DE69210079D1 - Zusammenschaltung von gegenüberliegenden Seiten einer Schaltplatine - Google Patents

Zusammenschaltung von gegenüberliegenden Seiten einer Schaltplatine

Info

Publication number
DE69210079D1
DE69210079D1 DE69210079T DE69210079T DE69210079D1 DE 69210079 D1 DE69210079 D1 DE 69210079D1 DE 69210079 T DE69210079 T DE 69210079T DE 69210079 T DE69210079 T DE 69210079T DE 69210079 D1 DE69210079 D1 DE 69210079D1
Authority
DE
Germany
Prior art keywords
interconnection
circuit board
opposite sides
opposite
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69210079T
Other languages
English (en)
Other versions
DE69210079T2 (de
Inventor
Christopher M Schreiber
William R Crumly
Robert B Hanley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of DE69210079D1 publication Critical patent/DE69210079D1/de
Application granted granted Critical
Publication of DE69210079T2 publication Critical patent/DE69210079T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69210079T 1991-03-25 1992-03-12 Zusammenschaltung von gegenüberliegenden Seiten einer Schaltplatine Expired - Fee Related DE69210079T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/674,254 US5227588A (en) 1991-03-25 1991-03-25 Interconnection of opposite sides of a circuit board

Publications (2)

Publication Number Publication Date
DE69210079D1 true DE69210079D1 (de) 1996-05-30
DE69210079T2 DE69210079T2 (de) 1996-08-14

Family

ID=24705925

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210079T Expired - Fee Related DE69210079T2 (de) 1991-03-25 1992-03-12 Zusammenschaltung von gegenüberliegenden Seiten einer Schaltplatine

Country Status (4)

Country Link
US (1) US5227588A (de)
EP (2) EP0506260B1 (de)
JP (1) JPH0744335B2 (de)
DE (1) DE69210079T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
EP0694990A1 (de) * 1994-07-22 1996-01-31 Connector Systems Technology N.V. Verfahren zur selektiven Metallisierung von aus Kunststoff geformten Verbindern
JP2831970B2 (ja) * 1996-04-12 1998-12-02 山一電機株式会社 回路基板における層間接続方法
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
US6299456B1 (en) 1998-04-10 2001-10-09 Micron Technology, Inc. Interposer with contact structures for electrical testing
US6407345B1 (en) * 1998-05-19 2002-06-18 Ibiden Co., Ltd. Printed circuit board and method of production thereof
US6211468B1 (en) * 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
DE69939221D1 (de) * 1998-09-03 2008-09-11 Ibiden Co Ltd Mehrschichtige leiterplatte und verfahren zu deren herstellung
US6274291B1 (en) 1998-11-18 2001-08-14 International Business Machines Corporation Method of reducing defects in I/C card and resulting card
JP3585793B2 (ja) * 1999-11-09 2004-11-04 富士通株式会社 両面薄膜配線基板の製造方法
US6467161B2 (en) * 2000-05-26 2002-10-22 Visteon Global Tech., Inc. Method for making a circuit board
US6473963B1 (en) * 2000-09-06 2002-11-05 Visteon Global Tech., Inc. Method of making electrical circuit board
JP3867523B2 (ja) * 2000-12-26 2007-01-10 株式会社デンソー プリント基板およびその製造方法
ATE452726T1 (de) * 2001-08-07 2010-01-15 Fraunhofer Ges Forschung Verfahren zum laserstrahlschweissen
US6638082B2 (en) 2001-11-20 2003-10-28 Fci Americas Technology, Inc. Pin-grid-array electrical connector
US6666693B2 (en) 2001-11-20 2003-12-23 Fci Americas Technology, Inc. Surface-mounted right-angle electrical connector
JP3823870B2 (ja) 2002-04-22 2006-09-20 セイコーエプソン株式会社 配線板の製造方法、および電子機器の製造方法
US20070290196A1 (en) * 2005-07-08 2007-12-20 Samsung Sdi Co., Ltd. Organic light emitting display device and method for manufacturing the organic light emitting display device
US8716867B2 (en) * 2010-05-12 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Forming interconnect structures using pre-ink-printed sheets
CN104039079B (zh) * 2013-12-01 2017-03-29 东莞市震泰电子科技有限公司 集成线路板
JP6788268B2 (ja) * 2016-02-22 2020-11-25 株式会社ダイワ工業 配線基板又は配線基板材料の製造方法
KR102555883B1 (ko) 2018-10-29 2023-07-17 셀링크 코포레이션 가요성 하이브리드 상호 연결 회로
WO2024171659A1 (ja) * 2023-02-16 2024-08-22 株式会社村田製作所 多層基板、電子機器及び多層基板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148310A (en) * 1964-09-08 Methods of making same
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
US3350498A (en) * 1965-01-04 1967-10-31 Intellux Inc Multilayer circuit and method of making the same
US3471631A (en) * 1968-04-03 1969-10-07 Us Air Force Fabrication of microminiature multilayer circuit boards
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
JPS51104570A (en) * 1975-03-12 1976-09-16 Kuranosuke Ito Metsukikairono tenshaahaisenban
US3953924A (en) * 1975-06-30 1976-05-04 Rockwell International Corporation Process for making a multilayer interconnect system
FR2402996A1 (fr) * 1977-09-12 1979-04-06 Labo Electronique Physique Procede de realisation de bulles metalliques sur un substrat perce, substrat ainsi traite et utilisation
FR2505094A1 (fr) * 1981-04-29 1982-11-05 Trt Telecom Radio Electr Procede de realisation des circuits hyperfrequences
US4646436A (en) * 1985-10-18 1987-03-03 Kollmorgen Technologies Corporation Shielded interconnection boards
US4788766A (en) * 1987-05-20 1988-12-06 Loral Corporation Method of fabricating a multilayer circuit board assembly
JPH02324A (ja) * 1987-12-18 1990-01-05 Mitsui Mining & Smelting Co Ltd 導電膜回路およびその製造方法
JPH0243797A (ja) * 1988-08-03 1990-02-14 Matsushita Electric Works Ltd スルーホール付回路基板の製造方法
US4994771A (en) * 1989-06-28 1991-02-19 Hughes Aircraft Company Micro-connector to microstrip controlled impedance interconnection assembly
JPH03147393A (ja) * 1989-11-01 1991-06-24 Nitto Denko Corp 両面プリント板の製造法
US5046238A (en) * 1990-03-15 1991-09-10 Rogers Corporation Method of manufacturing a multilayer circuit board

Also Published As

Publication number Publication date
EP0506260A2 (de) 1992-09-30
JPH0744335B2 (ja) 1995-05-15
EP0506260A3 (en) 1993-03-17
JPH0590750A (ja) 1993-04-09
EP0673189A1 (de) 1995-09-20
EP0506260B1 (de) 1996-04-24
US5227588A (en) 1993-07-13
DE69210079T2 (de) 1996-08-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee