DE69127154T2 - Anordnung zur Montierung elektronischer Bauteile - Google Patents

Anordnung zur Montierung elektronischer Bauteile

Info

Publication number
DE69127154T2
DE69127154T2 DE69127154T DE69127154T DE69127154T2 DE 69127154 T2 DE69127154 T2 DE 69127154T2 DE 69127154 T DE69127154 T DE 69127154T DE 69127154 T DE69127154 T DE 69127154T DE 69127154 T2 DE69127154 T2 DE 69127154T2
Authority
DE
Germany
Prior art keywords
arrangement
electronic components
mounting electronic
mounting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69127154T
Other languages
English (en)
Other versions
DE69127154D1 (de
Inventor
Tanaka Satoru
Tago Kazuhide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2220840A external-priority patent/JP2969863B2/ja
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE69127154D1 publication Critical patent/DE69127154D1/de
Publication of DE69127154T2 publication Critical patent/DE69127154T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
DE69127154T 1990-08-22 1991-08-22 Anordnung zur Montierung elektronischer Bauteile Expired - Lifetime DE69127154T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2220840A JP2969863B2 (ja) 1990-08-22 1990-08-22 電子部品装着機
JP31486490 1990-11-20

Publications (2)

Publication Number Publication Date
DE69127154D1 DE69127154D1 (de) 1997-09-11
DE69127154T2 true DE69127154T2 (de) 1998-01-29

Family

ID=26523940

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69127154T Expired - Lifetime DE69127154T2 (de) 1990-08-22 1991-08-22 Anordnung zur Montierung elektronischer Bauteile

Country Status (3)

Country Link
US (1) US5172468A (de)
EP (1) EP0476851B1 (de)
DE (1) DE69127154T2 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
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US5446323A (en) * 1991-09-25 1995-08-29 Systems, Machines, Automation Components Corporation Actuator with translational and rotational control
US5317222A (en) * 1991-09-25 1994-05-31 Systems, Machines, Automation Components Corp. Workpiece transporter device with replaceable grip
DE4332236A1 (de) * 1992-11-26 1995-03-23 F E S Used Electronics Elektro Anlage zur automatischen Entstückung
US5506410A (en) * 1994-05-16 1996-04-09 Matsushita Electric Industrial Co., Ltd. Cordless movable apparatus using optical spatial tranceivers
SE9403069D0 (sv) * 1994-09-14 1994-09-14 Mytronic Ab Optical centering and electronic test connect device
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
US5768765A (en) * 1995-02-21 1998-06-23 Samsung Aerospace Industries, Ltd. Component mounting apparatus
US5699448A (en) * 1995-07-05 1997-12-16 Universal Instruments Corporation Split field optics for locating multiple components
GB2306904B (en) * 1995-11-06 1999-06-16 Smtech Limited Circuit boards
BE1009814A5 (nl) * 1995-11-06 1997-08-05 Framatome Connectors Belgium Werkwijze en inrichting voor het aanbrengen van elektronische onderdelen in een plaat met gedrukte schakelingen.
SE9504062D0 (sv) * 1995-11-12 1995-11-12 Mytronic Ab Optical centering/coplanarity and electronic test device
JP2863731B2 (ja) * 1996-05-14 1999-03-03 株式会社テンリュウテクニックス 電子部品装着装置およびその方法
US6868603B2 (en) 1996-08-27 2005-03-22 Matsushita Electric Industrial Co., Ltd. Method of mounting component on circuit board
JPH1070395A (ja) * 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd 部品装着装置
JP3802955B2 (ja) * 1996-11-27 2006-08-02 富士機械製造株式会社 回路部品装着システム
EP0948250B1 (de) * 1996-12-13 2006-02-08 Matsushita Electric Industrial Co., Ltd. Elektronisches bauteil und bestückungsverfahren und -vorrichtung
US6938335B2 (en) * 1996-12-13 2005-09-06 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
JP3562325B2 (ja) * 1998-07-16 2004-09-08 松下電器産業株式会社 電子部品の実装方法
JP3384335B2 (ja) * 1998-09-02 2003-03-10 松下電器産業株式会社 自動組立装置および自動組立方法
US7191512B2 (en) * 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
US6266869B1 (en) * 1999-02-17 2001-07-31 Applied Kinetics, Inc. Method for assembling components
KR100685559B1 (ko) * 1999-03-16 2007-02-22 마츠시타 덴끼 산교 가부시키가이샤 도전성 볼의 탑재 장치 및 방법
JP2000288969A (ja) * 1999-04-01 2000-10-17 Mirae Corp 表面実装機のマウンタヘッド
KR100345901B1 (ko) * 1999-06-16 2002-07-27 미래산업 주식회사 표면실장장치
US6203082B1 (en) 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
KR100311747B1 (ko) * 1999-08-20 2001-10-18 정문술 표면실장기의 인쇄회로기판 이송장치
US6634091B1 (en) * 2000-02-15 2003-10-21 Samsung Techwin Co., Ltd. Part mounter
EP1264334B1 (de) * 2000-03-10 2009-02-18 Infotech, AG Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung
US20020030736A1 (en) * 2000-03-10 2002-03-14 Infotech Ag Single camera alignment system using up/down optics
US6985780B2 (en) 2000-03-10 2006-01-10 Adept Technology, Inc. Smart camera
US6605500B2 (en) 2000-03-10 2003-08-12 Infotech Ag Assembly process
US6988008B2 (en) 2000-03-10 2006-01-17 Adept Technology, Inc. Smart camera
JP2001338935A (ja) * 2000-05-26 2001-12-07 Nidec Copal Corp ダイボンディング装置
US6832122B1 (en) * 2000-07-06 2004-12-14 Siemens Electronics Assembly Systems, Inc. System and method for comparing electronics manufacturing data
DE10043197A1 (de) * 2000-09-01 2002-03-28 Siemens Ag Verfahren zur Verarbeitung von kontrastschwachen Bildsignalen
US6463359B2 (en) 2001-02-20 2002-10-08 Infotech Ag Micro-alignment pick-up head
US7027141B2 (en) * 2001-05-03 2006-04-11 Applied Kinetics, Inc. Static attitude determination and adjust of head suspension components
TW200404485A (en) * 2002-05-22 2004-03-16 Assembleon Nv Method of placing a component by means of a placement device at a desired position on a substrate holder, and device suitable for performing such a method
JP4044017B2 (ja) * 2003-04-22 2008-02-06 松下電器産業株式会社 部品実装装置及びその方法
JP2005228992A (ja) * 2004-02-13 2005-08-25 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
DE102004008082A1 (de) * 2004-02-19 2005-09-08 Marconi Communications Gmbh Verfahren zum Bestücken eines Schaltungsträgers
KR100651815B1 (ko) * 2005-01-14 2006-12-01 삼성테크윈 주식회사 부품 실장기
EP2343165A1 (de) 2010-01-07 2011-07-13 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System und Verfahren zum Aufnehmen und Platzieren von Chips
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
CN103098578A (zh) 2010-08-27 2013-05-08 松下电器产业株式会社 部件安装装置及部件安装方法
US9036354B2 (en) * 2013-01-15 2015-05-19 Flextronics, Ap, Llc Heat sink thermal press for phase change heat sink material
DE102017109698A1 (de) * 2017-05-05 2018-11-08 Carl Zeiss Microscopy Gmbh Bestimmen von Kontextinformation für Wechselkomponenten eines optischen Systems

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103700A (ja) * 1983-11-11 1985-06-07 株式会社日立製作所 部品の位置決め装置
EP0449481B1 (de) * 1990-03-19 1996-01-31 Hitachi, Ltd. Vorrichtung und Verfahren zum Transport von Bauteilen

Also Published As

Publication number Publication date
EP0476851A3 (en) 1992-07-08
EP0476851A2 (de) 1992-03-25
US5172468A (en) 1992-12-22
DE69127154D1 (de) 1997-09-11
EP0476851B1 (de) 1997-08-06

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