DE69206629D1 - Laminierung einer photopolymerisierbaren lötstopmasken-schicht auf ein löcher enthaltendes substrat unter verwendung einer zwischenschicht aus einer photopolymerisierbaren flüssigkeit. - Google Patents

Laminierung einer photopolymerisierbaren lötstopmasken-schicht auf ein löcher enthaltendes substrat unter verwendung einer zwischenschicht aus einer photopolymerisierbaren flüssigkeit.

Info

Publication number
DE69206629D1
DE69206629D1 DE69206629T DE69206629T DE69206629D1 DE 69206629 D1 DE69206629 D1 DE 69206629D1 DE 69206629 T DE69206629 T DE 69206629T DE 69206629 T DE69206629 T DE 69206629T DE 69206629 D1 DE69206629 D1 DE 69206629D1
Authority
DE
Germany
Prior art keywords
photopolymerizable
laminating
preformed
containing substrate
spectral region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69206629T
Other languages
English (en)
Other versions
DE69206629T2 (de
Inventor
Gary Stout
Robert Ashcraft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69206629D1 publication Critical patent/DE69206629D1/de
Publication of DE69206629T2 publication Critical patent/DE69206629T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
DE69206629T 1991-12-20 1992-12-14 Laminierung einer photopolymerisierbaren lötstopmasken-schicht auf ein löcher enthaltendes substrat unter verwendung einer zwischenschicht aus einer photopolymerisierbaren flüssigkeit. Expired - Lifetime DE69206629T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/811,358 US5240817A (en) 1991-12-20 1991-12-20 Lamination of a photopolymerizable solder mask layer to a substate containing holes using an intermediate photopolymerizable liquid layer
PCT/US1992/010555 WO1993013638A1 (en) 1991-12-20 1992-12-14 Lamination of a photopolymerizable solder mask layer to a substrate containing holes using an intermediate photopolymerizable liquid layer

Publications (2)

Publication Number Publication Date
DE69206629D1 true DE69206629D1 (de) 1996-01-18
DE69206629T2 DE69206629T2 (de) 1996-08-22

Family

ID=25206338

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206629T Expired - Lifetime DE69206629T2 (de) 1991-12-20 1992-12-14 Laminierung einer photopolymerisierbaren lötstopmasken-schicht auf ein löcher enthaltendes substrat unter verwendung einer zwischenschicht aus einer photopolymerisierbaren flüssigkeit.

Country Status (5)

Country Link
US (1) US5240817A (de)
EP (1) EP0606402B1 (de)
AT (1) ATE131340T1 (de)
DE (1) DE69206629T2 (de)
WO (1) WO1993013638A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW267219B (de) * 1991-12-27 1996-01-01 Sumitomo Chemical Co
DE4310814C2 (de) * 1993-04-02 1997-11-27 Du Pont Deutschland Verfahren zur Beschichtung von Leiterplatten
FR2705012B1 (fr) * 1993-04-02 1995-10-20 Du Pont Procédé pour le revêtement des cartes à circuit imprimé.
US5863597A (en) * 1996-01-23 1999-01-26 Sundstrand Corporation Polyurethane conformal coating process for a printed wiring board
US5726348A (en) * 1996-06-25 1998-03-10 United Technologies Corporation Process for precisely closing off cooling holes of an airfoil
US6015520A (en) * 1997-05-15 2000-01-18 International Business Machines Corporation Method for filling holes in printed wiring boards
US6146002A (en) * 1997-12-30 2000-11-14 Pearl Paints North America Urethane-free composition useful as an ultraviolet-(UV)-curable basecoat and reflector using the same
US6037096A (en) * 1998-05-26 2000-03-14 International Business Machines Corporation Film composition and method for a planar surface atop a plated through hole
TW483940B (en) * 1998-06-24 2002-04-21 Ciba Sc Holding Ag Method for coating printed circuit boards or similar substrates
WO2005118212A1 (en) * 2004-06-01 2005-12-15 Original Solutions Inc. Solder mask enhancement and method of inspecting printed circuit board assemblies
CN1842741B (zh) * 2004-12-03 2010-11-24 东京应化工业株式会社 化学放大型光致抗蚀剂组合物、光致抗蚀剂层层叠体、光致抗蚀剂组合物的制造方法、光致抗蚀图案的制造方法以及连接端子的制造方法
US8476000B2 (en) 2010-06-04 2013-07-02 Ryan Vest Method of producing a relief image from a liquid photopolymer resin
CN110719702B (zh) * 2019-10-18 2022-01-25 中山新诺科技股份有限公司 一种双波长防焊设备
JP7414680B2 (ja) * 2020-09-17 2024-01-16 キオクシア株式会社 インプリント方法、インプリント装置、及び膜形成装置
CN112351587A (zh) * 2020-10-20 2021-02-09 江西强达电路科技有限公司 一种免打磨的树脂塞孔pcb板制作工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629036A (en) * 1969-02-14 1971-12-21 Shipley Co The method coating of photoresist on circuit boards
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
US4293635A (en) * 1980-05-27 1981-10-06 E. I. Du Pont De Nemours And Company Photopolymerizable composition with polymeric binder
EP0141868A1 (de) * 1982-04-01 1985-05-22 Inc. M & T Chemicals Photomaskensatz mit hohem Auflösungsvermögen für die Herstellung von Photopolymerbildern
USRE32430E (en) * 1982-04-01 1987-06-02 Printed wiring board
US4631111A (en) * 1984-11-27 1986-12-23 E. I. Du Pont De Nemours And Company Dichromic process for preparation of conductive circuit
US4680249A (en) * 1986-05-28 1987-07-14 E. I. Du Pont De Nemours And Company Photopolymerizable composition containing carboxy benzotriazole
US4698294A (en) * 1986-09-12 1987-10-06 E. I. Du Pont De Nemours And Company Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer
EP0259853A3 (de) * 1986-09-12 1989-11-08 E.I. Du Pont De Nemours And Company Laminierung eines photopolymerisierbaren Films auf einem Träger mittels einer photoempfindlichen flüssigen Zwischenschicht

Also Published As

Publication number Publication date
US5240817A (en) 1993-08-31
WO1993013638A1 (en) 1993-07-08
DE69206629T2 (de) 1996-08-22
ATE131340T1 (de) 1995-12-15
EP0606402A1 (de) 1994-07-20
EP0606402B1 (de) 1995-12-06

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