DE69030836D1 - Material und Verfahren zur Herstellung von Mikromustern - Google Patents

Material und Verfahren zur Herstellung von Mikromustern

Info

Publication number
DE69030836D1
DE69030836D1 DE69030836T DE69030836T DE69030836D1 DE 69030836 D1 DE69030836 D1 DE 69030836D1 DE 69030836 T DE69030836 T DE 69030836T DE 69030836 T DE69030836 T DE 69030836T DE 69030836 D1 DE69030836 D1 DE 69030836D1
Authority
DE
Germany
Prior art keywords
patterns
micro
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69030836T
Other languages
English (en)
Other versions
DE69030836T2 (de
Inventor
Tadayoshi Kokubo
Kazuya Uenishi
Shiro Tan
Wataru Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of DE69030836D1 publication Critical patent/DE69030836D1/de
Application granted granted Critical
Publication of DE69030836T2 publication Critical patent/DE69030836T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
DE69030836T 1989-03-29 1990-03-29 Material und Verfahren zur Herstellung von Mikromustern Expired - Fee Related DE69030836T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1077899A JP2645587B2 (ja) 1989-03-29 1989-03-29 微細パターン形成材料及び微細パターン形成方法

Publications (2)

Publication Number Publication Date
DE69030836D1 true DE69030836D1 (de) 1997-07-10
DE69030836T2 DE69030836T2 (de) 1997-09-18

Family

ID=13646924

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69030836T Expired - Fee Related DE69030836T2 (de) 1989-03-29 1990-03-29 Material und Verfahren zur Herstellung von Mikromustern

Country Status (4)

Country Link
US (1) US5380618A (de)
EP (1) EP0390173B1 (de)
JP (1) JP2645587B2 (de)
DE (1) DE69030836T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460548A (ja) * 1990-06-29 1992-02-26 Fuji Photo Film Co Ltd パターン形成用組成物及び微細パターン形成方法
JP2698282B2 (ja) * 1992-03-16 1998-01-19 パイオニア株式会社 光ディスク用フォトレジスト
US6280910B1 (en) 1992-11-23 2001-08-28 Pioneer Electronic Corporation Photoresist for optical disc and method of preparing optical disc utilizing photoresist
JP3434340B2 (ja) * 1994-03-29 2003-08-04 東京応化工業株式会社 高感度ポジ型ホトレジスト組成物
US5821345A (en) * 1996-03-12 1998-10-13 Shipley Company, L.L.C. Thermodynamically stable photoactive compound
US5919597A (en) * 1997-10-30 1999-07-06 Ibm Corporation Of Armonk Methods for preparing photoresist compositions
US6051358A (en) * 1997-11-04 2000-04-18 Shipley Company, L.L.C. Photoresist with novel photoactive compound
JP2002296772A (ja) * 2001-04-02 2002-10-09 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物
JP4112416B2 (ja) * 2003-04-04 2008-07-02 東京応化工業株式会社 吐出ノズル式塗布法用ポジ型ホトレジスト組成物及びレジストパターンの形成方法
JP2007069114A (ja) * 2005-09-06 2007-03-22 Daicel Chem Ind Ltd 薄膜の形成方法
US8088549B2 (en) * 2007-12-19 2012-01-03 Eastman Kodak Company Radiation-sensitive elements with developability-enhancing compounds
KR20100125448A (ko) * 2008-03-25 2010-11-30 어플라이드 머티어리얼스, 인코포레이티드 결정성 태양 전지들을 위한 표면 세정 및 텍스처링 프로세스

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666473A (en) * 1970-10-06 1972-05-30 Ibm Positive photoresists for projection exposure
US4377631A (en) * 1981-06-22 1983-03-22 Philip A. Hunt Chemical Corporation Positive novolak photoresist compositions
US4529682A (en) * 1981-06-22 1985-07-16 Philip A. Hunt Chemical Corporation Positive photoresist composition with cresol-formaldehyde novolak resins
JPS59142538A (ja) * 1983-02-04 1984-08-15 Tokyo Ohka Kogyo Co Ltd 感光性組成物
CA1255952A (en) * 1983-03-04 1989-06-20 Akihiro Furuta Positive type photoresist composition
JPS6161153A (ja) * 1984-09-03 1986-03-28 Oki Electric Ind Co Ltd ネガ型レジストのパタ−ン形成方法
US4626492A (en) * 1985-06-04 1986-12-02 Olin Hunt Specialty Products, Inc. Positive-working o-quinone diazide photoresist composition containing a dye and a trihydroxybenzophenone compound
DE3662952D1 (en) * 1985-08-12 1989-05-24 Hoechst Celanese Corp Process for obtaining negative images from positive photoresists
JPH0654389B2 (ja) * 1986-06-23 1994-07-20 日本合成ゴム株式会社 ポジ型感放射線性樹脂組成物
JPH0654388B2 (ja) * 1986-05-02 1994-07-20 東京応化工業株式会社 ポジ型ホトレジスト組成物
JPS62262043A (ja) * 1986-05-08 1987-11-14 Tokyo Ohka Kogyo Co Ltd ポジ型感光性樹脂組成物
JP2564485B2 (ja) * 1986-05-19 1996-12-18 住友化学工業株式会社 ポジ型フォトレジスト用クレゾールノボラック樹脂
JPH0721641B2 (ja) * 1986-06-18 1995-03-08 沖電気工業株式会社 ネガ型レジストパターン形成方法
JPH0814696B2 (ja) * 1987-09-17 1996-02-14 富士写真フイルム株式会社 感光性樹脂組成物
JP2706978B2 (ja) * 1988-05-07 1998-01-28 住友化学工業株式会社 ポジ型レジスト組成物
US4959292A (en) * 1988-07-11 1990-09-25 Olin Hunt Specialty Products Inc. Light-sensitive o-quinone diazide composition and product with phenolic novolak prepared by condensation with haloacetoaldehyde
US4943511A (en) * 1988-08-05 1990-07-24 Morton Thiokol, Inc. High sensitivity mid and deep UV resist
WO1990001726A1 (en) * 1988-08-10 1990-02-22 Macdermid, Incorporated Light-sensitive novolac resins
JP2623778B2 (ja) * 1988-10-18 1997-06-25 日本合成ゴム株式会社 感放射線性樹脂組成物
US4965167A (en) * 1988-11-10 1990-10-23 Olin Hunt Specialty Products, Inc. Positive-working photoresist employing a selected mixture of ethyl lactate and ethyl 3-ethoxy propionate as casting solvent
US4957846A (en) * 1988-12-27 1990-09-18 Olin Hunt Specialty Products Inc. Radiation sensitive compound and mixtures with trinuclear novolak oligomer with o-naphthoquinone diazide sulfonyl group

Also Published As

Publication number Publication date
JP2645587B2 (ja) 1997-08-25
JPH02254451A (ja) 1990-10-15
US5380618A (en) 1995-01-10
DE69030836T2 (de) 1997-09-18
EP0390173B1 (de) 1997-06-04
EP0390173A2 (de) 1990-10-03
EP0390173A3 (de) 1991-10-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee