DE69303844D1 - Vakuumsprozessvorrichtung - Google Patents

Vakuumsprozessvorrichtung

Info

Publication number
DE69303844D1
DE69303844D1 DE69303844T DE69303844T DE69303844D1 DE 69303844 D1 DE69303844 D1 DE 69303844D1 DE 69303844 T DE69303844 T DE 69303844T DE 69303844 T DE69303844 T DE 69303844T DE 69303844 D1 DE69303844 D1 DE 69303844D1
Authority
DE
Germany
Prior art keywords
process device
vacuum process
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69303844T
Other languages
English (en)
Other versions
DE69303844T2 (de
Inventor
Akitaka Makino
Naoyuki Tamura
Tetsunori Kaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26411739&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69303844(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69303844D1 publication Critical patent/DE69303844D1/de
Application granted granted Critical
Publication of DE69303844T2 publication Critical patent/DE69303844T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/935—Gas flow control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE69303844T 1992-03-27 1993-03-18 Vakuumsprozessvorrichtung Revoked DE69303844T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4070610A JP2661455B2 (ja) 1992-03-27 1992-03-27 真空処理装置
US08/394,952 US5607510A (en) 1992-03-27 1995-02-27 Vacuum processing apparatus

Publications (2)

Publication Number Publication Date
DE69303844D1 true DE69303844D1 (de) 1996-09-05
DE69303844T2 DE69303844T2 (de) 1996-11-28

Family

ID=26411739

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69303844T Revoked DE69303844T2 (de) 1992-03-27 1993-03-18 Vakuumsprozessvorrichtung

Country Status (4)

Country Link
US (2) US5391260A (de)
EP (1) EP0562464B1 (de)
JP (1) JP2661455B2 (de)
DE (1) DE69303844T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2661455B2 (ja) * 1992-03-27 1997-10-08 株式会社日立製作所 真空処理装置
US5824158A (en) * 1993-06-30 1998-10-20 Kabushiki Kaisha Kobe Seiko Sho Chemical vapor deposition using inductively coupled plasma and system therefor
US5607542A (en) * 1994-11-01 1997-03-04 Applied Materials Inc. Inductively enhanced reactive ion etching
GB9616225D0 (en) 1996-08-01 1996-09-11 Surface Tech Sys Ltd Method of surface treatment of semiconductor substrates
EP0822582B1 (de) * 1996-08-01 2003-10-01 Surface Technology Systems Plc Verfahren zur Ätzung von Substraten
JP4356117B2 (ja) * 1997-01-29 2009-11-04 財団法人国際科学振興財団 プラズマ装置
US6187685B1 (en) 1997-08-01 2001-02-13 Surface Technology Systems Limited Method and apparatus for etching a substrate
US6417013B1 (en) 1999-01-29 2002-07-09 Plasma-Therm, Inc. Morphed processing of semiconductor devices
JP3645768B2 (ja) * 1999-12-07 2005-05-11 シャープ株式会社 プラズマプロセス装置
JP2003209097A (ja) * 2001-08-29 2003-07-25 Tokyo Electron Ltd ウエハ処理マシン
US7351291B2 (en) * 2002-02-20 2008-04-01 Tokyo Electron Limited Semiconductor processing system
US6893506B2 (en) * 2002-03-11 2005-05-17 Micron Technology, Inc. Atomic layer deposition apparatus and method
AU2003253689A1 (en) * 2002-07-31 2004-02-16 Tokyo Electron Limited Reduced volume, high conductance process chamber
JP4074224B2 (ja) * 2003-06-26 2008-04-09 住友重機械工業株式会社 真空装置及び電子ビーム近接露光装置
US8622905B2 (en) * 2003-08-01 2014-01-07 Dexcom, Inc. System and methods for processing analyte sensor data
WO2010024036A1 (ja) * 2008-08-28 2010-03-04 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置のクリーニング方法
US9679751B2 (en) 2012-03-15 2017-06-13 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816078A (ja) * 1981-07-17 1983-01-29 Toshiba Corp プラズマエツチング装置
JPH01122834U (de) * 1988-02-02 1989-08-21
NL8901630A (nl) * 1989-06-28 1991-01-16 Philips Nv Vacuuem systeem.
US5000225A (en) * 1989-11-17 1991-03-19 Applied Materials, Inc. Low profile, combination throttle/gate valve for a multi-pump chamber
JPH03290926A (ja) * 1990-04-06 1991-12-20 Sumitomo Metal Ind Ltd プラズマ装置及び該装置の使用方法
JPH0470610A (ja) * 1990-07-06 1992-03-05 Nippon Telegr & Teleph Corp <Ntt> 光コネクタフェルールの取付け方法
JP2661455B2 (ja) * 1992-03-27 1997-10-08 株式会社日立製作所 真空処理装置

Also Published As

Publication number Publication date
JP2661455B2 (ja) 1997-10-08
US5607510A (en) 1997-03-04
EP0562464A1 (de) 1993-09-29
EP0562464B1 (de) 1996-07-31
JPH05269361A (ja) 1993-10-19
US5391260A (en) 1995-02-21
DE69303844T2 (de) 1996-11-28

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation