DE69118635T2 - Optische Halbleiter-Vorrichtung - Google Patents

Optische Halbleiter-Vorrichtung

Info

Publication number
DE69118635T2
DE69118635T2 DE1991618635 DE69118635T DE69118635T2 DE 69118635 T2 DE69118635 T2 DE 69118635T2 DE 1991618635 DE1991618635 DE 1991618635 DE 69118635 T DE69118635 T DE 69118635T DE 69118635 T2 DE69118635 T2 DE 69118635T2
Authority
DE
Germany
Prior art keywords
semiconductor device
optical semiconductor
optical
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1991618635
Other languages
English (en)
Other versions
DE69118635D1 (de
Inventor
Nobuhiro Murai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69118635D1 publication Critical patent/DE69118635D1/de
Publication of DE69118635T2 publication Critical patent/DE69118635T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
DE1991618635 1990-09-26 1991-09-20 Optische Halbleiter-Vorrichtung Expired - Fee Related DE69118635T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2255601A JPH04133480A (ja) 1990-09-26 1990-09-26 光半導体装置用ステム

Publications (2)

Publication Number Publication Date
DE69118635D1 DE69118635D1 (de) 1996-05-15
DE69118635T2 true DE69118635T2 (de) 1996-09-26

Family

ID=17280993

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991618635 Expired - Fee Related DE69118635T2 (de) 1990-09-26 1991-09-20 Optische Halbleiter-Vorrichtung

Country Status (3)

Country Link
EP (1) EP0477801B1 (de)
JP (1) JPH04133480A (de)
DE (1) DE69118635T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT409913B (de) * 2000-11-27 2002-12-27 Electrovac Metall Glaseinschme Verschlussstopfen
DE10159544A1 (de) * 2001-12-05 2003-06-26 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelementes und damit hergestelltes Bauelement
JP3998526B2 (ja) 2002-07-12 2007-10-31 三菱電機株式会社 光半導体用パッケージ
JP4198410B2 (ja) * 2002-07-30 2008-12-17 三菱電機株式会社 光半導体集積装置
JP4550386B2 (ja) * 2003-03-27 2010-09-22 三菱電機株式会社 光半導体素子用パッケージ
KR100526504B1 (ko) 2003-06-04 2005-11-08 삼성전자주식회사 광소자 모듈 패키지 및 그 제조 방법
DE102004063978B4 (de) 2003-07-17 2019-01-24 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP2010073776A (ja) * 2008-09-17 2010-04-02 Rohm Co Ltd 半導体レーザ装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178376C (nl) * 1978-06-19 1986-03-03 Philips Nv Koppelelement met een lichtbron en een lens.
NL7908536A (nl) * 1979-11-23 1981-06-16 Philips Nv Omhulling voor een fotodiode.
JPS61147585A (ja) * 1984-12-21 1986-07-05 Stanley Electric Co Ltd 発光ダイオ−ド
US4642513A (en) * 1985-02-08 1987-02-10 Rca Corporation Electrooptic assembly having an adjustable window
US4797728A (en) * 1986-07-16 1989-01-10 General Electric Company Semiconductor device assembly and method of making same

Also Published As

Publication number Publication date
JPH04133480A (ja) 1992-05-07
EP0477801B1 (de) 1996-04-10
EP0477801A1 (de) 1992-04-01
DE69118635D1 (de) 1996-05-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD., KAWASAKI

8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee