DE3541977C2 - - Google Patents
Info
- Publication number
- DE3541977C2 DE3541977C2 DE19853541977 DE3541977A DE3541977C2 DE 3541977 C2 DE3541977 C2 DE 3541977C2 DE 19853541977 DE19853541977 DE 19853541977 DE 3541977 A DE3541977 A DE 3541977A DE 3541977 C2 DE3541977 C2 DE 3541977C2
- Authority
- DE
- Germany
- Prior art keywords
- circuits
- thickness
- film
- pressing
- pressure compensation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003825 pressing Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000010408 film Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/061—Cushion plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853541977 DE3541977A1 (de) | 1985-11-28 | 1985-11-28 | Mehrschicht-laminat zum verpressen von gedruckten schaltungsteilen untereinander oder mit folien |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853541977 DE3541977A1 (de) | 1985-11-28 | 1985-11-28 | Mehrschicht-laminat zum verpressen von gedruckten schaltungsteilen untereinander oder mit folien |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3541977A1 DE3541977A1 (de) | 1986-05-22 |
| DE3541977C2 true DE3541977C2 (enExample) | 1988-12-08 |
Family
ID=6287012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19853541977 Granted DE3541977A1 (de) | 1985-11-28 | 1985-11-28 | Mehrschicht-laminat zum verpressen von gedruckten schaltungsteilen untereinander oder mit folien |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3541977A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0235582A3 (en) * | 1986-02-27 | 1989-03-29 | Hewlett-Packard Company | Bonded press pad |
| DE3723414A1 (de) * | 1987-07-15 | 1989-01-26 | Leitron Leiterplatten | Verfahren zur herstellung von gedruckten schaltungen in starrer oder starrflexibler mehrlagentechnik |
| JP2556897B2 (ja) * | 1989-02-23 | 1996-11-27 | ファナック株式会社 | 多層プリント配線板の外層材及び製造方法 |
| US5046238A (en) * | 1990-03-15 | 1991-09-10 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
| AT414335B (de) * | 2001-11-14 | 2008-07-15 | C2C Technologie Fuer Leiterpla | Trennplatten-verbundkomponente zum herstellen von leiterplatten und verfahren zur herstellung einer solchen verbundkomponente |
| DE102004057493A1 (de) * | 2004-11-29 | 2006-06-01 | Siemens Ag | Umhüllung von auf einem Substrat angeordneten Bauelementen |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2444698C3 (de) * | 1974-09-18 | 1978-08-24 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Einrichtung zum Verpressen großflächiger mehrlagiger Leiterplatten |
-
1985
- 1985-11-28 DE DE19853541977 patent/DE3541977A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3541977A1 (de) | 1986-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OAV | Applicant agreed to the publication of the unexamined application as to paragraph 31 lit. 2 z1 | ||
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |