DE69032089D1 - Kupfer-Aetzverfahren mit Hilfe von Haliden - Google Patents
Kupfer-Aetzverfahren mit Hilfe von HalidenInfo
- Publication number
- DE69032089D1 DE69032089D1 DE69032089T DE69032089T DE69032089D1 DE 69032089 D1 DE69032089 D1 DE 69032089D1 DE 69032089 T DE69032089 T DE 69032089T DE 69032089 T DE69032089 T DE 69032089T DE 69032089 D1 DE69032089 D1 DE 69032089D1
- Authority
- DE
- Germany
- Prior art keywords
- halides
- etching process
- copper etching
- copper
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 150000004820 halides Chemical class 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
- C23F4/02—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 by evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45354989A | 1989-12-20 | 1989-12-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69032089D1 true DE69032089D1 (de) | 1998-04-09 |
DE69032089T2 DE69032089T2 (de) | 1998-06-25 |
Family
ID=23801003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69032089T Expired - Fee Related DE69032089T2 (de) | 1989-12-20 | 1990-12-18 | Kupfer-Aetzverfahren mit Hilfe von Haliden |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0433983B1 (de) |
JP (1) | JP3105547B2 (de) |
KR (1) | KR100221992B1 (de) |
CN (1) | CN1025508C (de) |
DE (1) | DE69032089T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX9305898A (es) * | 1992-10-30 | 1995-01-31 | Texas Instruments Inc | Metodo de grabado fotoquimico anisotropico para la fabricacion decircuitos integrados. |
JPH06326059A (ja) * | 1993-05-17 | 1994-11-25 | Fujitsu Ltd | 銅薄膜のエッチング方法 |
JP2793472B2 (ja) * | 1993-06-24 | 1998-09-03 | 日本電気株式会社 | 銅微細加工方法および銅微細加工装置 |
JPH0729908A (ja) * | 1993-07-15 | 1995-01-31 | Nec Corp | 銅微細配線の形成方法 |
EP2428516A1 (de) | 2003-11-19 | 2012-03-14 | Metabasis Therapeutics, Inc. | Neue Phosphor enthaltende Thyromimetika |
US8969514B2 (en) | 2007-06-04 | 2015-03-03 | Synergy Pharmaceuticals, Inc. | Agonists of guanylate cyclase useful for the treatment of hypercholesterolemia, atherosclerosis, coronary heart disease, gallstone, obesity and other cardiovascular diseases |
ES2393885T7 (es) | 2007-06-04 | 2014-01-30 | Synergy Pharmaceuticals Inc. | Agonistas de la guanilato ciclasa útiles para el tratamiento de trastornos gastrointestinales, inflamación, cáncer y otros trastornos |
ES2522968T3 (es) | 2008-06-04 | 2014-11-19 | Synergy Pharmaceuticals Inc. | Agonistas de guanilato ciclasa útiles para el tratamiento de trastornos gastrointestinales, inflamación, cáncer y otros trastornos |
AU2009270833B2 (en) | 2008-07-16 | 2015-02-19 | Bausch Health Ireland Limited | Agonists of guanylate cyclase useful for the treatment of gastrointestinal, inflammation, cancer and other disorders |
WO2010093601A1 (en) | 2009-02-10 | 2010-08-19 | Metabasis Therapeutics, Inc. | Novel sulfonic acid-containing thyromimetics, and methods for their use |
US9616097B2 (en) | 2010-09-15 | 2017-04-11 | Synergy Pharmaceuticals, Inc. | Formulations of guanylate cyclase C agonists and methods of use |
CA2905435A1 (en) | 2013-03-15 | 2014-09-25 | Synergy Pharmaceuticals Inc. | Compositions useful for the treatment of gastrointestinal disorders |
JP2016514671A (ja) | 2013-03-15 | 2016-05-23 | シナジー ファーマシューティカルズ インコーポレイテッド | グアニル酸シクラーゼのアゴニストおよびその使用 |
US10011637B2 (en) | 2013-06-05 | 2018-07-03 | Synergy Pharmaceuticals, Inc. | Ultra-pure agonists of guanylate cyclase C, method of making and using same |
ES2847904T3 (es) | 2013-07-23 | 2021-08-04 | Daiichi Sankyo Co Ltd | Medicamento para la prevención o el tratamiento de la hipertensión |
US9257638B2 (en) * | 2014-03-27 | 2016-02-09 | Lam Research Corporation | Method to etch non-volatile metal materials |
CA3015964C (en) | 2016-03-24 | 2021-08-03 | Daiichi Sankyo Company, Limited | Medicine for treating renal disease |
US10177002B2 (en) * | 2016-04-29 | 2019-01-08 | Applied Materials, Inc. | Methods for chemical etching of silicon |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6175529A (ja) * | 1984-09-21 | 1986-04-17 | Toshiba Corp | ドライエツチング方法及び装置 |
US4622095A (en) * | 1985-10-18 | 1986-11-11 | Ibm Corporation | Laser stimulated halogen gas etching of metal substrates |
JPH01215986A (ja) * | 1988-02-24 | 1989-08-29 | Hitachi Ltd | ドライエッチング方法 |
-
1990
- 1990-12-18 DE DE69032089T patent/DE69032089T2/de not_active Expired - Fee Related
- 1990-12-18 EP EP90124588A patent/EP0433983B1/de not_active Expired - Lifetime
- 1990-12-19 KR KR1019900021074A patent/KR100221992B1/ko not_active IP Right Cessation
- 1990-12-20 JP JP02404457A patent/JP3105547B2/ja not_active Expired - Fee Related
- 1990-12-20 CN CN90110066A patent/CN1025508C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH04159718A (ja) | 1992-06-02 |
EP0433983A3 (en) | 1993-02-24 |
EP0433983A2 (de) | 1991-06-26 |
KR100221992B1 (ko) | 1999-09-15 |
JP3105547B2 (ja) | 2000-11-06 |
CN1052706A (zh) | 1991-07-03 |
DE69032089T2 (de) | 1998-06-25 |
CN1025508C (zh) | 1994-07-20 |
EP0433983B1 (de) | 1998-03-04 |
KR910013442A (ko) | 1991-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69032089D1 (de) | Kupfer-Aetzverfahren mit Hilfe von Haliden | |
IT8822340A0 (it) | Emporio elettronico. | |
DE69033724T2 (de) | Plazierungsoptimierungssystem mit Hilfe von CAD | |
BR8904957A (pt) | Istema conector | |
DE3581295D1 (de) | Plasma-aetzverfahren. | |
DE69032706T2 (de) | Prozesskolonne | |
DE69028650D1 (de) | Plasma-Ätzmethode | |
DE69001292D1 (de) | Ueberzugsverfahren. | |
DE69026431D1 (de) | Siebdruckverfahren | |
DE69028929D1 (de) | Bildempfangs-Substrat | |
DE69009259D1 (de) | Verfahren zum Zusammensetzen von Halbleiteranordnungen. | |
FI900684A0 (fi) | Process foer framstaellning av polyaluminiumfoereningar. | |
DE69001914D1 (de) | Kommutierende schaltung. | |
FI903063A0 (fi) | Bestrykningsanordning. | |
FI872540A (fi) | Elektrisk glassmaeltmetod. | |
FI902711A0 (fi) | Bestrykningsanordning. | |
DE69033920D1 (de) | Bildherstellungsverfahren | |
FI920196A0 (fi) | Miljoevaenligare process foer blekning av lignocellulosamaterial. | |
FR2618008B1 (fr) | Ecran polychrome | |
DE3789990D1 (de) | Elektronisches Druckverfahren. | |
DE3676715D1 (de) | Photolackentfern-verfahren. | |
IT1196420B (it) | Copolimeri a blocchi a base di pivalolattone e processo per la loro preparazione | |
IT9020623A0 (it) | procedimento | |
DE3650049D1 (de) | Lötverfahren. | |
DE69025128D1 (de) | Magnetrone |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |