DE69218128D1 - Härtbare Organosiloxanzusammensetzungen, die elektrisch leitfähige Materialien ergeben - Google Patents

Härtbare Organosiloxanzusammensetzungen, die elektrisch leitfähige Materialien ergeben

Info

Publication number
DE69218128D1
DE69218128D1 DE69218128T DE69218128T DE69218128D1 DE 69218128 D1 DE69218128 D1 DE 69218128D1 DE 69218128 T DE69218128 T DE 69218128T DE 69218128 T DE69218128 T DE 69218128T DE 69218128 D1 DE69218128 D1 DE 69218128D1
Authority
DE
Germany
Prior art keywords
result
electrically conductive
conductive materials
curable organosiloxane
organosiloxane compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69218128T
Other languages
English (en)
Other versions
DE69218128T2 (de
Inventor
Richard Leroy Cole
Jean Ellen Fiori
Michael Andrew Lutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Application granted granted Critical
Publication of DE69218128D1 publication Critical patent/DE69218128D1/de
Publication of DE69218128T2 publication Critical patent/DE69218128T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69218128T 1991-11-29 1992-11-16 Härtbare Organosiloxanzusammensetzungen, die elektrisch leitfähige Materialien ergeben Expired - Lifetime DE69218128T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/800,298 US5227093A (en) 1991-11-29 1991-11-29 Curable organosiloxane compositions yielding electrically conductive materials

Publications (2)

Publication Number Publication Date
DE69218128D1 true DE69218128D1 (de) 1997-04-17
DE69218128T2 DE69218128T2 (de) 1997-10-02

Family

ID=25178025

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69218128T Expired - Lifetime DE69218128T2 (de) 1991-11-29 1992-11-16 Härtbare Organosiloxanzusammensetzungen, die elektrisch leitfähige Materialien ergeben

Country Status (4)

Country Link
US (1) US5227093A (de)
EP (1) EP0545568B1 (de)
JP (1) JP3786718B2 (de)
DE (1) DE69218128T2 (de)

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ES2113023T3 (es) 1993-10-06 1998-04-16 Dow Corning Toray Silicone Composiciones organosiloxanos electroconductoras cargadas de plata.
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KR100445248B1 (ko) * 1996-05-10 2004-10-28 주식회사 엘지생활건강 발수성을갖는새로운항균성화합물
US5928569A (en) * 1997-02-26 1999-07-27 Specialty Silicone Products, Inc. Substantially uniform moldable blends of silver particulate and organopolysiloxane
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US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
US6576199B1 (en) * 1998-09-18 2003-06-10 Alliedsignal Inc. Environmental control system including ozone-destroying catalytic converter having anodized and washcoat layers
US6533963B1 (en) 1999-02-12 2003-03-18 Robert A. Schleifstein Electrically conductive flexible compositions, and materials and methods for making same
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6433057B1 (en) 2000-03-28 2002-08-13 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
ATE281485T1 (de) * 2000-05-27 2004-11-15 Q Sys Co Ltd Elektrisch leitendes mikrogel und verfahren zur herstellung desselben
US6361716B1 (en) 2000-07-20 2002-03-26 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US6534581B1 (en) * 2000-07-20 2003-03-18 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
WO2004015002A2 (en) * 2002-08-07 2004-02-19 Dow Corning Toray Silicone Co., Ltd. Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices
JP4568472B2 (ja) 2002-11-29 2010-10-27 東レ・ダウコーニング株式会社 銀粉末の製造方法および硬化性シリコーン組成物
DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
JP3858902B2 (ja) * 2004-03-03 2006-12-20 住友電気工業株式会社 導電性銀ペーストおよびその製造方法
US8157589B2 (en) 2004-11-24 2012-04-17 John Mezzalingua Associates, Inc. Connector having a conductively coated member and method of use thereof
US8071174B2 (en) * 2009-04-03 2011-12-06 John Mezzalingua Associates, Inc. Conductive elastomer and method of applying a conductive coating to elastomeric substrate
CN101084275B (zh) 2004-12-23 2011-09-14 陶氏康宁公司 可交联的糖-硅氧烷组合物，和由其形成的网络、涂层和制品
WO2006127883A2 (en) * 2005-05-23 2006-11-30 Dow Corning Corporation Personal care compositions comprising saccharide-siloxane copolymers
EP1885939B1 (de) * 2005-05-23 2010-10-27 Dow Corning Corporation Oberflächenbehandlungszusammensetzungen mit saccharid-siloxan-polymeren
US20060289837A1 (en) * 2005-06-23 2006-12-28 Mcneilly Kirk Silver salts of dicarboxcylic acids for precious metal powder and flakes
CN101478973B (zh) * 2006-05-23 2013-08-28 陶氏康宁公司 用于递送活性成分的新型硅氧烷成膜剂
CN101627082B (zh) * 2007-02-20 2014-06-25 道康宁公司 基于键合氢聚有机硅氧烷的填料处理剂
WO2009131913A2 (en) * 2008-04-21 2009-10-29 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US8062063B2 (en) 2008-09-30 2011-11-22 Belden Inc. Cable connector having a biasing element
US8816205B2 (en) * 2009-04-03 2014-08-26 Ppc Broadband, Inc. Conductive elastomer and method of applying a conductive coating to a cable
US8113879B1 (en) 2010-07-27 2012-02-14 John Mezzalingua Associates, Inc. One-piece compression connector body for coaxial cable connector
WO2012027073A1 (en) 2010-08-23 2012-03-01 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
JP5830237B2 (ja) * 2010-11-10 2015-12-09 Ｄｏｗａエレクトロニクス株式会社 銀粒子含有組成物、分散液ならびにペーストの製造方法
US8157588B1 (en) 2011-02-08 2012-04-17 Belden Inc. Cable connector with biasing element
US8342879B2 (en) 2011-03-25 2013-01-01 John Mezzalingua Associates, Inc. Coaxial cable connector
US8465322B2 (en) 2011-03-25 2013-06-18 Ppc Broadband, Inc. Coaxial cable connector
EP2935429B1 (de) 2012-12-20 2018-11-07 Dow Silicones Corporation Härtbare silikonzusammensetzungen, elektrisch leitfähige silikonklebstoffe, verfahren zur herstellung und verwendung davon sowie elektrische vorrichtungen damit
US9795141B2 (en) 2013-01-14 2017-10-24 Dmr International, Inc. Antimicrobial polymer systems using multifunctional organometallic additives for polyurethane hosts
WO2014143627A1 (en) 2013-03-14 2014-09-18 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
WO2014150302A1 (en) 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
WO2014159792A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
JP6772448B2 (ja) * 2015-10-29 2020-10-21 住友ベークライト株式会社 導電性樹脂組成物、配線、配線基板および電子装置
JP6673322B2 (ja) * 2017-12-20 2020-03-25 住友ベークライト株式会社 導電性ペーストおよび伸縮性配線基板

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US3918984A (en) * 1973-09-21 1975-11-11 M & T Chemicals Inc Coating composition
JPS601222A (ja) * 1983-06-17 1985-01-07 Sumitomo Bakelite Co Ltd 導電性樹脂ペ−スト
HU192359B (en) * 1985-09-18 1987-05-28 Allami Penzveroe Process for producing activated-surface laminar-structure silver pigment suitable for electronics purpose
US4695404A (en) * 1986-04-07 1987-09-22 Amerasia International Technology, Inc. Hyperconductive filled polymers
FR2605326A1 (fr) * 1986-10-20 1988-04-22 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice.
JPH0617443B2 (ja) * 1986-12-25 1994-03-09 住友ベークライト株式会社 導電性樹脂ペ−スト
US4777205A (en) * 1987-07-22 1988-10-11 Wacker Silicones Corporation Electrically conductive compositions
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPS6431874A (en) * 1987-07-29 1989-02-02 Sumitomo Bakelite Co Electroconductive resin paste for semiconductor
JPH0615680B2 (ja) * 1987-10-20 1994-03-02 三井金属鉱業株式会社 導電塗料用銅粉およびその製造法
JPH0619077B2 (ja) * 1987-12-11 1994-03-16 住友ベークライト株式会社 導電性樹脂ペースト
JPH0662738B2 (ja) * 1988-01-26 1994-08-17 住友ベークライト株式会社 導電性樹脂ペースト
WO1990002768A1 (en) * 1988-09-02 1990-03-22 Toray Industries, Inc. Silicone-epoxy resin composition and conductive adhesive prepared therefrom
CA2000787A1 (en) * 1988-11-04 1990-05-04 Richard L. Cole Electrically conductive silicone compositions
JP2808296B2 (ja) * 1989-02-28 1998-10-08 東芝シリコーン株式会社 プライマー組成物
JPH0356581A (ja) * 1989-07-26 1991-03-12 Maruo Calcium Co Ltd シリコーン２成分型シーリング材組成物
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
JPH03173007A (ja) * 1989-12-01 1991-07-26 Kao Corp 導電性ペースト及び導電性塗膜

Also Published As

Publication number Publication date
EP0545568B1 (de) 1997-03-12
JP3786718B2 (ja) 2006-06-14
DE69218128T2 (de) 1997-10-02
JPH05230373A (ja) 1993-09-07
EP0545568A1 (de) 1993-06-09
US5227093A (en) 1993-07-13

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