DE69032666T2 - Eingekapselter piezoelektrischer Resonator - Google Patents

Eingekapselter piezoelektrischer Resonator

Info

Publication number
DE69032666T2
DE69032666T2 DE69032666T DE69032666T DE69032666T2 DE 69032666 T2 DE69032666 T2 DE 69032666T2 DE 69032666 T DE69032666 T DE 69032666T DE 69032666 T DE69032666 T DE 69032666T DE 69032666 T2 DE69032666 T2 DE 69032666T2
Authority
DE
Germany
Prior art keywords
piezoelectric resonator
encapsulated piezoelectric
encapsulated
resonator
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032666T
Other languages
English (en)
Other versions
DE69032666D1 (de
Inventor
Takao Morita
Osamu Ishii
Takebumi Kurosaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Toyo Communication Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02993690A external-priority patent/JP3221609B2/ja
Priority claimed from JP2040827A external-priority patent/JPH03243008A/ja
Priority claimed from JP2136136A external-priority patent/JPH0435106A/ja
Priority claimed from JP2232655A external-priority patent/JPH04117014A/ja
Application filed by Toyo Communication Equipment Co Ltd filed Critical Toyo Communication Equipment Co Ltd
Application granted granted Critical
Publication of DE69032666D1 publication Critical patent/DE69032666D1/de
Publication of DE69032666T2 publication Critical patent/DE69032666T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/174—Membranes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0528—Holders; Supports for bulk acoustic wave devices consisting of clips
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE69032666T 1990-02-09 1990-11-22 Eingekapselter piezoelektrischer Resonator Expired - Fee Related DE69032666T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP02993690A JP3221609B2 (ja) 1990-02-09 1990-02-09 超薄板圧電共振子の固定部構造
JP2040827A JPH03243008A (ja) 1990-02-21 1990-02-21 超薄板水晶共振子の固定方法
JP2136136A JPH0435106A (ja) 1990-05-25 1990-05-25 超薄板圧電共振子の電極リード接続構造
JP2232655A JPH04117014A (ja) 1990-09-03 1990-09-03 超薄板圧電共振子のパッケージング構造

Publications (2)

Publication Number Publication Date
DE69032666D1 DE69032666D1 (de) 1998-10-22
DE69032666T2 true DE69032666T2 (de) 1999-03-11

Family

ID=27459146

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69029086T Expired - Fee Related DE69029086T2 (de) 1990-02-09 1990-11-22 Struktur zur Festhaltung in einem Modül eines flachen ultradünnen piezoelektrischen Resonators
DE69032666T Expired - Fee Related DE69032666T2 (de) 1990-02-09 1990-11-22 Eingekapselter piezoelektrischer Resonator

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69029086T Expired - Fee Related DE69029086T2 (de) 1990-02-09 1990-11-22 Struktur zur Festhaltung in einem Modül eines flachen ultradünnen piezoelektrischen Resonators

Country Status (4)

Country Link
US (1) US5185550A (de)
EP (3) EP0468052B1 (de)
DE (2) DE69029086T2 (de)
WO (1) WO1991012663A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0435108A (ja) * 1990-05-25 1992-02-05 Toyo Commun Equip Co Ltd 超薄板多重モード水晶フィルタ素子
JP2562661Y2 (ja) * 1992-10-13 1998-02-16 株式会社村田製作所 圧電素子の実装構造
US5506463A (en) * 1993-08-23 1996-04-09 Rohm Co., Ltd. Packaged piezoelectric oscillator and method of making the same
JPH09246904A (ja) * 1996-03-14 1997-09-19 Citizen Watch Co Ltd 表面実装型水晶振動子
WO1998000864A1 (de) * 1996-06-28 1998-01-08 Siemens Aktiengesellschaft Bauelementgehäuse für eine oberflächenmontage eines halbleiter-bauelementes
IT1286162B1 (it) * 1996-07-11 1998-07-07 Fiat Ricerche Attuatore-trasduttore piezoelettrico per sistemi di fonoriproduzione.
JP3505997B2 (ja) * 1998-03-20 2004-03-15 アイシン・エィ・ダブリュ株式会社 電子制御ユニット
JP2933608B1 (ja) * 1998-05-14 1999-08-16 新潟日本電気株式会社 インクジェットヘッド及びその製造方法
US6249049B1 (en) * 1998-06-12 2001-06-19 Nec Corporation Ceramic package type electronic part which is high in connection strength to electrode
JP4136221B2 (ja) * 1999-09-09 2008-08-20 本田技研工業株式会社 スピーカ内蔵ヘルメットおよびヘルメット用スピーカ
US6426565B1 (en) 2000-03-22 2002-07-30 International Business Machines Corporation Electronic package and method of making same
US6395998B1 (en) 2000-09-13 2002-05-28 International Business Machines Corporation Electronic package having an adhesive retaining cavity
US7568377B2 (en) * 2005-07-28 2009-08-04 University Of South Florida High frequency thickness shear mode acoustic wave sensor for gas and organic vapor detection
JP2012502824A (ja) * 2008-09-18 2012-02-02 フジフィルム ディマティックス， インコーポレイテッド 溝を設けたシリコン基板との接着
JP4737726B2 (ja) * 2009-05-01 2011-08-03 セイコーエプソン株式会社 振動子、振動子アレイ、及び電子機器
CN102074647B (zh) * 2009-11-19 2013-09-18 金威贸易有限公司 压电组件封装装置
TW201251157A (en) 2011-06-03 2012-12-16 Seiko Epson Corp Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric vibrator, electronic device, and electronic apparatus
CN102957394B (zh) 2011-08-18 2016-12-21 精工爱普生株式会社 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法
US8970316B2 (en) 2011-08-19 2015-03-03 Seiko Epson Corporation Resonating element, resonator, electronic device, electronic apparatus, and mobile object
US9881861B2 (en) * 2014-05-28 2018-01-30 Ngk Spark Plug Co., Ltd. Wiring substrate
KR102595896B1 (ko) * 2016-08-08 2023-10-30 삼성전자 주식회사 인쇄회로기판 및 이를 가지는 반도체 패키지
CN114884478A (zh) * 2022-07-01 2022-08-09 成都泰美克晶体技术有限公司 一种光刻石英晶片及其电极的设计方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694677A (en) * 1971-03-03 1972-09-26 Us Army Vhf-uhf piezoelectric resonators
JPS5240092A (en) * 1975-09-26 1977-03-28 Seiko Instr & Electronics Ltd Structure of container for quarts crystal oscillator
SU580621A1 (ru) * 1976-06-25 1977-11-15 Предприятие П/Я Х-5332 Герметичный пьезоэлектрический резонатор
JPS5312292A (en) * 1976-07-21 1978-02-03 Seiko Instr & Electronics Ltd Thickness slide crystal vibrator
JPS54107293A (en) * 1978-02-10 1979-08-22 Nec Corp Crystal oscillator
SU705642A1 (ru) * 1978-07-06 1979-12-25 Предприятие П/Я Х-5332 Кварцевый резонатор
JPS57176820A (en) * 1981-04-24 1982-10-30 Toyo Commun Equip Co Ltd Flat type piezoelectric device
FR2527865A1 (fr) * 1982-06-01 1983-12-02 Cepe Resonateur piezo-electrique a haute frequence et son procede de fabrication
US4430596A (en) * 1982-08-16 1984-02-07 Motorola, Inc. Temperature insensitive piezoelectric crystal mounting arrangement
GB2146839B (en) * 1983-07-27 1987-04-01 Nihon Dempa Kogyo Co Piezoelectric resonator
JPS60105309A (ja) * 1983-11-11 1985-06-10 Murata Mfg Co Ltd 圧電振動部品
JPS60145715A (ja) * 1984-01-09 1985-08-01 Nippon Telegr & Teleph Corp <Ntt> 圧電共振子形成用基板の製造方法
FR2562352B1 (fr) * 1984-03-30 1989-10-20 Cepe Resonateur piezo-electrique
US4845397A (en) * 1984-12-19 1989-07-04 Tektronix, Inc. Constraining mount system for surface acoustic wave devices
JPS62108607A (ja) * 1985-11-06 1987-05-19 Murata Mfg Co Ltd 圧電部品

Also Published As

Publication number Publication date
EP0468052B1 (de) 1996-11-06
DE69029086T2 (de) 1997-03-06
EP0641073B1 (de) 1998-09-16
EP0644653A3 (de) 1995-04-12
EP0468052A1 (de) 1992-01-29
US5185550A (en) 1993-02-09
EP0644653A2 (de) 1995-03-22
EP0641073A3 (de) 1995-04-26
DE69029086D1 (de) 1996-12-12
EP0468052A4 (en) 1992-05-06
DE69032666D1 (de) 1998-10-22
WO1991012663A1 (en) 1991-08-22
EP0641073A2 (de) 1995-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PATENTANWAELTE KNOBLAUCH UND KNOBLAUCH, 60322 FRANK

8327 Change in the person/name/address of the patent owner

Owner name: EPSON TOYOCOM CORP., HINO, TOKYO, JP

8339 Ceased/non-payment of the annual fee