DE69110923D1 - Verfahren zur mechanischen Abhebung einer Metallschicht auf einem Polymer. - Google Patents

Verfahren zur mechanischen Abhebung einer Metallschicht auf einem Polymer.

Info

Publication number
DE69110923D1
DE69110923D1 DE69110923T DE69110923T DE69110923D1 DE 69110923 D1 DE69110923 D1 DE 69110923D1 DE 69110923 T DE69110923 T DE 69110923T DE 69110923 T DE69110923 T DE 69110923T DE 69110923 D1 DE69110923 D1 DE 69110923D1
Authority
DE
Germany
Prior art keywords
polymer
metal layer
mechanically lifting
mechanically
lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69110923T
Other languages
English (en)
Other versions
DE69110923T2 (de
Inventor
Andre Shiltz
Jean Palleau
Joaquim Torres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orange SA
Original Assignee
France Telecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Telecom SA filed Critical France Telecom SA
Application granted granted Critical
Publication of DE69110923D1 publication Critical patent/DE69110923D1/de
Publication of DE69110923T2 publication Critical patent/DE69110923T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/7688—Filling of holes, grooves or trenches, e.g. vias, with conductive material by deposition over sacrificial masking layer, e.g. lift-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
DE1991610923 1990-02-23 1991-02-19 Verfahren zur mechanischen Abhebung einer Metallschicht auf einem Polymer. Expired - Fee Related DE69110923T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9002690A FR2658976A1 (fr) 1990-02-23 1990-02-23 Procede de lift-off (enlevement d'une couche par decollement d'une couche sous-jacente) mecanique.

Publications (2)

Publication Number Publication Date
DE69110923D1 true DE69110923D1 (de) 1995-08-10
DE69110923T2 DE69110923T2 (de) 1996-03-21

Family

ID=9394345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991610923 Expired - Fee Related DE69110923T2 (de) 1990-02-23 1991-02-19 Verfahren zur mechanischen Abhebung einer Metallschicht auf einem Polymer.

Country Status (4)

Country Link
EP (1) EP0443967B1 (de)
JP (1) JPH04215435A (de)
DE (1) DE69110923T2 (de)
FR (1) FR2658976A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102013283B1 (ko) * 2017-12-05 2019-08-22 재단법인 오송첨단의료산업진흥재단 열팽창 계수를 이용한 박막전극 분리 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004044A (en) * 1975-05-09 1977-01-18 International Business Machines Corporation Method for forming patterned films utilizing a transparent lift-off mask
JPS5621332A (en) * 1979-07-31 1981-02-27 Fujitsu Ltd Manufacture of semiconductor device
US4448636A (en) * 1982-06-02 1984-05-15 Texas Instruments Incorporated Laser assisted lift-off
JPS59107354A (ja) * 1982-12-11 1984-06-21 Nitto Electric Ind Co Ltd フオトレジストの剥離方法
US4662989A (en) * 1985-10-04 1987-05-05 Honeywell Inc. High efficiency metal lift-off process
US4871651A (en) * 1988-06-27 1989-10-03 Ford Motor Copmpany Cryogenic process for metal lift-off

Also Published As

Publication number Publication date
EP0443967A1 (de) 1991-08-28
FR2658976A1 (fr) 1991-08-30
DE69110923T2 (de) 1996-03-21
JPH04215435A (ja) 1992-08-06
EP0443967B1 (de) 1995-07-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee