DE69201923T2 - Gerät und Verfahren zum Einbrennen. - Google Patents
Gerät und Verfahren zum Einbrennen.Info
- Publication number
- DE69201923T2 DE69201923T2 DE69201923T DE69201923T DE69201923T2 DE 69201923 T2 DE69201923 T2 DE 69201923T2 DE 69201923 T DE69201923 T DE 69201923T DE 69201923 T DE69201923 T DE 69201923T DE 69201923 T2 DE69201923 T2 DE 69201923T2
- Authority
- DE
- Germany
- Prior art keywords
- burning apparatus
- burning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3179774A JPH0529417A (ja) | 1991-07-19 | 1991-07-19 | バーンイン方法および装置 |
JP3189019A JPH0536778A (ja) | 1991-07-29 | 1991-07-29 | バーンイン方法および装置 |
JP3192312A JPH0536793A (ja) | 1991-07-31 | 1991-07-31 | バーンイン方法および装置 |
JP3192307A JPH0536790A (ja) | 1991-07-31 | 1991-07-31 | バーンイン方法および装置 |
JP3192310A JPH0536791A (ja) | 1991-07-31 | 1991-07-31 | バーンイン方法および装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69201923D1 DE69201923D1 (de) | 1995-05-11 |
DE69201923T2 true DE69201923T2 (de) | 1995-10-05 |
Family
ID=27528758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69201923T Expired - Fee Related DE69201923T2 (de) | 1991-07-19 | 1992-07-17 | Gerät und Verfahren zum Einbrennen. |
Country Status (7)
Country | Link |
---|---|
US (2) | US5327075A (de) |
EP (1) | EP0523735B1 (de) |
KR (1) | KR960003989B1 (de) |
AU (1) | AU657976B2 (de) |
CA (1) | CA2073886A1 (de) |
DE (1) | DE69201923T2 (de) |
MY (1) | MY131275A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112010000729B4 (de) * | 2009-02-10 | 2015-05-07 | Qualitau, Inc. | Integrierte Einheit für elektrisches Testen/ Zuverlässigkeitstesten mit verbesserter thermischer Kontrolle |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578934A (en) * | 1991-06-04 | 1996-11-26 | Micron Technology, Inc. | Method and apparatus for testing unpackaged semiconductor dice |
JP2856647B2 (ja) * | 1993-09-20 | 1999-02-10 | 株式会社東芝 | 半導体チップバーンイン用ソケット |
US5410162A (en) * | 1993-10-15 | 1995-04-25 | Texas Instruments Incorporated | Apparatus for and method of rapid testing of semiconductor components at elevated temperature |
GB9325281D0 (en) * | 1993-12-10 | 1994-02-16 | Texas Indstruments Limited | Improvements in and relating to the testing of semiconductor devices |
JP3099932B2 (ja) * | 1993-12-14 | 2000-10-16 | 株式会社東芝 | インテリジェントテストラインシステム |
JP2962129B2 (ja) * | 1993-12-29 | 1999-10-12 | 日本電気株式会社 | 半導体試験装置 |
US5582235A (en) * | 1994-08-11 | 1996-12-10 | Micro Control Company | Temperature regulator for burn-in board components |
KR960014952A (ko) * | 1994-10-14 | 1996-05-22 | 가즈오 가네코 | 반도체 웨이퍼의 번인 및 테스트방법과 그것에 사용되는 번인보드 |
US6002266A (en) * | 1995-05-23 | 1999-12-14 | Digital Equipment Corporation | Socket including centrally distributed test tips for testing unpackaged singulated die |
US6034404A (en) * | 1996-12-05 | 2000-03-07 | California Institute Of Technology | Schottky-barrier semiconductor device |
US6249132B1 (en) * | 1997-02-12 | 2001-06-19 | Tokyo Electron Limited | Inspection methods and apparatuses |
US5844208A (en) * | 1997-04-04 | 1998-12-01 | Unisys Corporation | Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature |
US6005404A (en) * | 1997-04-30 | 1999-12-21 | Rpi, Inc. | Environmental test apparatus with partition-isolated thermal chamber |
US6329831B1 (en) * | 1997-08-08 | 2001-12-11 | Advanced Micro Devices, Inc. | Method and apparatus for reliability testing of integrated circuit structures and devices |
US6593761B1 (en) * | 1997-11-28 | 2003-07-15 | Kabushiki Kaisha Toshiba | Test handler for semiconductor device |
US6144215A (en) * | 1998-04-13 | 2000-11-07 | Intel Corporation | Setup for testing an integrated circuit in a semiconductor chip wherein the temperature of the semiconductor chip is controlled |
DE19931337A1 (de) | 1998-07-09 | 2000-01-27 | Advantest Corp | Befestigungsvorrichtung für Halbleiter-Bauelemente |
JP5000803B2 (ja) * | 1998-07-14 | 2012-08-15 | デルタ・デザイン・インコーポレイテッド | 電子デバイスの速応温度反復制御を液体を利用して広範囲に行うための装置、方法 |
US6191599B1 (en) * | 1998-10-09 | 2001-02-20 | International Business Machines Corporation | IC device under test temperature control fixture |
US6496025B1 (en) * | 1998-12-11 | 2002-12-17 | Gte Communication Systems Corporation | Method and apparatus for testing printed circuit board assemblies |
US6448802B1 (en) | 1998-12-21 | 2002-09-10 | Intel Corporation | Photosensors for testing an integrated circuit |
JP2000214219A (ja) * | 1999-01-28 | 2000-08-04 | Ando Electric Co Ltd | テストバ―ンインボ―ドハンドラ |
JP4054473B2 (ja) * | 1999-02-22 | 2008-02-27 | 株式会社アドバンテスト | 電子部品試験装置および電子部品の試験方法 |
JP2000243795A (ja) * | 1999-02-22 | 2000-09-08 | Ando Electric Co Ltd | バーンインテスタにおける電源電流測定回路 |
JP2000258495A (ja) * | 1999-03-12 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体デバイス試験装置 |
US6504392B2 (en) | 1999-03-26 | 2003-01-07 | International Business Machines Corporation | Actively controlled heat sink for convective burn-in oven |
US6590405B2 (en) * | 1999-04-21 | 2003-07-08 | Advantest, Corp | CMOS integrated circuit and timing signal generator using same |
US6433567B1 (en) * | 1999-04-21 | 2002-08-13 | Advantest Corp. | CMOS integrated circuit and timing signal generator using same |
US6175498B1 (en) | 1999-07-13 | 2001-01-16 | Micro Control Company | Burn-in board and heat sink assembly mounting rack |
US6288371B1 (en) | 1999-07-13 | 2001-09-11 | Micro Control Company | Temperature controlled high power burn-in board heat sinks |
US6483326B1 (en) | 1999-08-10 | 2002-11-19 | Advanced Micro Devices, Inc. | Localized heating for defect isolation during die operation |
US6449295B1 (en) * | 1999-11-23 | 2002-09-10 | Litton Systems, Inc. | Method and system for generating laser light |
US7062399B1 (en) | 2000-06-02 | 2006-06-13 | Advance Micro Devices, Inc. | Resistivity analysis |
US6980016B2 (en) | 2001-07-02 | 2005-12-27 | Intel Corporation | Integrated circuit burn-in systems |
DE10135805A1 (de) * | 2001-07-23 | 2003-02-13 | Infineon Technologies Ag | Vorrichtung und Verfahren zur Erfassung einer Zuverlässigkeit von integrierten Halbleiterbauelementen bei hohen Temperaturen |
JP4148677B2 (ja) * | 2001-12-19 | 2008-09-10 | 富士通株式会社 | ダイナミック・バーンイン装置 |
US6870378B1 (en) * | 2002-05-16 | 2005-03-22 | The United States Of America As Represented By The Secretary Of The Army | Test apparatus and method for reliability assessment of high power switching devices |
US6821796B1 (en) * | 2002-07-19 | 2004-11-23 | Advanced Micro Devices, Inc. | Method and system for temperature cycling at an interface between an IC die and an underfill material |
US20040135595A1 (en) * | 2002-10-30 | 2004-07-15 | Finisar Corporation | Methods, systems, and devices for burn-in testing of optoelectronic devices |
US20040182564A1 (en) * | 2002-12-17 | 2004-09-23 | Micro Control Company | Heat exchange system chip temperature sensor |
US7114556B2 (en) * | 2002-12-17 | 2006-10-03 | Micro Control Company | Burn-in oven heat exchanger having improved thermal conduction |
US20040150417A1 (en) * | 2003-01-30 | 2004-08-05 | Paulos John James | Integrated circuit with junction temperature sensing diode |
EP1595154B1 (de) * | 2003-02-20 | 2008-04-09 | International Business Machines Corporation | Testverfahren für integrierte schaltungen mit verwendung modifikation von well-spannungen |
US6998862B2 (en) | 2003-04-28 | 2006-02-14 | Micron Technology, Inc. | Test socket for semiconductor components having serviceable nest |
US20050012516A1 (en) * | 2003-07-18 | 2005-01-20 | Sung-Pei Hou | Burn-in socket adapt to assembly sensor thereon |
US6995980B2 (en) * | 2003-08-21 | 2006-02-07 | Unisys Corporation | Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module |
US7265561B2 (en) * | 2003-09-30 | 2007-09-04 | International Business Machines Corporation | Device burn in utilizing voltage control |
US7123037B2 (en) * | 2004-02-27 | 2006-10-17 | Wells-Cti, Llc | Integrated circuit temperature sensing device and method |
US7394271B2 (en) * | 2004-02-27 | 2008-07-01 | Wells-Cti, Llc | Temperature sensing and prediction in IC sockets |
US7042240B2 (en) * | 2004-02-27 | 2006-05-09 | Wells-Cti, Llc | Burn-in testing apparatus and method |
US20060290370A1 (en) * | 2004-02-27 | 2006-12-28 | Wells-Cti, Llc, An Oregon Limited Liability Company | Temperature control in ic sockets |
US6965246B2 (en) * | 2004-04-16 | 2005-11-15 | Hon Hai Precision Ind. Co., Ltd. | Burn-in socket assembly |
US6989685B1 (en) | 2004-08-19 | 2006-01-24 | International Business Machines Corporation | Method and system for maintaining uniform module junction temperature during burn-in |
US7406397B2 (en) * | 2004-09-02 | 2008-07-29 | International Business Machines Corporation | Self heating monitor for SiGe and SOI CMOS devices |
US7486098B2 (en) * | 2005-06-16 | 2009-02-03 | International Business Machines Corporation | Integrated circuit testing method using well bias modification |
US20060290366A1 (en) * | 2005-06-28 | 2006-12-28 | Intel Corporation | Monitoring multiple electronic devices under test |
US20070030019A1 (en) * | 2005-08-04 | 2007-02-08 | Micron Technology, Inc. | Power sink for IC temperature control |
US20070210818A1 (en) * | 2006-03-09 | 2007-09-13 | International Business Machines Corporation | Temperature monitoring and control apparatus and method |
CN101601098A (zh) * | 2007-02-01 | 2009-12-09 | 富士通株式会社 | 监视老化试验装置和监视老化试验方法 |
US20080284609A1 (en) * | 2007-05-17 | 2008-11-20 | Broadcom Corporation, A California Corporation | RF Integrated circuit having an on-chip thermal sensing circuit |
CN101675347B (zh) * | 2007-05-21 | 2012-08-22 | 富士通半导体股份有限公司 | 半导体装置的测试装置及测试方法 |
TWI345067B (en) * | 2007-11-23 | 2011-07-11 | Ind Tech Res Inst | Devices and methods for led life test |
US7999563B2 (en) * | 2008-06-24 | 2011-08-16 | Cascade Microtech, Inc. | Chuck for supporting and retaining a test substrate and a calibration substrate |
US7965094B2 (en) * | 2008-07-14 | 2011-06-21 | Honeywell International Inc. | Packaged die heater |
US8008934B2 (en) * | 2009-06-10 | 2011-08-30 | Freescale Semiconductor, Inc. | Burn-in system for electronic devices |
US8608376B2 (en) * | 2010-05-26 | 2013-12-17 | Board Of Trustees Of The University Of Arkansas | Method for modeling and parameter extraction of LDMOS devices |
US8540422B2 (en) * | 2010-10-04 | 2013-09-24 | Cameron Health, Inc. | Electrical component behavior analysis tools |
ITMI20121201A1 (it) * | 2012-07-10 | 2014-01-11 | Nirox S R L | Apparato per la prova termica di un componente elettronico e posaggio per la prova di funzionamento di detto componente elettronico, integrante detto apparato di prova termica |
TWI484200B (zh) * | 2013-05-28 | 2015-05-11 | Richtek Technology Corp | 測試操作機與測試載具以及相關測試方法 |
US9176184B2 (en) * | 2013-10-03 | 2015-11-03 | Globalfoundries U.S. 2 Llc | Semiconductor device burn-in stress method and system |
CN203587627U (zh) * | 2013-12-05 | 2014-05-07 | 上海联星电子有限公司 | 一种低阻抗宽带测试夹具 |
CN112309487B (zh) * | 2019-07-26 | 2024-04-12 | 第一检测有限公司 | 芯片测试系统 |
CN114076859A (zh) * | 2020-08-18 | 2022-02-22 | 中国科学院国家空间科学中心 | 一种针对宇航用核心元器件的全温老炼测试系统及其方法 |
WO2022082557A1 (zh) * | 2020-10-22 | 2022-04-28 | 广西电网有限责任公司电力科学研究院 | 一种复合绝缘横担老化试验系统 |
TW202313431A (zh) * | 2021-09-17 | 2023-04-01 | 致茂電子股份有限公司 | 電子元件測試設備及其測試方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3092998A (en) * | 1960-08-08 | 1963-06-11 | Rca Corp | Thermometers |
US4145620A (en) * | 1977-10-05 | 1979-03-20 | Serel Corporation | Modular dynamic burn-in apparatus |
US4636725A (en) * | 1982-01-04 | 1987-01-13 | Artronics Corporation | Electronic burn-in system |
US4745354A (en) * | 1985-05-20 | 1988-05-17 | Fts Systems, Inc. | Apparatus and methods for effecting a burn-in procedure on semiconductor devices |
WO1987001813A1 (en) * | 1985-09-23 | 1987-03-26 | Sharetree Limited | An oven for the burn-in of integrated circuits |
US4777434A (en) * | 1985-10-03 | 1988-10-11 | Amp Incorporated | Microelectronic burn-in system |
US4734641A (en) * | 1987-03-09 | 1988-03-29 | Tektronix, Inc. | Method for the thermal characterization of semiconductor packaging systems |
DE3715231A1 (de) * | 1987-05-07 | 1988-11-17 | Siemens Ag | Messvorrichtung zur bestimmung der temperatur von halbleiterkoerpern, verfahren zur herstellung der messvorrichtung und verfahren zur bestimmung der temperatur von halbleiterkoerpern waehrend temperprozessen |
US4902969A (en) * | 1987-06-01 | 1990-02-20 | Reliability Incorporated | Automated burn-in system |
US5047711A (en) * | 1989-08-23 | 1991-09-10 | Silicon Connections Corporation | Wafer-level burn-in testing of integrated circuits |
US5001423A (en) * | 1990-01-24 | 1991-03-19 | International Business Machines Corporation | Dry interface thermal chuck temperature control system for semiconductor wafer testing |
US5309090A (en) * | 1990-09-06 | 1994-05-03 | Lipp Robert J | Apparatus for heating and controlling temperature in an integrated circuit chip |
US5164661A (en) * | 1991-05-31 | 1992-11-17 | Ej Systems, Inc. | Thermal control system for a semi-conductor burn-in |
-
1992
- 1992-07-15 CA CA002073886A patent/CA2073886A1/en not_active Abandoned
- 1992-07-17 AU AU20335/92A patent/AU657976B2/en not_active Ceased
- 1992-07-17 US US07/914,559 patent/US5327075A/en not_active Expired - Fee Related
- 1992-07-17 MY MYPI92001261A patent/MY131275A/en unknown
- 1992-07-17 DE DE69201923T patent/DE69201923T2/de not_active Expired - Fee Related
- 1992-07-17 EP EP92112264A patent/EP0523735B1/de not_active Expired - Lifetime
- 1992-07-18 KR KR1019920012833A patent/KR960003989B1/ko not_active IP Right Cessation
-
1994
- 1994-02-04 US US08/191,539 patent/US5414370A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112010000729B4 (de) * | 2009-02-10 | 2015-05-07 | Qualitau, Inc. | Integrierte Einheit für elektrisches Testen/ Zuverlässigkeitstesten mit verbesserter thermischer Kontrolle |
Also Published As
Publication number | Publication date |
---|---|
KR930003443A (ko) | 1993-02-24 |
DE69201923D1 (de) | 1995-05-11 |
US5327075A (en) | 1994-07-05 |
CA2073886A1 (en) | 1993-01-20 |
EP0523735B1 (de) | 1995-04-05 |
AU657976B2 (en) | 1995-03-30 |
AU2033592A (en) | 1993-02-11 |
MY131275A (en) | 2007-07-31 |
US5414370A (en) | 1995-05-09 |
EP0523735A1 (de) | 1993-01-20 |
KR960003989B1 (ko) | 1996-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |