DE69208515T2 - Herstellungsverfahren einer kupferkaschierten laminierten Platte - Google Patents

Herstellungsverfahren einer kupferkaschierten laminierten Platte

Info

Publication number
DE69208515T2
DE69208515T2 DE69208515T DE69208515T DE69208515T2 DE 69208515 T2 DE69208515 T2 DE 69208515T2 DE 69208515 T DE69208515 T DE 69208515T DE 69208515 T DE69208515 T DE 69208515T DE 69208515 T2 DE69208515 T2 DE 69208515T2
Authority
DE
Germany
Prior art keywords
film
copper
copper foil
polyamide type
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69208515T
Other languages
German (de)
English (en)
Other versions
DE69208515D1 (de
Inventor
Keiji Azuma
Kimikazu Katoh
Ryoichi Oguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil Japan Co Ltd
Sumitomo Bakelite Co Ltd
Original Assignee
Circuit Foil Japan Co Ltd
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Japan Co Ltd, Sumitomo Bakelite Co Ltd filed Critical Circuit Foil Japan Co Ltd
Publication of DE69208515D1 publication Critical patent/DE69208515D1/de
Application granted granted Critical
Publication of DE69208515T2 publication Critical patent/DE69208515T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
DE69208515T 1991-05-13 1992-05-06 Herstellungsverfahren einer kupferkaschierten laminierten Platte Expired - Fee Related DE69208515T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3201525A JP3029487B2 (ja) 1991-05-13 1991-05-13 銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
DE69208515D1 DE69208515D1 (de) 1996-04-04
DE69208515T2 true DE69208515T2 (de) 1996-09-26

Family

ID=16442492

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208515T Expired - Fee Related DE69208515T2 (de) 1991-05-13 1992-05-06 Herstellungsverfahren einer kupferkaschierten laminierten Platte

Country Status (7)

Country Link
US (1) US5286330A (enExample)
EP (1) EP0514074B1 (enExample)
JP (1) JP3029487B2 (enExample)
KR (1) KR0172456B1 (enExample)
DE (1) DE69208515T2 (enExample)
MY (1) MY108012A (enExample)
TW (1) TW243583B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0599779A1 (de) * 1992-10-29 1994-06-01 OCG Microelectronic Materials AG Hochauflösender negativ arbeitender Photoresist mit grossem Prozessspielraum
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
ID19337A (id) * 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
US6229096B1 (en) * 1997-10-07 2001-05-08 Mitsubishi Gas Chemical Company, Inc. Nonwoven reinforcement for printed wiring base board and process for producing the same
DE19859613C2 (de) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Presspaketaufbau und Verfahren zu dessen Herstellung
US6168634B1 (en) 1999-03-25 2001-01-02 Geoffrey W. Schmitz Hydraulically energized magnetorheological replicant muscle tissue and a system and a method for using and controlling same
KR100319834B1 (ko) * 1999-08-24 2002-01-10 고연종 복합보드 및 그 제조방법
US6584820B1 (en) 1999-09-23 2003-07-01 Polyclad Laminates, Inc. Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same
JP4025177B2 (ja) 2001-11-26 2007-12-19 三井金属鉱業株式会社 絶縁層付銅箔の製造方法
EP1616909B1 (en) 2003-04-18 2012-02-22 Asahi Kasei Chemicals Corporation Release film for printed wiring board production
EP1835505B1 (en) 2005-01-07 2010-09-08 Asahi Kasei Chemicals Corporation Inner part of hard disk drive
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
JP5201131B2 (ja) * 2007-03-01 2013-06-05 味の素株式会社 金属膜転写用フィルム、金属膜の転写方法及び回路基板の製造方法
KR101949812B1 (ko) * 2017-08-11 2019-02-20 주식회사 비앤엠 펀칭공법을 이용한 제련용 냉각편 제조장치
KR102171513B1 (ko) * 2019-01-16 2020-10-30 주식회사 비앤엠 이중열 펀칭공법을 이용한 제련용 직사각형 냉각편 제조장치
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3677876A (en) * 1970-02-18 1972-07-18 Formica Corp Decorative laminate surfaced with a transparent film of polyvinyl fluoride which film is temporarily covered with a transparent film of nylon
JPS5434142B2 (enExample) * 1973-09-29 1979-10-25
CA1230526A (en) * 1983-12-09 1987-12-22 Martin J. Wilheim Mold release sheet and method of manufacture
EP0235582A3 (en) * 1986-02-27 1989-03-29 Hewlett-Packard Company Bonded press pad
JPS62214939A (ja) * 1986-03-15 1987-09-21 Matsushita Electric Works Ltd 積層板の製法
JPS62274795A (ja) * 1986-05-23 1987-11-28 新神戸電機株式会社 多層回路板の製造法
WO1988003743A1 (en) * 1986-11-13 1988-05-19 Johnston James A Method and apparatus for manufacturing printed circuit boards
GB8725746D0 (en) * 1987-11-03 1987-12-09 Du Pont Canada Release sheet for printed circuit board
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits

Also Published As

Publication number Publication date
MY108012A (en) 1996-07-30
EP0514074B1 (en) 1996-02-28
US5286330A (en) 1994-02-15
TW243583B (enExample) 1995-03-21
DE69208515D1 (de) 1996-04-04
EP0514074A3 (en) 1993-05-19
EP0514074A2 (en) 1992-11-19
JP3029487B2 (ja) 2000-04-04
JPH06316032A (ja) 1994-11-15
KR920021308A (ko) 1992-12-18
KR0172456B1 (ko) 1999-03-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee