12-04 1999-02-19 Thomson Csf Detecteur d'ondes electromagnetiques
FR2756667B1 (fr) * 1996-12-04 1999-02-19 Thomson Csf Detecteur d'ondes electromagnetiques bispectral
JPH10335618A (ja) * 1997-05-20 1998-12-18 Hewlett Packard Co <Hp> 光センサ・アレイ
US6310346B1 (en) 1997-05-30 2001-10-30 University Of Central Florida Wavelength-tunable coupled antenna uncooled infrared (IR) sensor
US6037590A (en) * 1997-05-30 2000-03-14 University Of Central Florida Polarization-tunable antenna-coupled infrared detector
US6097031A (en) * 1997-07-25 2000-08-01 Honeywell Inc. Dual bandwith bolometer
EP1207415B1 (de) * 1997-10-29 2006-08-30 MacAulay, Calum, E. Gerät und Verfahren zur Mikroskopie unter Verwendung räumlich modulierten Lichtes
US6034373A (en) * 1997-12-11 2000-03-07 Imrad Imaging Systems Ltd. Semiconductor radiation detector with reduced surface effects
US6064067A (en) * 1998-04-13 2000-05-16 Wayne State University High-gain infrared collector and data node
US6147349A (en) * 1998-07-31 2000-11-14 Raytheon Company Method for fabricating a self-focusing detector pixel and an array fabricated in accordance with the method
US6236508B1 (en) * 1999-03-03 2001-05-22 The Boeing Company Multicolor detector and focal plane array using diffractive lenses
JP2001068658A (ja) * 1999-08-27 2001-03-16 Sony Corp 固体撮像装置及びその製造方法
US20030164450A1 (en) * 2000-03-29 2003-09-04 Rainer Bruchhaus Thermal radiation detection device, method for producing the same and use of said device
GB0017659D0 (en) * 2000-07-19 2000-09-06 Secr Defence Light emitting diode with lens
US6594422B2 (en) * 2001-05-02 2003-07-15 Motorola, Inc. Opto-coupling device structure and method therefor
US6633716B2 (en) * 2001-05-02 2003-10-14 Motorola, Inc. Optical device and method therefor
US20060072109A1 (en) * 2004-09-03 2006-04-06 Andrew Bodkin Hyperspectral imaging systems
US7049597B2 (en) * 2001-12-21 2006-05-23 Andrew Bodkin Multi-mode optical imager
US8174694B2 (en) * 2001-12-21 2012-05-08 Bodkin Design And Engineering Llc Hyperspectral imaging systems
US7796316B2 (en) * 2001-12-21 2010-09-14 Bodkin Design And Engineering Llc Micro-optic shutter
US7196790B2 (en) 2002-03-18 2007-03-27 Honeywell International Inc. Multiple wavelength spectrometer
US7351977B2 (en) * 2002-11-08 2008-04-01 L-3 Communications Cincinnati Electronics Corporation Methods and systems for distinguishing multiple wavelengths of radiation and increasing detected signals in a detection system using micro-optic structures
US7129488B2 (en) * 2003-12-23 2006-10-31 Sharp Laboratories Of America, Inc. Surface-normal optical path structure for infrared photodetection
US7531363B2 (en) 2003-12-30 2009-05-12 Honeywell International Inc. Particle detection using fluorescence
EP1564817A1 (de) * 2004-02-10 2005-08-17 Samsung Electronics Co., Ltd. Photodiode mit einer durch einen PN-Übergang getrennten lichtabsorbierenden Zone und Herstellungsverfahren dazu
US7095027B1 (en) * 2004-02-25 2006-08-22 University Of Central Florida Research Foundation, Inc. Multispectral multipolarization antenna-coupled infrared focal plane array
JP2008103614A (ja) * 2006-10-20 2008-05-01 Mitsui Eng & Shipbuild Co Ltd 光電変換デバイス
US8154732B2 (en) * 2007-04-27 2012-04-10 Bodkin Design And Engineering, Llc Multiband spatial heterodyne spectrometer and associated methods
US8922783B2 (en) 2007-04-27 2014-12-30 Bodkin Design And Engineering Llc Multiband spatial heterodyne spectrometer and associated methods
TWI356333B (en) * 2008-03-21 2012-01-11 Chimei Innolux Corp Liquid crystal display and remote controlling syst
US8946839B1 (en) 2009-08-20 2015-02-03 Hrl Laboratories, Llc Reduced volume infrared detector
US7928389B1 (en) 2009-08-20 2011-04-19 Hrl Laboratories, Llc Wide bandwidth infrared detector and imager
US7977637B1 (en) 2009-08-20 2011-07-12 Hrl Laboratories, Llc Honeycomb infrared detector
CN102931201A (zh) * 2011-08-11 2013-02-13 中国科学院微电子研究所 基于红外焦平面阵列的聚能微镜阵列及其制作方法
US10677656B2 (en) 2012-12-31 2020-06-09 Flir Systems, Inc. Devices and methods for infrared reference pixels
US9606016B2 (en) 2012-12-31 2017-03-28 Flir Systems, Inc. Devices and methods for determining vacuum pressure levels
US9034734B2 (en) * 2013-02-04 2015-05-19 Avago Technologies General Ip (Singapore) Pte. Ltd. Systems and methods for plasma etching compound semiconductor (CS) dies and passively aligning the dies
US9490292B1 (en) 2013-03-15 2016-11-08 Hrl Laboratories, Llc Dual-band detector array
US10903261B1 (en) 2013-03-15 2021-01-26 Hrl Laboratories, Llc Triple output, dual-band detector
US10020331B1 (en) 2016-07-21 2018-07-10 Hrl Laboratories, Llc Dual-band lateral-effect position sensor
WO2020033930A2 (en) 2018-08-10 2020-02-13 Obsidian Sensors, Inc. Mems sensors and systems
WO2020209927A1 (en) * 2019-04-11 2020-10-15 Hrl Laboratories, Llc Simultaneous dual-band image sensors
US11320545B2 (en) 2020-07-07 2022-05-03 GE Precision Healthcare LLC Systems and methods for improved medical imaging
US11092701B1 (en) 2020-07-07 2021-08-17 GE Precision Healthcare LLC Systems and methods for improved medical imaging
JP7138149B2 (ja) * 2020-11-11 2022-09-15 浜松ホトニクス株式会社 受光装置、及び受光装置の製造方法

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JPS55115375A (en) * 1979-02-26 1980-09-05 Matsushita Electric Ind Co Ltd Light detector element
US4559695A (en) * 1981-03-27 1985-12-24 U.S. Philips Corporation Method of manufacturing an infrared radiation imaging device
JPS5855909A (ja) * 1981-09-29 1983-04-02 Takeomi Suzuki 光学像検出装置
GB2116363B (en) * 1982-03-03 1985-10-16 Philips Electronic Associated Multi-level infra-red detectors and their manufacture
US4629892A (en) * 1982-12-22 1986-12-16 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Optically immersed detector assembly
DE3429812C1 (de) * 1984-08-14 1986-04-10 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Monolithischer Bildaufnehmer
US4754139A (en) * 1986-04-10 1988-06-28 Aerojet-General Corporation Uncooled high resolution infrared imaging plane
GB8715211D0 (en) * 1987-06-29 1987-08-05 Secr Defence Lensed photo detector
JPH0265181A (ja) * 1988-08-30 1990-03-05 Fujitsu Ltd 赤外線検知装置

Also Published As

Publication number Publication date
EP0481552B1 (de) 1995-12-27
GB9022464D0 (en) 1991-02-20
EP0481552A1 (de) 1992-04-22
GB2248964A (en) 1992-04-22
JP2556944B2 (ja) 1996-11-27
JPH04260368A (ja) 1992-09-16
IL99730A0 (en) 1992-08-18
IL99730A (en) 1994-10-07
DE69115834T2 (de) 1996-05-23
US5239179A (en) 1993-08-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee