DE69112090D1 - Verfahren und Vorrichtung zur Messung von Musterdimensionen. - Google Patents

Verfahren und Vorrichtung zur Messung von Musterdimensionen.

Info

Publication number
DE69112090D1
DE69112090D1 DE69112090T DE69112090T DE69112090D1 DE 69112090 D1 DE69112090 D1 DE 69112090D1 DE 69112090 T DE69112090 T DE 69112090T DE 69112090 T DE69112090 T DE 69112090T DE 69112090 D1 DE69112090 D1 DE 69112090D1
Authority
DE
Germany
Prior art keywords
measuring sample
sample dimensions
dimensions
measuring
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69112090T
Other languages
English (en)
Other versions
DE69112090T2 (de
Inventor
Yasuhiro Kaga
Fumio Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69112090D1 publication Critical patent/DE69112090D1/de
Publication of DE69112090T2 publication Critical patent/DE69112090T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
DE69112090T 1990-02-07 1991-02-07 Verfahren und Vorrichtung zur Messung von Musterdimensionen. Expired - Fee Related DE69112090T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2028013A JPH07111336B2 (ja) 1990-02-07 1990-02-07 パターン寸法測定方法及び装置

Publications (2)

Publication Number Publication Date
DE69112090D1 true DE69112090D1 (de) 1995-09-21
DE69112090T2 DE69112090T2 (de) 1996-05-09

Family

ID=12236892

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69112090T Expired - Fee Related DE69112090T2 (de) 1990-02-07 1991-02-07 Verfahren und Vorrichtung zur Messung von Musterdimensionen.

Country Status (5)

Country Link
US (1) US5159643A (de)
EP (1) EP0441373B1 (de)
JP (1) JPH07111336B2 (de)
KR (1) KR940007113B1 (de)
DE (1) DE69112090T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398307A (en) * 1990-07-06 1995-03-14 Matsushita Electric Industrial Co., Ltd. Mesh generating method and apparatus therefor
JP2823450B2 (ja) * 1992-11-19 1998-11-11 株式会社東芝 回路パターンの寸法測定方法
US5541411A (en) * 1995-07-06 1996-07-30 Fei Company Image-to-image registration focused ion beam system
US6075859A (en) * 1997-03-11 2000-06-13 Qualcomm Incorporated Method and apparatus for encrypting data in a wireless communication system
WO1999012003A1 (en) * 1997-09-03 1999-03-11 The Great Dividers Manufacturing Company Limited Measuring instrument and combination measuring instrument and costing program
US6104493A (en) * 1998-05-14 2000-08-15 Fujitsu Limited Method and apparatus for visual inspection of bump array
US6326618B1 (en) * 1999-07-02 2001-12-04 Agere Systems Guardian Corp. Method of analyzing semiconductor surface with patterned feature using line width metrology
JP4767650B2 (ja) * 1999-11-05 2011-09-07 株式会社トプコン 半導体デバイス検査装置
US6670612B1 (en) * 2002-07-01 2003-12-30 Kla-Tencor Technologies Corporation Undercut measurement using SEM
JP4493495B2 (ja) * 2002-07-11 2010-06-30 アプライド マテリアルズ インコーポレイテッド サブミクロン断面を有する構造素子の断面特徴を決定するためのシステム及び方法
KR101035426B1 (ko) * 2003-07-11 2011-05-18 어플라이드 머티리얼즈 이스라엘 리미티드 기준 구조 엘리먼트를 이용하여 구조 엘리먼트의 단면 피쳐를 결정하는 시스템 및 방법
JP2007201660A (ja) * 2006-01-25 2007-08-09 Fuji Xerox Co Ltd 画像処理装置、画像形成装置、画像処理方法及びプログラム
JP4546500B2 (ja) * 2007-04-04 2010-09-15 株式会社日立ハイテクノロジーズ パターン計測方法及びパターン計測装置、並びにパターン工程制御方法
US8781219B2 (en) 2008-10-12 2014-07-15 Fei Company High accuracy beam placement for local area navigation
CN102246258B (zh) * 2008-10-12 2015-09-02 Fei公司 用于局部区域导航的高精确度射束放置
JP5254099B2 (ja) * 2009-03-23 2013-08-07 株式会社ニューフレアテクノロジー パターン寸法測定方法及び荷電粒子ビーム描画方法
CN102096307A (zh) * 2009-12-14 2011-06-15 鸿富锦精密工业（深圳）有限公司 测试相机镜头偏转角度的方法和装置
EP2612342B1 (de) 2010-08-31 2018-08-22 FEI Company Navigation und probenbearbeitung unter verwendung einer ionenquelle mit sowohl massearmen als auch massereichen spezies
JP6061496B2 (ja) * 2012-05-21 2017-01-18 株式会社日立ハイテクノロジーズ パターン計測装置、パターン計測方法及びパターン計測プログラム
CN103196400A (zh) * 2013-04-08 2013-07-10 常州同泰光电有限公司 一种量测图案化衬底的量测方法
CN105158050B (zh) * 2015-08-12 2019-07-30 核工业理化工程研究院 一种用于纤维扫描电镜试验的固定装置与试验方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326252A (en) * 1976-11-29 1982-04-20 Hitachi Medical Corporation Method of reconstructing cross-section image
US4406545A (en) * 1981-05-07 1983-09-27 Western Electric Company, Inc. Methods of and apparatus for measuring surface areas
JPS6161002A (ja) * 1984-09-03 1986-03-28 Hitachi Ltd 断面形状自動測定方式
EP0178090B1 (de) * 1984-09-19 1990-11-22 Ishida Scales Mfg. Co. Ltd. Verfahren zum Bestimmen eines Volumens
JPS61128114A (ja) * 1984-11-27 1986-06-16 Toshiba Corp パタ−ンの表面形状評価方法
JPH0621784B2 (ja) * 1984-12-10 1994-03-23 株式会社日立製作所 パタ−ン形状評価装置
JPH01311551A (ja) * 1988-06-08 1989-12-15 Toshiba Corp パターン形状測定装置

Also Published As

Publication number Publication date
EP0441373A3 (en) 1992-12-16
KR910015840A (ko) 1991-09-30
EP0441373B1 (de) 1995-08-16
KR940007113B1 (ko) 1994-08-05
JPH03233310A (ja) 1991-10-17
DE69112090T2 (de) 1996-05-09
US5159643A (en) 1992-10-27
EP0441373A2 (de) 1991-08-14
JPH07111336B2 (ja) 1995-11-29

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee