DE69305369D1 - Verfahren zum Aufbringen einer Lotlegierung auf die Anschlussfahnen elektronischer Bausteine - Google Patents

Verfahren zum Aufbringen einer Lotlegierung auf die Anschlussfahnen elektronischer Bausteine

Info

Publication number
DE69305369D1
DE69305369D1 DE69305369T DE69305369T DE69305369D1 DE 69305369 D1 DE69305369 D1 DE 69305369D1 DE 69305369 T DE69305369 T DE 69305369T DE 69305369 T DE69305369 T DE 69305369T DE 69305369 D1 DE69305369 D1 DE 69305369D1
Authority
DE
Germany
Prior art keywords
applying
electronic components
solder alloy
terminal lugs
lugs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69305369T
Other languages
English (en)
Other versions
DE69305369T2 (de
Inventor
Sylvie Mellul
Pierre Claverie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide SA, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical Air Liquide SA
Publication of DE69305369D1 publication Critical patent/DE69305369D1/de
Application granted granted Critical
Publication of DE69305369T2 publication Critical patent/DE69305369T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Molten Solder (AREA)
DE69305369T 1992-01-13 1993-01-13 Verfahren zum Aufbringen einer Lotlegierung auf die Anschlussfahnen elektronischer Bausteine Expired - Fee Related DE69305369T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9200239A FR2686212B1 (fr) 1992-01-13 1992-01-13 Procede d'application de composition de soudure sur des broches de composants electroniques.

Publications (2)

Publication Number Publication Date
DE69305369D1 true DE69305369D1 (de) 1996-11-21
DE69305369T2 DE69305369T2 (de) 1997-03-13

Family

ID=9425546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69305369T Expired - Fee Related DE69305369T2 (de) 1992-01-13 1993-01-13 Verfahren zum Aufbringen einer Lotlegierung auf die Anschlussfahnen elektronischer Bausteine

Country Status (7)

Country Link
US (1) US5433372A (de)
EP (1) EP0552096B1 (de)
JP (1) JPH05283856A (de)
KR (1) KR930017237A (de)
CA (1) CA2087068A1 (de)
DE (1) DE69305369T2 (de)
FR (1) FR2686212B1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6021940A (en) * 1993-12-15 2000-02-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and apparatus for reflow soldering metallic surfaces
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
FR2727044A1 (fr) * 1994-11-23 1996-05-24 Electrovague Dispositif d'injection d'un gaz neutre, notamment de l'azote, pour machine de soudure a la vague et machine de soudure a la vague munie d'un tel systeme
US20070054797A1 (en) * 2003-08-09 2007-03-08 Thomas Ronald J Siliceous clay slurry
US7105466B2 (en) 2003-08-09 2006-09-12 H.C. Spinks Clay Company, Inc. Siliceous clay slurry
US7091148B2 (en) * 2003-08-09 2006-08-15 H.C. Spinks Clay Company, Inc. Silicious clay slurry
US20110139855A1 (en) * 2009-12-16 2011-06-16 Ristolainen Tero Residual oxygen measurement and control in wave soldering process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576659A (en) * 1982-12-02 1986-03-18 International Business Machines Corporation Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
US4646958A (en) * 1985-10-31 1987-03-03 International Business Machines Corp. Fluxless soldering process using a silane atmosphere
DE3813931C2 (de) * 1988-04-25 1995-05-04 Resma Gmbh Fuegetechnik Indust Schutzgaslötverfahren und Vorrichtung zur Ausführung dieses Verfahrens
US5071058A (en) * 1988-09-30 1991-12-10 Union Carbide Industrial Gases Technology Corporation Process for joining/coating using an atmosphere having a controlled oxidation capability
FR2653448B1 (fr) * 1989-10-20 1992-01-10 Air Liquide Procede d'elaboration d'une atmosphere de traitement de metaux.
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering

Also Published As

Publication number Publication date
FR2686212A1 (fr) 1993-07-16
EP0552096A1 (de) 1993-07-21
DE69305369T2 (de) 1997-03-13
CA2087068A1 (fr) 1993-07-14
US5433372A (en) 1995-07-18
FR2686212B1 (fr) 1994-03-11
JPH05283856A (ja) 1993-10-29
EP0552096B1 (de) 1996-10-16
KR930017237A (ko) 1993-08-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee