DE69208863T2 - Absorbierende Träger für eine akustische Wandleranordnung - Google Patents
Absorbierende Träger für eine akustische WandleranordnungInfo
- Publication number
- DE69208863T2 DE69208863T2 DE69208863T DE69208863T DE69208863T2 DE 69208863 T2 DE69208863 T2 DE 69208863T2 DE 69208863 T DE69208863 T DE 69208863T DE 69208863 T DE69208863 T DE 69208863T DE 69208863 T2 DE69208863 T2 DE 69208863T2
- Authority
- DE
- Germany
- Prior art keywords
- block
- acoustic
- carrier
- electrical
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002745 absorbent Effects 0.000 title 1
- 239000002250 absorbent Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 claims description 87
- 239000000463 material Substances 0.000 claims description 60
- 230000002238 attenuated effect Effects 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 238000013016 damping Methods 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 27
- 238000003491 array Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 230000008901 benefit Effects 0.000 description 9
- 239000000835 fiber Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/835,157 US5267221A (en) | 1992-02-13 | 1992-02-13 | Backing for acoustic transducer array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69208863D1 DE69208863D1 (de) | 1996-04-11 |
| DE69208863T2 true DE69208863T2 (de) | 1996-09-05 |
Family
ID=25268751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69208863T Expired - Fee Related DE69208863T2 (de) | 1992-02-13 | 1992-11-25 | Absorbierende Träger für eine akustische Wandleranordnung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5267221A (enExample) |
| EP (1) | EP0559963B1 (enExample) |
| JP (1) | JP3279375B2 (enExample) |
| DE (1) | DE69208863T2 (enExample) |
Families Citing this family (101)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2139151A1 (en) * | 1994-01-14 | 1995-07-15 | Amin M. Hanafy | Two-dimensional acoustic array and method for the manufacture thereof |
| EP0772891A4 (en) * | 1994-07-22 | 1999-11-03 | Loral Infrared & Imaging Syst | ULTRASONIC GROUP CONVERTER FOR IMAGE GENERATION |
| US5592730A (en) * | 1994-07-29 | 1997-01-14 | Hewlett-Packard Company | Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes |
| US5550792A (en) * | 1994-09-30 | 1996-08-27 | Edo Western Corp. | Sliced phased array doppler sonar system |
| US5493541A (en) * | 1994-12-30 | 1996-02-20 | General Electric Company | Ultrasonic transducer array having laser-drilled vias for electrical connection of electrodes |
| US5629906A (en) * | 1995-02-15 | 1997-05-13 | Hewlett-Packard Company | Ultrasonic transducer |
| US5559388A (en) * | 1995-03-03 | 1996-09-24 | General Electric Company | High density interconnect for an ultrasonic phased array and method for making |
| US5644085A (en) * | 1995-04-03 | 1997-07-01 | General Electric Company | High density integrated ultrasonic phased array transducer and a method for making |
| AT403417B (de) * | 1995-04-25 | 1998-02-25 | Fritz Dr Paschke | Schallfiltervorrichtung |
| US5648942A (en) * | 1995-10-13 | 1997-07-15 | Advanced Technology Laboratories, Inc. | Acoustic backing with integral conductors for an ultrasonic transducer |
| US6236144B1 (en) | 1995-12-13 | 2001-05-22 | Gec-Marconi Limited | Acoustic imaging arrays |
| GB9525418D0 (en) * | 1995-12-13 | 1996-07-17 | Marconi Gec Ltd | Acoustic imaging arrays |
| US5757727A (en) * | 1996-04-24 | 1998-05-26 | Acuson Corporation | Two-dimensional acoustic array and method for the manufacture thereof |
| US5855049A (en) * | 1996-10-28 | 1999-01-05 | Microsound Systems, Inc. | Method of producing an ultrasound transducer |
| US6043590A (en) * | 1997-04-18 | 2000-03-28 | Atl Ultrasound | Composite transducer with connective backing block |
| US6541896B1 (en) | 1997-12-29 | 2003-04-01 | General Electric Company | Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array |
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| JP2000004865A (ja) * | 1998-06-25 | 2000-01-11 | Yasuyuki Moriyama | シガレットの付属消火装置 |
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| JP4408974B2 (ja) | 1998-12-09 | 2010-02-03 | 株式会社東芝 | 超音波トランスジューサ及びその製造方法 |
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| US6546803B1 (en) | 1999-12-23 | 2003-04-15 | Daimlerchrysler Corporation | Ultrasonic array transducer |
| US7037270B2 (en) * | 2000-03-02 | 2006-05-02 | Mayo Foundation For Medical Education And Research | Small ultrasound transducers |
| US6467138B1 (en) | 2000-05-24 | 2002-10-22 | Vermon | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same |
| US6497667B1 (en) | 2001-07-31 | 2002-12-24 | Koninklijke Philips Electronics N.V. | Ultrasonic probe using ribbon cable attachment system |
| US6572547B2 (en) | 2001-07-31 | 2003-06-03 | Koninklijke Philips Electronics N.V. | Transesophageal and transnasal, transesophageal ultrasound imaging systems |
| US6669644B2 (en) * | 2001-07-31 | 2003-12-30 | Koninklijke Philips Electronics N.V. | Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy |
| USRE45759E1 (en) * | 2001-07-31 | 2015-10-20 | Koninklijke Philips N.V. | Transesophageal and transnasal, transesophageal ultrasound imaging systems |
| EP1414347A1 (en) | 2001-07-31 | 2004-05-06 | Koninklijke Philips Electronics N.V. | Transesophageal and transnasal, transesophageal ultrasound imaging systems |
| US7149090B2 (en) * | 2001-09-11 | 2006-12-12 | Brother Kogyo Kabushiki Kaisha | Structure of flexible printed circuit board |
| FR2833450B1 (fr) * | 2001-12-07 | 2004-11-19 | Thales Sa | Antenne acoustique a grande puissance d'emission |
| JP2004088056A (ja) * | 2002-07-02 | 2004-03-18 | Sumitomo Electric Ind Ltd | 圧電振動子とその実装方法、実装デバイス、それを用いた超音波プローブ、およびそれを用いた3次元超音波診断装置 |
| US6859984B2 (en) * | 2002-09-05 | 2005-03-01 | Vermon | Method for providing a matrix array ultrasonic transducer with an integrated interconnection means |
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| US7053530B2 (en) * | 2002-11-22 | 2006-05-30 | General Electric Company | Method for making electrical connection to ultrasonic transducer through acoustic backing material |
| US7564125B2 (en) * | 2002-12-06 | 2009-07-21 | General Electric Company | Electronic array and methods for fabricating same |
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| JPS60114110A (ja) * | 1983-11-25 | 1985-06-20 | 井関農機株式会社 | 田植機の分離爪突入寸法測定装置 |
| DE3425992C2 (de) * | 1984-07-14 | 1986-10-09 | Richard Wolf Gmbh, 7134 Knittlingen | Piezoelektrischer Wandler zur Zerstörung von Konkrementen im Körperinneren |
| US4728844A (en) * | 1985-03-23 | 1988-03-01 | Cogent Limited | Piezoelectric transducer and components therefor |
| US4698541A (en) * | 1985-07-15 | 1987-10-06 | Mcdonnell Douglas Corporation | Broad band acoustic transducer |
| EP0239999B1 (en) * | 1986-04-02 | 1993-10-13 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic probe having an ultrasonic propagation medium |
-
1992
- 1992-02-13 US US07/835,157 patent/US5267221A/en not_active Expired - Lifetime
- 1992-11-25 DE DE69208863T patent/DE69208863T2/de not_active Expired - Fee Related
- 1992-11-25 EP EP92120113A patent/EP0559963B1/en not_active Expired - Lifetime
-
1993
- 1993-02-10 JP JP04597193A patent/JP3279375B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5267221A (en) | 1993-11-30 |
| JPH0646497A (ja) | 1994-02-18 |
| EP0559963A3 (enExample) | 1994-01-26 |
| EP0559963B1 (en) | 1996-03-06 |
| JP3279375B2 (ja) | 2002-04-30 |
| DE69208863D1 (de) | 1996-04-11 |
| EP0559963A2 (en) | 1993-09-15 |
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| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA |
|
| 8339 | Ceased/non-payment of the annual fee |