DE69108605D1 - Herstellungsverfahren einer integrierten Halbleiter-Lichtleiter-Lichtdetektor-Struktur. - Google Patents

Herstellungsverfahren einer integrierten Halbleiter-Lichtleiter-Lichtdetektor-Struktur.

Info

Publication number
DE69108605D1
DE69108605D1 DE69108605T DE69108605T DE69108605D1 DE 69108605 D1 DE69108605 D1 DE 69108605D1 DE 69108605 T DE69108605 T DE 69108605T DE 69108605 T DE69108605 T DE 69108605T DE 69108605 D1 DE69108605 D1 DE 69108605D1
Authority
DE
Germany
Prior art keywords
manufacturing process
integrated semiconductor
detector structure
light guide
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69108605T
Other languages
English (en)
Other versions
DE69108605T2 (de
Inventor
Louis Menigaux
Alain Carenco
Andre Scavennec
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orange SA
Original Assignee
France Telecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Telecom SA filed Critical France Telecom SA
Publication of DE69108605D1 publication Critical patent/DE69108605D1/de
Application granted granted Critical
Publication of DE69108605T2 publication Critical patent/DE69108605T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02327Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166Manufacturing methods
    • G02B2006/12195Tapering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/918Single-crystal waveguide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/065Gp III-V generic compounds-processing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE69108605T 1990-05-21 1991-05-17 Herstellungsverfahren einer integrierten Halbleiter-Lichtleiter-Lichtdetektor-Struktur. Expired - Fee Related DE69108605T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9006317A FR2662304B1 (fr) 1990-05-21 1990-05-21 Procede de fabrication d'une structure integree guide-detecteur de lumiere en materiau semi-conducteur.

Publications (2)

Publication Number Publication Date
DE69108605D1 true DE69108605D1 (de) 1995-05-11
DE69108605T2 DE69108605T2 (de) 1995-11-09

Family

ID=9396798

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69108605T Expired - Fee Related DE69108605T2 (de) 1990-05-21 1991-05-17 Herstellungsverfahren einer integrierten Halbleiter-Lichtleiter-Lichtdetektor-Struktur.

Country Status (5)

Country Link
US (1) US5190883A (de)
EP (1) EP0458688B1 (de)
JP (1) JP3010389B2 (de)
DE (1) DE69108605T2 (de)
FR (1) FR2662304B1 (de)

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US5652435A (en) * 1995-09-01 1997-07-29 The United States Of America As Represented By The Secretary Of The Air Force Vertical structure schottky diode optical detector
US6931003B2 (en) * 2000-02-09 2005-08-16 Bookline Flolmstead Llc Packet prioritization protocol for a large-scale, high speed computer network
JP2003152216A (ja) * 2001-11-16 2003-05-23 Anritsu Corp 半導体受光素子
US7043106B2 (en) * 2002-07-22 2006-05-09 Applied Materials, Inc. Optical ready wafers
US7110629B2 (en) * 2002-07-22 2006-09-19 Applied Materials, Inc. Optical ready substrates
US7072534B2 (en) * 2002-07-22 2006-07-04 Applied Materials, Inc. Optical ready substrates
EP1627249A4 (de) * 2003-05-29 2007-05-09 Applied Materials Inc Serielles routen von optischen signalen
EP1649566A4 (de) * 2003-06-27 2007-08-15 Applied Materials Inc Gepulstes quanten-dot-lasersystem mit niedrigem jitter
US20050016446A1 (en) 2003-07-23 2005-01-27 Abbott John S. CaF2 lenses with reduced birefringence
US20060222024A1 (en) * 2005-03-15 2006-10-05 Gray Allen L Mode-locked semiconductor lasers with quantum-confined active region
US20060227825A1 (en) * 2005-04-07 2006-10-12 Nl-Nanosemiconductor Gmbh Mode-locked quantum dot laser with controllable gain properties by multiple stacking
WO2007027615A1 (en) * 2005-09-01 2007-03-08 Applied Materials, Inc. Ridge technique for fabricating an optical detector and an optical waveguide
US8411711B2 (en) * 2005-12-07 2013-04-02 Innolume Gmbh Semiconductor laser with low relative intensity noise of individual longitudinal modes and optical transmission system incorporating the laser
WO2007065614A2 (en) * 2005-12-07 2007-06-14 Innolume Gmbh Laser source with broadband spectrum emission
US7835408B2 (en) * 2005-12-07 2010-11-16 Innolume Gmbh Optical transmission system
US7561607B2 (en) * 2005-12-07 2009-07-14 Innolume Gmbh Laser source with broadband spectrum emission
US8630326B2 (en) 2009-10-13 2014-01-14 Skorpios Technologies, Inc. Method and system of heterogeneous substrate bonding for photonic integration
US8867578B2 (en) 2009-10-13 2014-10-21 Skorpios Technologies, Inc. Method and system for hybrid integration of a tunable laser for a cable TV transmitter
US9882073B2 (en) 2013-10-09 2018-01-30 Skorpios Technologies, Inc. Structures for bonding a direct-bandgap chip to a silicon photonic device
US8611388B2 (en) * 2009-10-13 2013-12-17 Skorpios Technologies, Inc. Method and system for heterogeneous substrate bonding of waveguide receivers
US8615025B2 (en) * 2009-10-13 2013-12-24 Skorpios Technologies, Inc. Method and system for hybrid integration of a tunable laser
US9316785B2 (en) 2013-10-09 2016-04-19 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
US8559470B2 (en) 2009-10-13 2013-10-15 Skorpios Technologies, Inc. Method and system for hybrid integration of a tunable laser and a phase modulator
US8605766B2 (en) 2009-10-13 2013-12-10 Skorpios Technologies, Inc. Method and system for hybrid integration of a tunable laser and a mach zehnder modulator
US11181688B2 (en) 2009-10-13 2021-11-23 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
US9922967B2 (en) 2010-12-08 2018-03-20 Skorpios Technologies, Inc. Multilevel template assisted wafer bonding
US9885832B2 (en) 2014-05-27 2018-02-06 Skorpios Technologies, Inc. Waveguide mode expander using amorphous silicon
US9977188B2 (en) 2011-08-30 2018-05-22 Skorpios Technologies, Inc. Integrated photonics mode expander
JP6318468B2 (ja) * 2013-05-01 2018-05-09 富士通株式会社 導波路型半導体受光装置及びその製造方法
US9664855B2 (en) 2014-03-07 2017-05-30 Skorpios Technologies, Inc. Wide shoulder, high order mode filter for thick-silicon waveguides
US10003173B2 (en) 2014-04-23 2018-06-19 Skorpios Technologies, Inc. Widely tunable laser control
WO2016172202A1 (en) 2015-04-20 2016-10-27 Skorpios Technologies, Inc. Vertical output couplers for photonic devices
JP2020513716A (ja) * 2016-11-10 2020-05-14 コプシス・ソチエタ・ア・レスポンサビリタ・リミタータQOpSyS S.r.l. フォトニック共振モータ
US10649148B2 (en) 2017-10-25 2020-05-12 Skorpios Technologies, Inc. Multistage spot size converter in silicon photonics
US11360263B2 (en) 2019-01-31 2022-06-14 Skorpios Technologies. Inc. Self-aligned spot size converter

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701008A (en) * 1984-08-10 1987-10-20 Motorola, Inc. Optical waveguide including superstrate of niobium or silicon oxynitride and method of making same
JPS6254991A (ja) * 1985-09-04 1987-03-10 Hitachi Ltd 半導体レ−ザ装置
FR2588701B1 (fr) * 1985-10-14 1988-12-30 Bouadma Noureddine Procede de realisation d'une structure integree laser-photodetecteur
JPS62169389A (ja) * 1986-01-21 1987-07-25 Sharp Corp 半導体レ−ザアレイ装置
JPS6410986A (en) * 1986-06-30 1989-01-13 Takeda Chemical Industries Ltd Production of lysozyme
JP2587628B2 (ja) * 1987-01-29 1997-03-05 国際電信電話株式会社 半導体集積発光素子
JPH02179626A (ja) * 1988-12-29 1990-07-12 Sharp Corp 光波長変換装置
FR2647967B1 (fr) * 1989-06-06 1991-08-16 Thomson Csf Dispositif optoelectronique sur substrat semi-isolant et procede de realisation d'un tel dispositif
US4944838A (en) * 1989-08-03 1990-07-31 At&T Bell Laboratories Method of making tapered semiconductor waveguides

Also Published As

Publication number Publication date
US5190883A (en) 1993-03-02
EP0458688A1 (de) 1991-11-27
JPH04252079A (ja) 1992-09-08
EP0458688B1 (de) 1995-04-05
DE69108605T2 (de) 1995-11-09
JP3010389B2 (ja) 2000-02-21
FR2662304B1 (fr) 1992-07-24
FR2662304A1 (fr) 1991-11-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee