DE69123279D1 - Transportvorrichtung für Substrate und Verfahren zur Kontrolle - Google Patents

Transportvorrichtung für Substrate und Verfahren zur Kontrolle

Info

Publication number
DE69123279D1
DE69123279D1 DE69123279T DE69123279T DE69123279D1 DE 69123279 D1 DE69123279 D1 DE 69123279D1 DE 69123279 T DE69123279 T DE 69123279T DE 69123279 T DE69123279 T DE 69123279T DE 69123279 D1 DE69123279 D1 DE 69123279D1
Authority
DE
Germany
Prior art keywords
substrates
control
transport device
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69123279T
Other languages
English (en)
Other versions
DE69123279T2 (de
Inventor
Mitsutoshi Kuno
Hidehiko Fujioka
Nobutoshi Mizusawa
Yuji Chiba
Takao Kariya
Koji Uda
Shunichi Uzawa
Eigo Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2090413A external-priority patent/JP2802664B2/ja
Priority claimed from JP14156590A external-priority patent/JPH0435890A/ja
Priority claimed from JP2174441A external-priority patent/JP2802148B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69123279D1 publication Critical patent/DE69123279D1/de
Publication of DE69123279T2 publication Critical patent/DE69123279T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Library & Information Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69123279T 1990-04-06 1991-04-04 Transportvorrichtung für Substrate und Verfahren zur Kontrolle Expired - Fee Related DE69123279T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2090413A JP2802664B2 (ja) 1990-04-06 1990-04-06 マスク搬送装置とマスク位置決め保持方法
JP14156590A JPH0435890A (ja) 1990-06-01 1990-06-01 搬送装置の制御方法
JP2174441A JP2802148B2 (ja) 1990-07-03 1990-07-03 マスク位置決め保持方法

Publications (2)

Publication Number Publication Date
DE69123279D1 true DE69123279D1 (de) 1997-01-09
DE69123279T2 DE69123279T2 (de) 1997-04-24

Family

ID=27306439

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69123279T Expired - Fee Related DE69123279T2 (de) 1990-04-06 1991-04-04 Transportvorrichtung für Substrate und Verfahren zur Kontrolle

Country Status (3)

Country Link
US (1) US5641264A (de)
EP (1) EP0452041B1 (de)
DE (1) DE69123279T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5418717A (en) * 1990-08-27 1995-05-23 Su; Keh-Yih Multiple score language processing system
KR0144945B1 (ko) * 1994-08-25 1998-08-17 이대원 레티클 검출장치
JP3200326B2 (ja) * 1995-04-24 2001-08-20 東京応化工業株式会社 円板状被処理物の移載方法及び移載装置
US5788453A (en) * 1996-05-30 1998-08-04 Applied Materials, Inc. Piezoelectric wafer gripping system for robot blades
JP3450648B2 (ja) * 1997-05-09 2003-09-29 キヤノン株式会社 倍率補正装置および倍率補正装置を搭載したｘ線露光装置ならびにデバイス製造方法
US6120230A (en) * 1997-08-25 2000-09-19 Advanced Digital Information Corporation Roller-inserter for use with cartridge style information storage media
GB2347784B (en) 1999-03-11 2004-02-11 Applied Materials Inc Scanning wheel for ion implantation process chamber
US6920803B2 (en) * 2001-07-25 2005-07-26 Olympus Optical Co., Ltd. Electromotive stage for microscope
DE50214847D1 (de) * 2001-10-31 2011-02-17 Komax Holding Ag Handhabungsvorrichtung für Drahtleitung, Einführungsmaschine und Einführungsverfahren mit einer solchen Handhabungsvorrichtung
US7004715B2 (en) 2002-01-09 2006-02-28 Asml Holding N.V. Apparatus for transferring and loading a reticle with a robotic reticle end-effector
DE50210755D1 (de) * 2002-06-28 2007-10-04 Esec Trading Sa Klemmelement mit einem integrierten Kraftsensor
TWI231244B (en) 2002-06-28 2005-04-21 Esec Trading Sa Clamping element with an integrated force sensor
US20140165906A1 (en) * 2012-12-13 2014-06-19 Varian Semiconductor Equipment Associates, Inc. Magnetic masks for an ion implant apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3906325A (en) * 1973-12-20 1975-09-16 Olivetti & Co Spa Adaptive feeling apparatus for determining a prearranged position in which a part is to be fitted
US4132318A (en) * 1976-12-30 1979-01-02 International Business Machines Corporation Asymmetric six-degree-of-freedom force-transducer system for a computer-controlled manipulator system
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法
US4540331A (en) * 1983-08-18 1985-09-10 General Motors Corporation Cut out device
US4510683A (en) * 1983-10-27 1985-04-16 Sperry Corporation Force assembler apparatus for robots
US4514616A (en) * 1984-09-11 1985-04-30 Rumble Equipment Limited Safety mounting device
EP0198501B1 (de) * 1985-04-17 1992-07-01 Hitachi, Ltd. Greiferwerkzeug
US4715774A (en) * 1985-12-23 1987-12-29 Peddinghaus Corporation Workpiece advancing apparatus
US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
JPH01164583A (ja) * 1987-12-21 1989-06-28 Hitachi Ltd エンドエフェクタ
JP2631485B2 (ja) * 1988-01-28 1997-07-16 キヤノン株式会社 位置決め装置
DE68928460T2 (de) * 1988-09-06 1998-04-02 Canon K.K., Tokio/Tokyo Maskenkassetten-Ladevorrichtung

Also Published As

Publication number Publication date
US5641264A (en) 1997-06-24
EP0452041B1 (de) 1996-11-27
EP0452041A1 (de) 1991-10-16
DE69123279T2 (de) 1997-04-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee