DE69110939D1 - Halbleiterbauelement, dessen Ausgangscharakteristiken durch Trimmen in Funktion angepasst werden können. - Google Patents

Halbleiterbauelement, dessen Ausgangscharakteristiken durch Trimmen in Funktion angepasst werden können.

Info

Publication number
DE69110939D1
DE69110939D1 DE69110939T DE69110939T DE69110939D1 DE 69110939 D1 DE69110939 D1 DE 69110939D1 DE 69110939 T DE69110939 T DE 69110939T DE 69110939 T DE69110939 T DE 69110939T DE 69110939 D1 DE69110939 D1 DE 69110939D1
Authority
DE
Germany
Prior art keywords
trimming
function
semiconductor component
output characteristics
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69110939T
Other languages
English (en)
Other versions
DE69110939T2 (de
Inventor
Yu Ohata
Yosuke Takagi
Koichi Kitahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69110939D1 publication Critical patent/DE69110939D1/de
Application granted granted Critical
Publication of DE69110939T2 publication Critical patent/DE69110939T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE69110939T 1990-04-06 1991-04-05 Halbleiterbauelement, dessen Ausgangscharakteristiken durch Trimmen in Funktion angepasst werden können. Expired - Fee Related DE69110939T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2091396A JP2664793B2 (ja) 1990-04-06 1990-04-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69110939D1 true DE69110939D1 (de) 1995-08-10
DE69110939T2 DE69110939T2 (de) 1995-12-21

Family

ID=14025222

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69110939T Expired - Fee Related DE69110939T2 (de) 1990-04-06 1991-04-05 Halbleiterbauelement, dessen Ausgangscharakteristiken durch Trimmen in Funktion angepasst werden können.

Country Status (5)

Country Link
US (1) US5493148A (de)
EP (1) EP0450648B1 (de)
JP (1) JP2664793B2 (de)
KR (1) KR950013898B1 (de)
DE (1) DE69110939T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780918A (en) * 1990-05-22 1998-07-14 Seiko Epson Corporation Semiconductor integrated circuit device having a programmable adjusting element in the form of a fuse mounted on a margin of the device and a method of manufacturing the same
JP2929966B2 (ja) * 1995-04-11 1999-08-03 株式会社村田製作所 抵抗体のトリミング方法
US5710538A (en) * 1995-09-27 1998-01-20 Micrel, Inc. Circuit having trim pads formed in scribe channel
DE69531058D1 (de) * 1995-12-20 2003-07-17 Ibm Halbleiter IC chip mit elektrisch verstellbaren Widerstandstrukturen
US6107909A (en) * 1997-08-27 2000-08-22 Microlectronic Modules Corporation Trimmed surge resistors
JPH1187622A (ja) * 1997-09-04 1999-03-30 Nec Corp 半導体装置の信号遅延調整回路
WO1999018656A1 (fr) * 1997-10-02 1999-04-15 Mitsubishi Denki Kabushiki Kaisha Dispositif regulateur de tension
US6081106A (en) * 1998-08-21 2000-06-27 Cisco Technology, Inc. Voltage setpoint error reduction
US6770949B1 (en) * 1998-08-31 2004-08-03 Lightspeed Semiconductor Corporation One-mask customizable phase-locked loop
TW429382B (en) * 1998-11-06 2001-04-11 Matsushita Electric Ind Co Ltd Regulating resistor, semiconductor equipment and its production method
US6329272B1 (en) * 1999-06-14 2001-12-11 Technologies Ltrim Inc. Method and apparatus for iteratively, selectively tuning the impedance of integrated semiconductor devices using a focussed heating source
KR100306469B1 (ko) * 1999-08-27 2001-11-01 윤종용 집적회로의 퓨즈옵션회로 및 방법
US6242790B1 (en) * 1999-08-30 2001-06-05 Advanced Micro Devices, Inc. Using polysilicon fuse for IC programming
JP2001267877A (ja) * 2000-03-21 2001-09-28 Sanyo Electric Co Ltd 弾性表面波デバイス
US6664500B2 (en) 2000-12-16 2003-12-16 Anadigics, Inc. Laser-trimmable digital resistor
CN1620704A (zh) * 2001-09-10 2005-05-25 迈克罗布里吉技术有限公司 使用脉冲加热和热定位进行有效的电阻微调的方法
US6452478B1 (en) * 2001-09-19 2002-09-17 California Micro Devices Voltage trimmable resistor
US6789238B2 (en) * 2002-07-02 2004-09-07 Texas Instruments Incorporated System and method to improve IC fabrication through selective fusing
JP4364515B2 (ja) * 2003-01-09 2009-11-18 Ｏｋｉセミコンダクタ株式会社 ヒューズレイアウト，及びトリミング方法
US6806107B1 (en) * 2003-05-08 2004-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical fuse element test structure and method
US7300807B2 (en) * 2004-04-14 2007-11-27 International Business Machines Corporation Structure and method for providing precision passive elements
JP4723827B2 (ja) * 2004-08-04 2011-07-13 セイコーインスツル株式会社 抵抗回路
WO2006137392A1 (ja) * 2005-06-21 2006-12-28 Rohm Co., Ltd. チップ抵抗器およびその製造方法
EP1750309A3 (de) * 2005-08-03 2009-07-29 Samsung Electro-mechanics Co., Ltd Licht-emittierende Vorrichtung mit Schutzelement
US7701035B2 (en) * 2005-11-30 2010-04-20 International Business Machines Corporation Laser fuse structures for high power applications
CA2533225C (en) 2006-01-19 2016-03-22 Technologies Ltrim Inc. A tunable semiconductor component provided with a current barrier
TWI285068B (en) * 2006-03-24 2007-08-01 Ind Tech Res Inst An adjustable resistor embedded in a multi-layer substrate and method for forming the same
JP2008047556A (ja) * 2006-08-10 2008-02-28 Tokai Rika Co Ltd ラダー抵抗の調整パターン構造及びこれを有する電子部品
US7973552B2 (en) * 2007-12-04 2011-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. On-die terminators formed of coarse and fine resistors
WO2010035608A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN108389807A (zh) * 2012-11-26 2018-08-10 D3半导体有限公司 用于垂直半导体器件的精度提高的器件体系结构和方法
JP2017045839A (ja) * 2015-08-26 2017-03-02 ルネサスエレクトロニクス株式会社 半導体装置
JP6577410B2 (ja) * 2015-10-19 2019-09-18 株式会社東芝 半導体装置
US11101263B2 (en) 2018-08-31 2021-08-24 Texas Instruments Incorporated Resistor with exponential-weighted trim
US11056253B2 (en) 2019-03-18 2021-07-06 Qualcomm Incorporated Thin-film resistors with flexible terminal placement for area saving

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812478A (en) * 1971-07-31 1974-05-21 Nippon Musical Instruments Mfg Semiconductor storage device
US4016483A (en) * 1974-06-27 1977-04-05 Rudin Marvin B Microminiature integrated circuit impedance device including weighted elements and contactless switching means for fixing the impedance at a preselected value
US4150366A (en) * 1976-09-01 1979-04-17 Motorola, Inc. Trim network for monolithic circuits and use in trimming a d/a converter
US4201970A (en) * 1978-08-07 1980-05-06 Rca Corporation Method and apparatus for trimming resistors
JPS58112343A (ja) * 1981-12-26 1983-07-04 Olympus Optical Co Ltd 半導体装置およびその製造方法
US4775884A (en) * 1984-08-03 1988-10-04 Linear Technology Corporation Integrated circuit having permanent adjustment circuitry which requires low adjustment current
JPS6144454A (ja) * 1984-08-09 1986-03-04 Fujitsu Ltd 半導体装置
US4870472A (en) * 1984-10-18 1989-09-26 Motorola, Inc. Method for resistor trimming by metal migration
US4792779A (en) * 1986-09-19 1988-12-20 Hughes Aircraft Company Trimming passive components buried in multilayer structures
JPS63140550A (ja) * 1986-12-01 1988-06-13 Mitsubishi Electric Corp 冗長回路用電気ヒユ−ズ
JPH01199404A (ja) * 1988-02-04 1989-08-10 Toshiba Corp トリミング抵抗回路網
JPH02298049A (ja) * 1989-05-12 1990-12-10 Nec Corp 半導体集積回路

Also Published As

Publication number Publication date
EP0450648B1 (de) 1995-07-05
JPH03289168A (ja) 1991-12-19
EP0450648A1 (de) 1991-10-09
DE69110939T2 (de) 1995-12-21
JP2664793B2 (ja) 1997-10-22
US5493148A (en) 1996-02-20
KR950013898B1 (ko) 1995-11-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee