DE69321095D1 - Magnetronzerstäubungsgerät mit Kollimator für die Beschichtung eines Substrats - Google Patents

Magnetronzerstäubungsgerät mit Kollimator für die Beschichtung eines Substrats

Info

Publication number
DE69321095D1
DE69321095D1 DE69321095T DE69321095T DE69321095D1 DE 69321095 D1 DE69321095 D1 DE 69321095D1 DE 69321095 T DE69321095 T DE 69321095T DE 69321095 T DE69321095 T DE 69321095T DE 69321095 D1 DE69321095 D1 DE 69321095D1
Authority
DE
Germany
Prior art keywords
collimator
coating
substrate
magnetron sputtering
sputtering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69321095T
Other languages
English (en)
Inventor
Geri M Actor
Vance E Hoffman
Ronald R Cochran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Application granted granted Critical
Publication of DE69321095D1 publication Critical patent/DE69321095D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • H01L21/203—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3494—Adaptation to extreme pressure conditions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69321095T 1992-12-16 1993-12-16 Magnetronzerstäubungsgerät mit Kollimator für die Beschichtung eines Substrats Expired - Lifetime DE69321095D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US99228592A 1992-12-16 1992-12-16

Publications (1)

Publication Number Publication Date
DE69321095D1 true DE69321095D1 (de) 1998-10-22

Family

ID=25538139

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69321095T Expired - Lifetime DE69321095D1 (de) 1992-12-16 1993-12-16 Magnetronzerstäubungsgerät mit Kollimator für die Beschichtung eines Substrats

Country Status (5)

Country Link
EP (1) EP0606745B1 (de)
JP (1) JPH07221019A (de)
KR (1) KR100345253B1 (de)
CA (1) CA2111536A1 (de)
DE (1) DE69321095D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643428A (en) * 1995-02-01 1997-07-01 Advanced Micro Devices, Inc. Multiple tier collimator system for enhanced step coverage and uniformity
AUPO338396A0 (en) * 1996-11-04 1996-11-28 Sola International Holdings Ltd Sputter coating apparatus
DE10004824B4 (de) * 2000-02-04 2009-06-25 Oc Oerlikon Balzers Ag Verfahren zur Herstellung von Substraten, Magnetronquelle, Sputterbeschichtungskammer und Verwendung des Verfahrens
EP2211367A1 (de) * 2009-01-21 2010-07-28 Applied Materials, Inc. Teilchenstrahlvorrichtung mit verringerter Emission von ungewünschtem Material
US20140197026A1 (en) * 2011-08-17 2014-07-17 Samsung Electronics Co., Ltd. Sputtering apparatus and method for forming a transmissive conductive layer of a light emitting device
US11017989B2 (en) 2018-03-16 2021-05-25 Samsung Electronics Co., Ltd. Collimator, fabrication apparatus including the same, and method of fabricating a semiconductor device using the same
KR102647861B1 (ko) * 2018-03-16 2024-03-18 삼성전자주식회사 콜리메이터, 그를 포함하는 반도체 소자의 제조장치 및 반도체 소자의 제조방법
CN115572949B (zh) * 2022-09-16 2023-06-16 广州湾区半导体产业集团有限公司 一种双镀源物理气相沉积工艺及多模式物理气相沉积设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229133A (ja) * 1985-07-31 1987-02-07 Hitachi Ltd スパツタ方法およびその装置
US4824544A (en) * 1987-10-29 1989-04-25 International Business Machines Corporation Large area cathode lift-off sputter deposition device
US5252194A (en) * 1990-01-26 1993-10-12 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
DE69129081T2 (de) * 1990-01-29 1998-07-02 Varian Associates Gerät und Verfahren zur Niederschlagung durch einen Kollimator
CA2061119C (en) * 1991-04-19 1998-02-03 Pei-Ing P. Lee Method of depositing conductors in high aspect ratio apertures
JP2725944B2 (ja) * 1991-04-19 1998-03-11 インターナショナル・ビジネス・マシーンズ・コーポレイション 金属層堆積方法
US5223108A (en) * 1991-12-30 1993-06-29 Materials Research Corporation Extended lifetime collimator

Also Published As

Publication number Publication date
CA2111536A1 (en) 1994-06-17
JPH07221019A (ja) 1995-08-18
EP0606745A1 (de) 1994-07-20
KR100345253B1 (ko) 2002-11-23
EP0606745B1 (de) 1998-09-16
KR940016462A (ko) 1994-07-23

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Legal Events

Date Code Title Description
8332 No legal effect for de