DE69117374D1 - SiC-Dünnschichtthermistor und Verfahren und Herstellungsverfahren. - Google Patents

SiC-Dünnschichtthermistor und Verfahren und Herstellungsverfahren.

Info

Publication number
DE69117374D1
DE69117374D1 DE69117374T DE69117374T DE69117374D1 DE 69117374 D1 DE69117374 D1 DE 69117374D1 DE 69117374 T DE69117374 T DE 69117374T DE 69117374 T DE69117374 T DE 69117374T DE 69117374 D1 DE69117374 D1 DE 69117374D1
Authority
DE
Germany
Prior art keywords
thin film
manufacturing process
film thermistor
sic thin
sic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69117374T
Other languages
English (en)
Other versions
DE69117374T2 (de
Inventor
Takeshi Nagai
Shuji Itou
Kunihiro Tsuruda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2197247A external-priority patent/JPH0483301A/ja
Priority claimed from JP3058648A external-priority patent/JP2701565B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69117374D1 publication Critical patent/DE69117374D1/de
Publication of DE69117374T2 publication Critical patent/DE69117374T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
DE69117374T 1990-07-25 1991-07-23 SiC-Dünnschichtthermistor und Verfahren und Herstellungsverfahren. Expired - Fee Related DE69117374T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2197247A JPH0483301A (ja) 1990-07-25 1990-07-25 薄膜サーミスタ
JP3058648A JP2701565B2 (ja) 1991-03-22 1991-03-22 薄膜サーミスタおよびその製造方法

Publications (2)

Publication Number Publication Date
DE69117374D1 true DE69117374D1 (de) 1996-04-04
DE69117374T2 DE69117374T2 (de) 1996-08-01

Family

ID=26399675

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69117374T Expired - Fee Related DE69117374T2 (de) 1990-07-25 1991-07-23 SiC-Dünnschichtthermistor und Verfahren und Herstellungsverfahren.

Country Status (6)

Country Link
US (1) US5216404A (de)
EP (1) EP0468429B1 (de)
KR (1) KR960011154B1 (de)
AU (1) AU627663B2 (de)
CA (1) CA2047639C (de)
DE (1) DE69117374T2 (de)

Families Citing this family (29)

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Publication number Priority date Publication date Assignee Title
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
DE4339551C1 (de) * 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
EP0760157B1 (de) * 1994-05-16 1998-08-26 Raychem Corporation Elektrisches bauteil mit einem ptc-widerstandselement
US6172590B1 (en) 1996-01-22 2001-01-09 Surgx Corporation Over-voltage protection device and method for making same
ATE309610T1 (de) * 1996-01-22 2005-11-15 Surgx Corp Überspannungsschutzanordnung und herstellungsverfahren
US6034411A (en) * 1997-10-29 2000-03-07 Intersil Corporation Inverted thin film resistor
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US6064094A (en) * 1998-03-10 2000-05-16 Oryx Technology Corporation Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
US5977863A (en) * 1998-08-10 1999-11-02 Cts Corporation Low cross talk ball grid array resistor network
US6326677B1 (en) 1998-09-04 2001-12-04 Cts Corporation Ball grid array resistor network
JP2002527861A (ja) * 1998-10-06 2002-08-27 ブアンズ・インコーポレイテッド 導電性ポリマーｐｔｃバッテリー保護デバイス及びその製造方法
US6097277A (en) * 1998-11-05 2000-08-01 Cts Resistor network with solder sphere connector
US6005777A (en) * 1998-11-10 1999-12-21 Cts Corporation Ball grid array capacitor
US6194979B1 (en) 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6640420B1 (en) * 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6373719B1 (en) 2000-04-13 2002-04-16 Surgx Corporation Over-voltage protection for electronic circuits
US6246312B1 (en) 2000-07-20 2001-06-12 Cts Corporation Ball grid array resistor terminator network
US7183891B2 (en) * 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
US7880580B2 (en) * 2005-12-07 2011-02-01 General Electric Company Thermistor having doped and undoped layers of material
US7835001B2 (en) * 2006-05-24 2010-11-16 Samsung Mobile Display Co., Ltd. Method of aligning a substrate, mask to be aligned with the same, and flat panel display apparatus using the same
KR100928143B1 (ko) 2008-06-27 2009-11-24 지엠비코리아 주식회사 워터펌프의 전자클러치
US8809897B2 (en) 2011-08-31 2014-08-19 Micron Technology, Inc. Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods
US9490239B2 (en) 2011-08-31 2016-11-08 Micron Technology, Inc. Solid state transducers with state detection, and associated systems and methods
JP6256690B2 (ja) * 2014-02-26 2018-01-10 三菱マテリアル株式会社 非接触温度センサ
JP2018146403A (ja) * 2017-03-06 2018-09-20 Koa株式会社 温度センサ素子
CN115287589B (zh) * 2022-01-12 2024-01-30 青岛大学 一种基于卷曲硅纳米膜的气体传感器制备方法及应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1549394A (en) * 1923-01-20 1925-08-11 Columbia Phonograph Co Inc Resistance conductor and manufacturing process and material therefor
GB933470A (en) * 1959-11-14 1963-08-08 Barr & Stroud Ltd Improvements relating to glass sandwiches primarily for windows of optical instruments
US3775725A (en) * 1970-04-30 1973-11-27 Hokuriku Elect Ind Printed resistor
US3659245A (en) * 1971-03-29 1972-04-25 Bourns Inc Variable resistor pin terminal and method
US3845443A (en) * 1972-06-14 1974-10-29 Bailey Meter Co Thin film resistance thermometer
US4086559A (en) * 1973-09-14 1978-04-25 U.S. Philips Corporation Electric resistor based on silicon carbide having a negative temperature coefficient
JPS5623281B2 (de) * 1974-02-28 1981-05-30
US4208449A (en) * 1974-09-11 1980-06-17 U.S. Philips Corporation Method of making an electric resistor having a resistance body consisting of silicon carbide having a negative temperature coefficient
GB1546091A (en) * 1975-02-28 1979-05-16 Johnson Matthey Co Ltd Thermometers
GB2061002B (en) * 1979-10-11 1983-10-19 Matsushita Electric Ind Co Ltd Method for making a carbide thin film thermistor
US4424507A (en) * 1981-04-10 1984-01-03 Matsushita Electric Industrial Co., Ltd. Thin film thermistor
GB2162686B (en) * 1984-08-02 1988-05-11 Stc Plc Thermistors
JPS62262385A (ja) * 1986-05-07 1987-11-14 日本碍子株式会社 発熱抵抗体
US4777718A (en) * 1986-06-30 1988-10-18 Motorola, Inc. Method of forming and connecting a resistive layer on a pc board
JPH0616442B2 (ja) * 1988-04-06 1994-03-02 株式会社村田製作所 有機正特性サーミスタ
JPH0810645B2 (ja) * 1988-04-21 1996-01-31 松下電器産業株式会社 薄膜サーミスタ

Also Published As

Publication number Publication date
DE69117374T2 (de) 1996-08-01
CA2047639A1 (en) 1992-01-26
EP0468429B1 (de) 1996-02-28
AU8129291A (en) 1992-01-30
EP0468429A3 (en) 1992-12-09
KR960011154B1 (ko) 1996-08-21
US5216404A (en) 1993-06-01
KR920003339A (ko) 1992-02-29
AU627663B2 (en) 1992-08-27
EP0468429A2 (de) 1992-01-29
CA2047639C (en) 1997-09-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee