DE69224758D1 - Laminat auf basis eines verstärkten polyimidfilms, der metallorganische verbindungen zur haftverbesserung enthält - Google Patents

Laminat auf basis eines verstärkten polyimidfilms, der metallorganische verbindungen zur haftverbesserung enthält

Info

Publication number
DE69224758D1
DE69224758D1 DE69224758T DE69224758T DE69224758D1 DE 69224758 D1 DE69224758 D1 DE 69224758D1 DE 69224758 T DE69224758 T DE 69224758T DE 69224758 T DE69224758 T DE 69224758T DE 69224758 D1 DE69224758 D1 DE 69224758D1
Authority
DE
Germany
Prior art keywords
organic compounds
film containing
polyimide film
containing metal
metal organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69224758T
Other languages
English (en)
Other versions
DE69224758T2 (de
Inventor
Anthony Arduengo
Yia Ray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69224758D1 publication Critical patent/DE69224758D1/de
Publication of DE69224758T2 publication Critical patent/DE69224758T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C08K5/57—Organo-tin compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
DE1992624758 1992-01-17 1992-12-30 Laminat auf basis eines verstärkten polyimidfilms, der metallorganische verbindungen zur haftverbesserung enthält Expired - Fee Related DE69224758T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/822,501 US5272194A (en) 1992-01-17 1992-01-17 Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion
PCT/US1992/011322 WO1993014157A1 (en) 1992-01-17 1992-12-30 Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion

Publications (2)

Publication Number Publication Date
DE69224758D1 true DE69224758D1 (de) 1998-04-16
DE69224758T2 DE69224758T2 (de) 1998-07-09

Family

ID=25236206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1992624758 Expired - Fee Related DE69224758T2 (de) 1992-01-17 1992-12-30 Laminat auf basis eines verstärkten polyimidfilms, der metallorganische verbindungen zur haftverbesserung enthält

Country Status (5)

Country Link
US (1) US5272194A (de)
EP (1) EP0621888B1 (de)
JP (1) JP2653725B2 (de)
DE (1) DE69224758T2 (de)
WO (1) WO1993014157A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543222A (en) * 1994-04-29 1996-08-06 E. I. Du Pont De Nemours And Company Metallized polyimide film containing a hydrocarbyl tin compound
US5525405A (en) 1994-12-14 1996-06-11 E. I. Du Pont De Nemours And Company Adhesiveless aromatic polyimide laminate
DE69822973T2 (de) * 1997-11-28 2005-03-31 Ube Industries, Ltd., Ube Aromatische Polyimidfolie mit verbesserter Haftung
US6156438A (en) * 1998-04-09 2000-12-05 E. I. Du Pont De Nemours And Company Monolithic polyimide laminate containing encapsulated design and preparation thereof
FR2786193B1 (fr) 1998-11-20 2002-03-22 Kaneka Corp Stratifies de polimide/resine fluoree, leur procede de fabrication, et ruban isolant pour enroulement autour de conducteurs, forme a partir de ces stratifies
JP2000289166A (ja) * 1999-04-09 2000-10-17 E I Du Pont De Nemours & Co 封入された構造を含む一体式ポリイミド積層体および該積層体の製造方法
US6653433B2 (en) 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad
WO2004045846A1 (ja) * 2002-11-20 2004-06-03 Tomoegawa Paper Co., Ltd. フレキシブル金属積層体及び耐熱性接着剤組成物
SG108945A1 (en) * 2003-01-20 2005-02-28 Sumitomo Chemical Co Metal compound, and catalyst component and catalyst for addition polymerization, and process for producing addition polymer
JP2005144816A (ja) * 2003-11-13 2005-06-09 Tomoegawa Paper Co Ltd フレキシブル金属積層体
JP2006114168A (ja) 2004-10-18 2006-04-27 Ricoh Co Ltd 再生方法、光ディスク装置、プログラム及び記録媒体
WO2006109753A1 (ja) 2005-04-07 2006-10-19 Ube Industries, Ltd. ポリイミドフィルムの製造方法およびポリイミドフィルム
JP5868753B2 (ja) * 2012-03-26 2016-02-24 東レ・デュポン株式会社 ポリイミドフィルム
US9471012B2 (en) 2013-09-20 2016-10-18 Xerox Corporation Coating composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3063963A (en) * 1958-10-13 1962-11-13 Eastman Kodak Co Stabilized polymers of vinylidene chloride or vinyl chloride containing a sulfur compound and a tin compound
US3073785A (en) * 1959-07-02 1963-01-15 Electrically conductive polymeric
US3179630A (en) * 1962-01-26 1965-04-20 Du Pont Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides
US3240795A (en) * 1962-07-02 1966-03-15 Exxon Research Engineering Co Organometallic compounds
US3389111A (en) * 1965-01-04 1968-06-18 Minnesota Mining & Mfg Corona resistant polyimide compositions containing certain organo-metallic compounds
JPS4519663B1 (de) * 1966-06-07 1970-07-04
US3577346A (en) * 1968-11-14 1971-05-04 Minnesota Mining & Mfg Insulated electrical conductors having corona resistant polymeric insulation containing organo metallic compounds

Also Published As

Publication number Publication date
EP0621888A1 (de) 1994-11-02
DE69224758T2 (de) 1998-07-09
EP0621888B1 (de) 1998-03-11
JP2653725B2 (ja) 1997-09-17
WO1993014157A1 (en) 1993-07-22
JPH07503984A (ja) 1995-04-27
US5272194A (en) 1993-12-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee