DE69026072T2 - Anschlussrahmen für Harz-Halbleiterverpackungen - Google Patents

Anschlussrahmen für Harz-Halbleiterverpackungen

Info

Publication number
DE69026072T2
DE69026072T2 DE69026072T DE69026072T DE69026072T2 DE 69026072 T2 DE69026072 T2 DE 69026072T2 DE 69026072 T DE69026072 T DE 69026072T DE 69026072 T DE69026072 T DE 69026072T DE 69026072 T2 DE69026072 T2 DE 69026072T2
Authority
DE
Germany
Prior art keywords
semiconductor packaging
connection frames
resin semiconductor
resin
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69026072T
Other languages
English (en)
Other versions
DE69026072D1 (de
Inventor
Yasuyuki Nakamura
Shin Nemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neomax Co Ltd
Original Assignee
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2092553A external-priority patent/JPH03290956A/ja
Priority claimed from JP2092554A external-priority patent/JPH03290957A/ja
Application filed by Sumitomo Special Metals Co Ltd filed Critical Sumitomo Special Metals Co Ltd
Application granted granted Critical
Publication of DE69026072D1 publication Critical patent/DE69026072D1/de
Publication of DE69026072T2 publication Critical patent/DE69026072T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69026072T 1990-04-06 1990-09-10 Anschlussrahmen für Harz-Halbleiterverpackungen Expired - Lifetime DE69026072T2 (de)

Applications Claiming Priority (2)

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JP2092553A JPH03290956A (ja) 1990-04-06 1990-04-06 プラスチックスパッケージ用リードフレーム材料
JP2092554A JPH03290957A (ja) 1990-04-06 1990-04-06 プラスチックスパッケージ用リードフレーム材料

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DE69026072D1 DE69026072D1 (de) 1996-04-25
DE69026072T2 true DE69026072T2 (de) 1996-09-19

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CN101878566B (zh) * 2007-12-21 2012-02-29 三菱电机株式会社 激光光源模块
KR101028473B1 (ko) * 2009-03-26 2011-04-14 한국생산기술연구원 발광다이오드용 리드프레임 및 이를 제조하는 방법
EP3185291B1 (de) * 2015-12-21 2020-09-23 Nexperia B.V. Leitrahmen und verfahren zur herstellung eines leiterrahmens
DE102016110847B4 (de) * 2016-06-14 2022-02-17 Auto-Kabel Management Gmbh Leitungsintegrierter Schalter und Verfahren zum Herstellen eines leitungsintegrierten Schalters
CN113909494B (zh) * 2021-09-22 2023-10-31 寰采星科技(宁波)有限公司 用于金属掩膜板的金属箔材及金属掩膜板的制备方法

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US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料

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EP0450223B1 (de) 1996-03-20
KR940010910B1 (ko) 1994-11-19
KR910019189A (ko) 1991-11-30
EP0450223A1 (de) 1991-10-09
DE69026072D1 (de) 1996-04-25

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