DE69131091D1 - Epoxydharzzusammensetzungen und deren gehärtete Gegenstände - Google Patents
Epoxydharzzusammensetzungen und deren gehärtete GegenständeInfo
- Publication number
- DE69131091D1 DE69131091D1 DE69131091T DE69131091T DE69131091D1 DE 69131091 D1 DE69131091 D1 DE 69131091D1 DE 69131091 T DE69131091 T DE 69131091T DE 69131091 T DE69131091 T DE 69131091T DE 69131091 D1 DE69131091 D1 DE 69131091D1
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- resin compositions
- hardened articles
- hardened
- articles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1444—Monoalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2339911A JPH0747622B2 (ja) | 1990-11-30 | 1990-11-30 | エポキシ樹脂組成物及びその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69131091D1 true DE69131091D1 (de) | 1999-05-12 |
DE69131091T2 DE69131091T2 (de) | 1999-11-11 |
Family
ID=18331941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69131091T Expired - Fee Related DE69131091T2 (de) | 1990-11-30 | 1991-11-29 | Epoxydharzzusammensetzungen und deren gehärtete Gegenstände |
Country Status (4)
Country | Link |
---|---|
US (1) | US5225484A (de) |
EP (1) | EP0488374B1 (de) |
JP (1) | JPH0747622B2 (de) |
DE (1) | DE69131091T2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960704977A (ko) * | 1994-07-18 | 1996-10-09 | 마에다 가쯔노스께 | 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료(An Epoxy Resin Composition, a Prepreg and a Fiber Reinforced Composite Material) |
US5977255A (en) * | 1997-10-06 | 1999-11-02 | Dow Corning Corporation | Glycidoxy-functional polymer cured with amine-functional organosilicon compound |
TW538482B (en) * | 1999-04-26 | 2003-06-21 | Shinetsu Chemical Co | Semiconductor encapsulating epoxy resin composition and semiconductor device |
US7192997B2 (en) * | 2001-02-07 | 2007-03-20 | International Business Machines Corporation | Encapsulant composition and electronic package utilizing same |
US6750290B2 (en) * | 2001-04-19 | 2004-06-15 | Canon Kabushiki Kaisha | Epoxy resin composition, method of improving surface of substrate, ink jet recording head and ink jet recording apparatus |
KR100523594B1 (ko) * | 2002-10-24 | 2005-10-24 | 주식회사 엘지화학 | 에폭시/열가소성 수지 블렌드 조성물 |
KR100588301B1 (ko) * | 2002-10-24 | 2006-06-09 | 주식회사 엘지화학 | 에폭시/열가소성 수지 블렌드 조성물 |
JP4609645B2 (ja) * | 2005-03-07 | 2011-01-12 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂成形材料接着用プライマー組成物及び半導体装置 |
EP2383817A1 (de) | 2010-04-29 | 2011-11-02 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Lichtemittierende Vorrichtung und Verfahren zu ihrer Herstellung |
CN113228383A (zh) * | 2018-12-27 | 2021-08-06 | 三洋电机株式会社 | 用于使相邻的电池单体绝缘的隔板和具备该隔板的电源装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1487853A (en) * | 1973-12-26 | 1977-10-05 | Gen Electric | Polymer-filled polysiloxanes |
US4550056A (en) * | 1983-04-15 | 1985-10-29 | Union Carbide Corporation | Electrical cable containing cured elastomeric compositions |
JPS61101519A (ja) * | 1984-10-24 | 1986-05-20 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ成形材料 |
JPS61296052A (ja) * | 1985-06-24 | 1986-12-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPS62280215A (ja) * | 1986-05-29 | 1987-12-05 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
DE3623795C1 (de) * | 1986-07-15 | 1987-10-22 | Rehau Ag + Co, 8673 Rehau, De | |
JPS63162762A (ja) * | 1986-12-26 | 1988-07-06 | Polyplastics Co | 合成樹脂組成物 |
JPH0617458B2 (ja) * | 1987-03-16 | 1994-03-09 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
JPH0791446B2 (ja) * | 1987-03-31 | 1995-10-04 | 株式会社東芝 | 樹脂封止半導体装置 |
JPH0655805B2 (ja) * | 1987-06-26 | 1994-07-27 | 信越化学工業株式会社 | 熱硬化性エポキシ樹脂組成物 |
US4861833A (en) * | 1987-09-28 | 1989-08-29 | Ppg Industries, Inc. | Epoxide and rubber based curable compositions having good adhesion direct to metal |
JP2608107B2 (ja) * | 1988-06-28 | 1997-05-07 | 三菱電機株式会社 | 半導体封止用エポキシ樹脂組成物 |
DE3815124A1 (de) * | 1988-05-04 | 1989-11-16 | Bayer Ag | Verwendung von siliconharzen als flammschutzmittel |
JPH0243279A (ja) * | 1988-08-04 | 1990-02-13 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2686787B2 (ja) * | 1988-10-17 | 1997-12-08 | 東レ・ダウコーニング・シリコーン株式会社 | ふっ素系ゴム組成物 |
FR2641789B1 (fr) * | 1989-01-19 | 1991-03-22 | Rhone Poulenc Chimie | Procede de preparation de particules non collantes a base d'une composition organopolysiloxane reticulee par des reactions de polyaddition |
US5053450A (en) * | 1989-10-16 | 1991-10-01 | Monsanto Company | Elastomer compositions |
CA2031128A1 (en) * | 1989-12-01 | 1991-06-02 | Yoshio Ishida | Two-component epoxy resin compositions |
-
1990
- 1990-11-30 JP JP2339911A patent/JPH0747622B2/ja not_active Expired - Fee Related
-
1991
- 1991-11-27 US US07/798,750 patent/US5225484A/en not_active Expired - Lifetime
- 1991-11-29 DE DE69131091T patent/DE69131091T2/de not_active Expired - Fee Related
- 1991-11-29 EP EP91120521A patent/EP0488374B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5225484A (en) | 1993-07-06 |
JPH04202524A (ja) | 1992-07-23 |
EP0488374A3 (en) | 1992-11-04 |
DE69131091T2 (de) | 1999-11-11 |
EP0488374B1 (de) | 1999-04-07 |
JPH0747622B2 (ja) | 1995-05-24 |
EP0488374A2 (de) | 1992-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |