DE69223207T2 - Verfahren und Vorrichtung zur Messung einer Verlagerung - Google Patents

Verfahren und Vorrichtung zur Messung einer Verlagerung

Info

Publication number
DE69223207T2
DE69223207T2 DE69223207T DE69223207T DE69223207T2 DE 69223207 T2 DE69223207 T2 DE 69223207T2 DE 69223207 T DE69223207 T DE 69223207T DE 69223207 T DE69223207 T DE 69223207T DE 69223207 T2 DE69223207 T2 DE 69223207T2
Authority
DE
Germany
Prior art keywords
measuring displacement
displacement
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69223207T
Other languages
English (en)
Other versions
DE69223207D1 (de
Inventor
Koichi Sentoku
Takahiro Matsumoto
Noriyuki Nose
Minoru Yoshii
Kenji Saitoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3249216A external-priority patent/JPH0587529A/ja
Priority claimed from JP3249204A external-priority patent/JPH0587527A/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69223207D1 publication Critical patent/DE69223207D1/de
Application granted granted Critical
Publication of DE69223207T2 publication Critical patent/DE69223207T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
DE69223207T 1991-09-27 1992-09-24 Verfahren und Vorrichtung zur Messung einer Verlagerung Expired - Fee Related DE69223207T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3249216A JPH0587529A (ja) 1991-09-27 1991-09-27 計測方法及び装置
JP3249204A JPH0587527A (ja) 1991-09-27 1991-09-27 光ヘテロダイン干渉計測方法及び計測装置

Publications (2)

Publication Number Publication Date
DE69223207D1 DE69223207D1 (de) 1998-01-02
DE69223207T2 true DE69223207T2 (de) 1998-04-16

Family

ID=26539149

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69223207T Expired - Fee Related DE69223207T2 (de) 1991-09-27 1992-09-24 Verfahren und Vorrichtung zur Messung einer Verlagerung

Country Status (4)

Country Link
US (1) US5610718A (de)
EP (1) EP0534757B1 (de)
CA (1) CA2078732A1 (de)
DE (1) DE69223207T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3269343B2 (ja) * 1995-07-26 2002-03-25 キヤノン株式会社 ベストフォーカス決定方法及びそれを用いた露光条件決定方法
JP3517504B2 (ja) * 1995-12-15 2004-04-12 キヤノン株式会社 位置検出装置及びそれを用いたデバイスの製造方法
KR0186068B1 (ko) * 1995-12-27 1999-04-01 문정환 리소그라피 장치의 위치 정렬 시스템
JPH1022213A (ja) * 1996-06-28 1998-01-23 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
US6594012B2 (en) 1996-07-05 2003-07-15 Canon Kabushiki Kaisha Exposure apparatus
JP4136067B2 (ja) * 1997-05-02 2008-08-20 キヤノン株式会社 検出装置及びそれを用いた露光装置
JP4208277B2 (ja) * 1997-11-26 2009-01-14 キヤノン株式会社 露光方法及び露光装置
JPH11241908A (ja) 1997-12-03 1999-09-07 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
JP4065468B2 (ja) 1998-06-30 2008-03-26 キヤノン株式会社 露光装置及びこれを用いたデバイスの製造方法
JP2001174409A (ja) * 1999-12-15 2001-06-29 Internatl Business Mach Corp <Ibm> ２波長管、検査用照明装置、検査装置及び該方法
US7009704B1 (en) * 2000-10-26 2006-03-07 Kla-Tencor Technologies Corporation Overlay error detection
US6911349B2 (en) * 2001-02-16 2005-06-28 Boxer Cross Inc. Evaluating sidewall coverage in a semiconductor wafer
US7372630B2 (en) * 2001-08-17 2008-05-13 Semiconductor Energy Laboratory Co., Ltd. Laser, irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
IL148566A (en) * 2002-03-07 2007-06-17 Nova Measuring Instr Ltd Method and system for measuring overlap accuracy
KR100464854B1 (ko) * 2002-06-26 2005-01-06 삼성전자주식회사 반도체 기판의 정렬 방법 및 정렬 장치
US7253885B2 (en) * 2003-12-05 2007-08-07 Canon Kabushiki Kaisha Wavelength selecting method, position detecting method and apparatus, exposure method and apparatus, and device manufacturing method
US7190458B2 (en) * 2003-12-09 2007-03-13 Applied Materials, Inc. Use of scanning beam for differential evaluation of adjacent regions for change in reflectivity
WO2005057194A1 (en) * 2003-12-09 2005-06-23 Applied Materials, Inc. Differential evaluation of adjacent regions for change in reflectivity
US7136163B2 (en) * 2003-12-09 2006-11-14 Applied Materials, Inc. Differential evaluation of adjacent regions for change in reflectivity
JP2007114869A (ja) * 2005-10-18 2007-05-10 Fuji Xerox Co Ltd 読取装置、情報処理システム、および媒体偽造防止方法
US9417281B1 (en) * 2014-09-30 2016-08-16 Checkpoint Technologies Llc Adjustable split-beam optical probing (ASOP)
CN112005157B (zh) * 2018-02-27 2023-03-03 Asml荷兰有限公司 用于确定衬底上的一个或更多个结构的特性的量测设备和方法
CN110716397B (zh) * 2019-10-31 2020-10-13 清华大学 激光干涉光刻中的曝光光束相位测量方法和光刻系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2843282A1 (de) * 1977-10-05 1979-04-12 Canon Kk Fotoelektrische erfassungsvorrichtung
EP0045321B1 (de) * 1980-07-31 1986-12-10 International Business Machines Corporation Verfahren und Einrichtung zur optischen Distanzmessung
US4596467A (en) * 1984-03-16 1986-06-24 Hughes Aircraft Company Dissimilar superimposed grating precision alignment and gap measurement systems
FR2598797B1 (fr) * 1986-05-07 1990-05-11 Nippon Telegraph & Telephone Procede de mesure et/ou d'ajustement du deplacement d'un objet et appareil pour la mise en oeuvre de ce procede
US4815854A (en) * 1987-01-19 1989-03-28 Nec Corporation Method of alignment between mask and semiconductor wafer
US4870289A (en) * 1987-09-25 1989-09-26 Matsushita Electric Industrial Co., Ltd. Apparatus for controlling relation in position between a photomask and a wafer
JP2546350B2 (ja) * 1988-09-09 1996-10-23 キヤノン株式会社 位置合わせ装置
EP0411966B1 (de) * 1989-08-04 1994-11-02 Canon Kabushiki Kaisha Verfahren und Vorrichtung zur Positionsbestimmung
JP2829642B2 (ja) * 1989-09-29 1998-11-25 キヤノン株式会社 露光装置
DE69133624D1 (de) * 1990-03-27 2009-12-03 Canon Kk Messverfahren und -vorrichtung
US5182610A (en) * 1990-04-19 1993-01-26 Sortec Corporation Position detecting method and device therefor as well as aligning device
JP3244769B2 (ja) * 1991-07-11 2002-01-07 キヤノン株式会社 測定方法及び測定装置
JPH06177013A (ja) * 1992-12-10 1994-06-24 Canon Inc 位置検出装置

Also Published As

Publication number Publication date
DE69223207D1 (de) 1998-01-02
EP0534757A1 (de) 1993-03-31
EP0534757B1 (de) 1997-11-19
CA2078732A1 (en) 1993-03-28
US5610718A (en) 1997-03-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee