CN113909494B - 用于金属掩膜板的金属箔材及金属掩膜板的制备方法 - Google Patents
用于金属掩膜板的金属箔材及金属掩膜板的制备方法 Download PDFInfo
- Publication number
- CN113909494B CN113909494B CN202111108320.5A CN202111108320A CN113909494B CN 113909494 B CN113909494 B CN 113909494B CN 202111108320 A CN202111108320 A CN 202111108320A CN 113909494 B CN113909494 B CN 113909494B
- Authority
- CN
- China
- Prior art keywords
- metal
- metal foil
- mask plate
- metal mask
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 187
- 239000002184 metal Substances 0.000 title claims abstract description 187
- 239000011888 foil Substances 0.000 title claims abstract description 102
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 29
- 230000008569 process Effects 0.000 claims abstract description 17
- 238000004372 laser cladding Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000005253 cladding Methods 0.000 claims abstract description 4
- 238000004804 winding Methods 0.000 claims abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 28
- 238000005520 cutting process Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000001039 wet etching Methods 0.000 claims description 8
- 238000005097 cold rolling Methods 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 239000011572 manganese Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 238000009432 framing Methods 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910000531 Co alloy Inorganic materials 0.000 abstract description 6
- WBWJXRJARNTNBL-UHFFFAOYSA-N [Fe].[Cr].[Co] Chemical compound [Fe].[Cr].[Co] WBWJXRJARNTNBL-UHFFFAOYSA-N 0.000 abstract description 6
- URQWOSCGQKPJCM-UHFFFAOYSA-N [Mn].[Fe].[Ni] Chemical compound [Mn].[Fe].[Ni] URQWOSCGQKPJCM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000010935 stainless steel Substances 0.000 abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 4
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 2
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 2
- 229910001069 Ti alloy Inorganic materials 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 33
- 229910045601 alloy Inorganic materials 0.000 description 27
- 239000000956 alloy Substances 0.000 description 27
- 229920001621 AMOLED Polymers 0.000 description 13
- 239000007789 gas Substances 0.000 description 10
- 238000005323 electroforming Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 238000002207 thermal evaporation Methods 0.000 description 4
- 229910000914 Mn alloy Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 229910000601 superalloy Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- YQCIWBXEVYWRCW-UHFFFAOYSA-N methane;sulfane Chemical compound C.S YQCIWBXEVYWRCW-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/64—Treatment of workpieces or articles after build-up by thermal means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
- C21D8/0205—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips of ferrous alloys
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
- C21D8/0221—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
- C21D8/0236—Cold rolling
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
- C21D8/0247—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the heat treatment
- C21D8/0268—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the heat treatment between cold rolling steps
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
- C22C38/105—Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/30—Ferrous alloys, e.g. steel alloys containing chromium with cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明公开了一种用于金属掩膜板的金属箔材的制备方法,其特征在于包括以下制备步骤:1)金属粉末配备:所述金属粉末为不锈钢、镍合金、钛合金、铝合金、铁镍合金、铁镍锰、铁镍钴合金、铁钴铬中的一种;2)激光熔敷:a、先铺设一层金属粉末在基板上;b、激光熔敷后在熔覆层上方再铺设一层金属粉末,再激光熔敷;重复b过程加工成厚度5μm~5mm的金属箔坯;每层金属粉末的铺设厚度为0.8~300μm,激光熔敷时所需激光能量为50~500W,激光能量密度为10~350J/mm3,扫描速度为50~5000mm/秒;3)第一次热处理:在干燥的惰性氛围或者还原氛围或者真空环境下对得到的金属箔坯进行热处理,然后将金属箔坯与基板分离、绕卷。
Description
技术领域
本发明属于金属制备技术领域,具体涉及一种用于金属掩膜板的金属箔材的制备方法、金属掩膜板的制备方法及经由它制造的有机发光二极管显示器件。
背景技术
OLED(Organic Light Emitting Diode)为有机发光二极管显示器,相对于液晶显示器具有重量巧、视角广、响应时间快、耐低温和发光效率高等优点,被视为下一代新型显示技术。一般采用真空蒸镀技术制备有机电致发光薄膜,即在真空环境中加热有机半导体材料,材料受热升华,通过具有特殊子画素图案的金属掩膜板在基板表面形成具有所设计形状的有机薄膜器件叠构,经历多种材料的连续沉积成膜,加上在叠构的两端各镀上阳极及阴极,即可形成具有多层薄膜的OLED发光器件结构。
蒸镀过程中,需要使用共通层金属掩模板(Clear Metal Mask,CMM)和精密金属掩膜板,使用精密型金属掩膜板(Fine Metal Mask,FMM)沉积OLED器件的发光层。目前精密型金属掩膜板有三种制作方法:1.蚀刻法精密掩膜板;2.电铸法精密掩膜板;3.不需张网的混合型精密掩膜板。
蚀刻法精密金属掩膜板(Fine Metal Mask,FMM)目前使用最为广泛,蚀刻法金属掩膜板是采用熔炼之后的金属板材,经过多段的传统热压延、热处理、冷压延到所需的厚度、热处理而制成的超薄金属薄片,通常为铁镍合金,厚度在20~100μm间。薄金属箔片经历半导体制成的黄光(photolithography)、湿式蚀刻(wet etching),在超薄金属箔片形成众多的微孔图案,对应于所需AMOLED(Active Matrix Organic Light Emitting Diode)显示器中的发光子画素的OLED发光器件的设计。在熔炼,热锻及多道热压延,热处理,冷压延,热处理的制程工序里,许多的杂质及污染物会产生并含在材料中而造成在精密掩模板制造时的问题及良率损失。所以此方法受限于所使用原材料的洁净度及最终多道压延工序制成的金属箔材的品质,厚度与蚀刻精度,目前可达到解析度400~500ppi左右,但生产良率常不高。生产用的大尺寸精密金属掩膜板是以条状的蚀刻后的掩膜板条,精密张网对位后,焊接在网框上,再裁切掉多余的部分而成。由多条拼成所需要的大尺寸的精密掩膜板,然后置入热蒸镀机内与要被蒸镀的驱动基板叠合,对位,固定后当成形成子像素器件图案的荫罩使用,来制成AMOLED显示器。目前由此方法制成的最大的量产用精密金属掩膜版用拼接多片蚀刻掩膜板条而成,尺寸可达1500mm×925mm(即第六代半板,G6H,的尺寸),是目前量产用精密金属掩模板的主要方式。
电铸法(Electroforming)精密金属掩膜板,在含化学药液的电镀槽中利用金属片通电后,在金属基板(例如不锈钢薄片)表面上逐渐生长出来具有所需数十微米(μm)微孔图形结构的金属镀层的一种技术,生长成的金属镀层材质为镍钴合金为主。目前电铸法只可以制作小尺寸,然后在精密张网后,焊接框上,再以拼接的方式做成所需要的大尺寸精密金属掩膜板。目前单片尺寸最大可达730mm×920mm左右。此法的优点是设备投资及制作成本较低,金属箔材的厚度可以低于20μm,所以可能用于较高解析度的AMOLED子画素的制作。理论上,电铸法可做精密度达700~800ppi的掩膜板供AMOLED图型化热蒸镀用,但是此方法有下列的缺点。
第一:由此法可制作的金属箔材的组成受限于可用于电镀液配方的化学品的选择。
第二:对于多成分的合金组成的金属箔材,由电铸方式沉积金属箔时,组成及物理性能的均匀度还是难以恰当控制的,这在制作大面积的电铸金属箔时,仍然存在挑战。
第三:由电铸法制成的超薄金属箔材料延展性较低,所以在后续的加工或使用上不如蚀刻式的精密金属掩模版。
因为以上所述的原因,此方法仍然没有被大规模量产用在G6H的产线上。
混合型精密掩膜板是在玻璃基板上形成聚酰亚胺聚合物薄膜(6~20μm厚)后,再电镀上金属薄片。此掩膜板可用于制作不需张网的高分辨率OLED产品。此法的优点是不需张网,且因PI层较薄,可以降低蒸镀遮蔽效应(Shadow effect)而得到较大的发光区面积,可能用以制作较亮及高寿命的OLED显示器。但这技术尚在研发阶段,还未导入量产。
真空蒸镀法制造OLED屏幕,为了制造高分辨率屏幕产品,必须使用高精密掩模板,目前蚀刻法精密掩模板能够实现400~600ppi OLED屏幕产品,若需要制作更高分辨率的产品(例如600~800ppi OLED屏幕),就需要使用电铸法精密掩膜版或混合型掩膜板。
从产品品质、性能的提升,生产成本及产业的进步而言,新的、可靠的、具量产性、较低成本及高品质的金属箔材的制作对精密金属掩模版的制作及后续AMOLED的制造是至关重要的。
发明内容
本发明所要解决的第一个技术问题是提供一种纯净度高的用于金属掩膜板的金属箔材的制备方法。
本发明解决第一个技术问题所采用的技术方案为:一种用于金属掩膜板的金属箔材的制备方法,其特征在于包括以下制备步骤:
1)金属粉末配备:所述金属粉末为不锈钢、镍合金、钛合金、铝合金、铁镍合金、铁镍锰、铁镍钴合金、铁钴铬中的一种;
2)激光熔敷:a、先铺设一层金属粉末在基板上;b、激光熔敷后在熔覆层上方再铺设一层金属粉末,再激光熔敷;重复b过程加工成厚度5μm~5mm的金属箔坯;每层金属粉末的铺设厚度为0.8~300μm,激光熔敷时所需激光能量为50~500W,激光能量密度为10~350J/mm3,扫描速度为50~5000mm/秒;
3)第一次热处理:在干燥的惰性氛围或者还原氛围或者真空环境下对得到的金属箔坯进行热处理,然后将金属箔坯与基板分离、绕卷;
4)轧制:对金属箔坯进行冷轧形成金属箔材;
5)第二次热处理:在干燥的惰性氛围或者还原氛围或者真空环境下对轧制后的箔材进行热处理;
根据所需箔材厚度可重复步骤4)、5)一次或者多次。
作为优选,所述铁镍合金的质量百分比组成为Ni:28~46wt%,余量为Fe和不可避免的杂质;所述铁镍钴合金的质量百分比组成为Ni:31~39wt%,Co:0.02~6wt%,余量为Fe和不可避免的杂质;所述铁镍锰的质量百分比组成为Ni:35~37wt%,Mn、Si、Cr的总量为0.001~1wt%,余量为Fe和不可避免的杂质;所述铁钴铬的质量百分比组成为Co:52~54wt%,Cr:9~10wt%,余量为Fe和不可避免的杂质。
为改善箔坯或者箔材的微观组织或者消除箔材的内部应力,作为优选,所述第一次热处理和第二次热处理的温度范围为55℃~1100℃,时间为2分钟~72小时。
进一步,作为优选,所述第一次热处理和第二次热处理的温度范围为670℃~810℃,时间为2分钟~30分钟或者250℃~400℃,时间为0.1~2小时或者60℃~200℃,时间为2分钟~5小时。
作为优选,所述轧制的压延率为5~80%。采用激光熔敷制备的金属箔坯内部尚有残留微孔,表面也粗糙,需以冷压延制成满足厚度要求以及平整表面的薄金属箔材。一般而言压延率越高,加工硬化越大,从而使得加工困难,且加工缺陷增多,良率下降。
进一步,作为优选,所述轧制的压延率为25~60%。
为了控制轧制道次以及保证箔材的质量,作为优选,所述金属粉末为铁镍合金,其中,Ni的含量为28~46wt%,钴的含量为0~17wt%,锰的含量为0~1wt%,余量为Fe及不可避免的微量杂质;粉末尺寸范围为12~50μm,激光能量为200W~350W,激光能量密度为45~95J/mm3,激光扫描速度800~2000mm/秒。当扫描速度过快、激光能量太低、激光能量密度低时,金属粉末无法熔融或者存在不完全熔融,金属箔坯内夹杂有未完全熔融的金属粉末,所得到的箔坯密度低、强度低,不能满足材料的性能要求;当扫描速度过慢、激光能量高、激光能量密度高时,金属粉末大量的蒸发而造成不稳定的熔融,导致制成的金属箔坯有大量的孔洞及表面缺陷。因此,通过控制粉末尺寸、激光能量、激光能量密度以及激光扫描速度的参数,各参数相互协同实现金属箔坯的相对密度高、微孔数量少、表面相对光滑及残余应力小。
作为优选,所述激光熔敷加工成金属箔坯的相对密度达到金属材料标准密度的92%以上。金属箔坯的相对密度是评价激光熔敷制备的金属箔坯性能是否满足要求的重要指标,相对密度越高,说明金属粉末之间已经熔融结合,材料的强度高,满足金属掩膜板对于材料强度的要求。
本发明所要解决的第二个技术问题是提供一种金属掩膜板的制备方法。
本发明解决第二个技术问题所采用的技术方案为:一种金属掩膜板的制备方法,其特征在于包括以下工艺制备流程:清洁所述的金属箔材表面→贴光刻胶膜或塗布湿式光刻胶→曝光→显影→湿法刻蚀→去光刻胶膜或洗掉光刻胶→裁切到金属掩膜板条成品规格;经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
本发明所要解决的第三个技术问题是提供一种金属掩膜板的制备方法。
本发明解决第三个技术问题所采用的技术方案为:将所述的金属箔材裁切成片状→装框→激光投影微孔加工→清洁→裁切到金属掩膜板条成品规格;经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
与现有技术相比,本发明的优点在于:
1)本发明通过直接使用高纯度金属粉末原料控制激光熔敷的参数制备出相对密度高(达到金属材料标准密度的92%以上)的金属箔坯,该金属箔坯的厚度5μm~5mm,通过后续的热处理和轧制制备出满足金属掩膜板厚度和使用要求的金属箔材,因该过程中金属箔坯的厚度较薄,没有使用传统的锻造及热轧工艺,采用较少的道次的精密冷轧即可加工到成品箔材(18~100μm),减少了由生产设备,制造环境及空气中夹杂物的混入,例如氮(N)<0.01wt.%,硫(S)<0.01wt.%,碳(C)<0.02wt.%,磷(P)<0.02wt.%等,提高了金属箔材的纯净度,金属箔材的粗糙度Ra<0.1μm,成材率高于50%。
2)这制备方法满足多种金属箔材的制备,如不锈钢,铁-镍(Fe-Ni)合金,镍(Ni)合金,钛(Ti)合金,铝(Al)合金,超合金(Superalloys,例如:铁镍钴(Fe-Ni-Co)合金,铁镍锰(Fe-Ni-Mn)合金,铁钴铬(Fe-Co-Cr)合金等),适用面广。
3)若是做为AMOLED显示器制作时热蒸镀时器件图案化使用的荫罩的应用,可使用多种低热膨胀系数金属材料,例如,铁镍合金(Fe-Ni(28~46wt.%)),铁镍钴合金(Fe-Ni(31~39wt.%)-Co(0.02~6wt.%));铁镍锰合金(Fe-Ni35~37%-Mn+Si+Cr0.001~1%);铁镍钴合金(Fe余量-Ni(28%~33%)-Co(13~17%)),或铁钴铬合金(Co 52~54%-Cr 9~10%-Fe余量)。
附图说明
图1为本发明对比例的传统工艺流程图。
具体实施方式
以下结合附图实施例对本发明作进一步详细描述。
提供2个实施例和1个对比例,其中,实施例采用本发明的方法制备金属箔材和金属掩膜板。
实施例
Fe-Ni36(Ni:36wt%,余量为Fe)合金箔材的制备:
1)配备Fe-Ni36金属粉末,粉末尺寸范围12~50μm;
2)激光熔敷:a、先铺设一层Fe-Ni36金属粉末在基板上;b、激光熔敷后在熔覆层上方再铺设一层Fe-Ni36金属粉末,再激光熔敷;重复b过程加工成厚度1mm的金属箔坯;每层金属粉末的铺设厚度为1μm,激光能量为300W,激光能量密度为80J/mm3,激光扫描速度1000mm/秒。
3)第一次热处理:在干燥的还原气体(5mol%H2-N2混合气体(forming gas)氛围下对得到的金属箔坯进行退火热处理,氧含量需在100ppm以下,热处理温度为740±70℃,时间为2~10分钟,然后将金属箔坯与基板分离、绕卷;
4)轧制:对金属箔坯进行冷轧形成金属箔材,压延率为20~50%;
5)第二次热处理:在干燥的还原气体(5mol%H2-N2混合气体(forming gas)氛围下对得到的金属箔坯进行消除加工硬化及应力的热处理,氧含量需在100ppm以下,热处理温度为315±20℃,时间为6~60分钟;
重复步骤4)、5)直至将金属箔材加工到18~100μm。在轧制到最后的厚度时,可用材料稳定化的时效热处理,即在干燥的还原气体(5mol%H2-N2混合气体(forming gas),氧含量需在100ppm以下的氛围下对得到的金属箔材进行消除残余应力的热处理,热处理温度为105±50℃,时间为2~60分钟。
Fe-Ni36合金掩膜板的第一种制备方法:工艺流程为清洁Fe-Ni36合金箔材表面→贴光刻胶膜或塗布湿式光刻胶→曝光→显影→湿法刻蚀→去光刻胶膜或洗掉光刻胶→裁切到金属掩膜板条成品规格;经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
具体步骤为:
1)将Fe-Ni36合金表面清洗,去除金属箔材表面的污染物或氧化层,用清洗剂将金属箔材表面清洗干净。除Fe-Ni36合金外,还有其它可使用的低热膨胀系数金属材料。例如,铁镍合金(Fe-Ni(28~46wt.%)),铁镍钴合金(Fe-Ni(31~39wt.%)-Co(0.02~6wt.%));铁镍锰合金(Fe-Ni35~37%-Mn+Si+Cr0.001~1%);铁镍钴合金(Fe余量-Ni(28%~33%)-Co(13~17%)),或铁钴铬合金(Co52~54%-Cr 9~10%-Fe余量)。
2)贴附光刻胶膜在清洗过后的Fe-Ni36合金箔材上。若需增强贴合力,可使用真孔贴合,高温烘烤,或使用界面接合剂。对片式金属箔材的制作时,也可不用干膜光刻胶,而使用涂膜式光刻胶,加上高温烘烤。
3)曝光。将贴附了光刻胶膜的Fe-Ni36合金箔材放置在曝光机,透过光掩模板,将所要制作的图案投影在光刻胶上。除了用曝光机将所要的图案制作在光刻胶膜上外,也可以用激光直写成像(Laser Direct Imaging,LDI)的方式,不需用光掩模板及曝光机,直接用激光直写成像设备以激光照射将图案直接刻写在光刻胶膜上,将Fe-Ni36箔材的两面曝光。
4)显影。由于光刻胶是光感应材料;被光照射过的区域与没有被光照射过的区域的结构与化学特性不同。若是用负型光刻胶,此曝光后的光刻胶膜及金属箔材浸泡在显影液时,已受照光感应的部分会固化留存,而未经照光反应的部分会被显影液溶解,而投影的图案就会显现在存留的光刻胶上。
5)湿式蚀刻。将显影后的光刻胶膜/Fe-Ni36箔材放置在蚀刻槽中,蚀刻液在没有被光刻胶覆盖的部分会与金属箔材接触並起化学反应将接触到的金属蚀刻掉。蚀刻完成后,光刻胶上的图案就会刻蚀在Fe-Ni36箔上。湿式蚀刻加工所制成的微孔尺寸范围在8μm~1000μm。每次湿式蚀刻加工的微孔阵列区域面积依制作AMOLED显示器大小所需的精密金属掩模板尺寸而定。目前智能手机用AMOLED量产的产线为G6半板,整面精密金属掩膜板的大小约为925mm*1500mm,依AMOLED显示屏的大小而定,整面的FMM的制作是以多条精密金属掩膜板条(例如以制作智能手机用6.7寸AMOLED屏来说,约含21条),经过精密对位,焊接,及裁掉多余部分而成。经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件(AMOLED)。,依使用薄金属箔材的宽度而定,单次曝光面积会制作至少含一列AMOLED显示屏尺寸的精密金属掩膜板条的范围。一次曝光若能制作多条精密金属掩膜板条,那平均制作成本可降低。
6)去光刻胶。完成蚀刻后,就需将光刻胶膜在去膜机中去掉,留下有蚀刻图案的金属箔材。
7)裁切。将清洗完后的图案化后的Fe-Ni36合金箔材裁切成最后金属掩模板(FMM)条产品尺寸。
8)将制成的产品做品质检测,看是否符合出货规格。
9)将符合出货规格的金属掩模板条产品包装。
10)经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
上述制作方法,除了适用制作精密金属掩模板外,也可以制作其它,但只不限于,金属掩模板,例如:共通层金属掩模板(CMM),封装层金属掩模板(CVD mask),及相关掩模板配件;以及其它电子用,医疗用的精密金属配件等。
Fe-Ni36合金掩膜板的第二种制备方法:Fe-Ni36合金箔材裁切成片状→装框→激光投影微孔加工→清洁→裁切到金属掩膜板条成品规格;经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
具体步骤为:
1)裁切成金属箔材。将Fe-Ni36合金箔材裁切成片状。
2)片状金属箔装框。因金属箔片材薄,将它用框固定,较易样品制程中的传送及避免损坏。
3)表面清洗。去除Fe-Ni36合金箔材表面的污染物或氧化层,用清洗剂将金属箔材表面清洗干净。
4)激光投影微孔加工。用高能量激光,经过光掩模板,光束能量因光掩模板而形成与其图案的相应的分布。经过光学系统,将此激光光束能量投影到金属箔材上,而在箔材上因高能量激光造成局部激光烧蚀(laser ablation)而在金属箔上制成如光掩模板上的微孔图案。激光的选择可因所需烧蚀的材料而调整。例如:气态激光器,如二氧化碳激光器(CO2 laser),准分子激光(Excimer laser);固态激光器,如掺镱光纤激光器(Ytterbiumfiber laser),Nd:YAG激光器(Nd:YAG laser)。
5)清洗。去除Fe-Ni36合金箔材表面因先前制程中可能有的污染物,用清洗剂将金属箔材表面清洗干净。
6)裁切。将图案化后的Fe-Ni36合金箔材裁切成最后金属掩模板(FMM)条
产品尺寸。
7)检测。将制成的产品做品质检测,看是否符合产品出货规格。
8)包装/出货。将符合产品出货规格的金属掩模板(FMM)条产品包装及出货。
9)经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
上述制作方法,除了适用制作精密金属掩模板外,也可以制作其它,但不限,金属掩模板(例如:共通层金属掩模板(CMM),封装层金属掩模板(CVD mask),及相关掩模板配件;以及其它电子用,医疗用的精密金属配件)
对比例的金属箔材与实施例的不同之处在于金属箔材的制备,工艺流程见图1所示。
性能测试:
实施例的相对密度的测试采用比重瓶测试。
实施例和对比例中颗粒状异物杂质的检测采用自动光学检测仪(AOI)做二维的扫描。
实施例和对比例中杂质检测采用XRF(X-Ray Fluorescdence Spectrascopy),ICPMass Spectroscopy(ICP-MS),红外线碳硫分析仪,及氮氢氧分析仪。
表1本发明实施例和对比例中颗粒状异物杂质和杂质含量
Claims (6)
1.一种用于金属掩膜板的金属箔材的制备方法,其特征在于包括以下制备步骤:
1)金属粉末配备:所述金属粉末为铁镍合金,其中,Ni的含量为28~46wt%,钴的含量为0~17wt%,锰的含量为0~1wt%,余量为Fe及不可避免的微量杂质;
2)激光熔敷:a、先铺设一层金属粉末在基板上;b、激光熔敷后在熔覆层上方再铺设一层金属粉末,再激光熔敷;重复b过程加工成厚度5μm~5mm的金属箔坯;每层金属粉末的铺设厚度为0.8~300μm,激光熔敷时所需激光能量为200~350W,激光能量密度为45~95J/mm3,扫描速度为800~2000mm/秒;
3)第一次热处理:在干燥的惰性氛围或者还原氛围或者真空环境下对得到的金属箔坯进行热处理,热处理温度为740±70℃,时间为2~10分钟,然后将金属箔坯与基板分离、绕卷;
4)轧制:对金属箔坯进行冷轧形成金属箔材;
5)第二次热处理:在干燥的惰性氛围或者还原氛围或者真空环境下对轧制后的箔材进行热处理,热处理温度为315±20℃,时间为6~60分钟;
根据所需箔材厚度重复步骤4)、5)一次或者多次;
所述激光熔敷加工成金属箔坯的相对密度达到金属材料标准密度的92%以上。
2.根据权利要求1所述的用于金属掩膜板的金属箔材的制备方法,其特征在于:所述轧制的压延率为5~80%。
3.根据权利要求2所述的用于金属掩膜板的金属箔材的制备方法,其特征在于:所述轧制的压延率为25~60%。
4.根据权利要求1所述的用于金属掩膜板的金属箔材的制备方法,其特征在于:所述粉末尺寸范围为12~50μm。
5.一种金属掩膜板的制备方法,其特征在于包括以下工艺制备流程:清洁权利要求1至4任一权利要求所述的金属箔材表面→贴光刻胶膜或塗布湿式光刻胶→曝光→显影→湿法刻蚀→去光刻胶膜或洗掉光刻胶→裁切到金属掩膜板条成品规格;经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
6.一种金属掩膜板的制备方法,其特征在于包括以下工艺制备流程:将权利要求1至4任一权利要求所述的金属箔材裁切成片状→装框→激光投影微孔加工→清洁→裁切到金属掩膜板条成品规格;经由多条金属掩膜板条组装成整张精密金属掩模板作为荫罩,在热蒸镀机中制作有机发光二极管显示器件。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111108320.5A CN113909494B (zh) | 2021-09-22 | 2021-09-22 | 用于金属掩膜板的金属箔材及金属掩膜板的制备方法 |
JP2022150759A JP7471011B2 (ja) | 2021-09-22 | 2022-09-21 | メタルマスクの製造に適した高平坦度金属箔材の製造方法 |
US17/950,144 US20230017083A1 (en) | 2021-09-22 | 2022-09-22 | Method for preparing high-flatness metal foil suitable for making metal mask |
EP22197134.4A EP4155424A1 (en) | 2021-09-22 | 2022-09-22 | Method for preparing high-flatness metal foil suitable for making metal mask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111108320.5A CN113909494B (zh) | 2021-09-22 | 2021-09-22 | 用于金属掩膜板的金属箔材及金属掩膜板的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113909494A CN113909494A (zh) | 2022-01-11 |
CN113909494B true CN113909494B (zh) | 2023-10-31 |
Family
ID=79235549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111108320.5A Active CN113909494B (zh) | 2021-09-22 | 2021-09-22 | 用于金属掩膜板的金属箔材及金属掩膜板的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113909494B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114535580A (zh) * | 2022-03-02 | 2022-05-27 | 寰采星科技(宁波)有限公司 | 一种适合制作金属掩模版的高平整度金属箔材制备方法 |
CN114433847A (zh) * | 2022-02-11 | 2022-05-06 | 寰采星科技(宁波)有限公司 | 一种高洁净金属箔材制备方法以及金属掩模版条制备方法 |
CN115679219A (zh) * | 2022-11-14 | 2023-02-03 | 寰采星科技(宁波)有限公司 | 一种用于精密金属掩膜板的铁镍合金箔材及其制备方法 |
CN116511842B (zh) * | 2023-04-27 | 2023-10-03 | 寰采星科技(宁波)有限公司 | 一种精密金属掩模板的制作方法及精密金属掩模板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0450223A1 (en) * | 1990-04-06 | 1991-10-09 | Sumitomo Special Metals Company Limited | Lead frames for semiconductor resin packages |
CN103966632A (zh) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | 一种掩模板的制作方法 |
JP2016216772A (ja) * | 2015-05-18 | 2016-12-22 | 国立研究開発法人産業技術総合研究所 | 金属積層造形と塑性加工を複合した金属素材の製造方法 |
CN108315734A (zh) * | 2018-02-26 | 2018-07-24 | 沈阳工业大学 | 一种改善激光熔覆铝青铜合金梯度涂层性能的工艺方法 |
CN113103690A (zh) * | 2021-05-19 | 2021-07-13 | 飞荣达科技(江苏)有限公司 | 一种镀Ni钎焊铝合金复合板及其制备方法和应用 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101786391B1 (ko) * | 2016-10-06 | 2017-11-16 | 주식회사 포스코 | 증착용 마스크로 사용되는 합금 금속박, 증착용 마스크 및 이들의 제조방법과 이를 이용한 유기 발광 소자 제조방법 |
CN108080638B (zh) * | 2018-01-30 | 2023-07-04 | 华中科技大学 | 一种非晶合金箔材的激光3d打印成形系统及成形方法 |
-
2021
- 2021-09-22 CN CN202111108320.5A patent/CN113909494B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0450223A1 (en) * | 1990-04-06 | 1991-10-09 | Sumitomo Special Metals Company Limited | Lead frames for semiconductor resin packages |
CN103966632A (zh) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | 一种掩模板的制作方法 |
JP2016216772A (ja) * | 2015-05-18 | 2016-12-22 | 国立研究開発法人産業技術総合研究所 | 金属積層造形と塑性加工を複合した金属素材の製造方法 |
CN108315734A (zh) * | 2018-02-26 | 2018-07-24 | 沈阳工业大学 | 一种改善激光熔覆铝青铜合金梯度涂层性能的工艺方法 |
CN113103690A (zh) * | 2021-05-19 | 2021-07-13 | 飞荣达科技(江苏)有限公司 | 一种镀Ni钎焊铝合金复合板及其制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
CN113909494A (zh) | 2022-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113909494B (zh) | 用于金属掩膜板的金属箔材及金属掩膜板的制备方法 | |
JP7478364B2 (ja) | 蒸着マスクを製造するための金属板の評価方法 | |
EP3556899B1 (en) | Vapor deposition mask device and method for manufacturing vapor deposition mask device | |
JP5516816B1 (ja) | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 | |
JP5626491B1 (ja) | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 | |
KR101798480B1 (ko) | 금속판, 금속판의 제조 방법, 및 금속판을 사용하여 마스크를 제조하는 방법 | |
US20230017083A1 (en) | Method for preparing high-flatness metal foil suitable for making metal mask | |
EP4148161A1 (en) | Method of manufacturing vapor deposition mask device | |
US20200152463A1 (en) | Deposition mask, deposition mask apparatus, manufacturing method of deposition mask, and manufacturing method of deposition mask apparatus | |
KR20190116559A (ko) | 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 | |
US20210214843A1 (en) | Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, vapor deposition pattern forming method, and method for producing organic semiconductor element | |
CN114535580A (zh) | 一种适合制作金属掩模版的高平整度金属箔材制备方法 | |
KR20210116310A (ko) | 유기 디바이스의 제조 장치의 증착실의 평가 방법, 평가 방법에서 사용되는 표준 마스크 장치 및 표준 기판, 표준 마스크 장치의 제조 방법, 평가 방법으로 평가된 증착실을 구비하는 유기 디바이스의 제조 장치, 평가 방법으로 평가된 증착실에서 형성된 증착층을 구비하는 유기 디바이스, 그리고 유기 디바이스의 제조 장치의 증착실의 메인터넌스 방법 | |
JP2004169169A (ja) | 蒸着用マスク構造体とその製造方法、及びこれを用いた有機el素子の製造方法 | |
EP3569730B1 (en) | Vapor deposition mask, method for manufacturing vapor deposition mask device, and method for manufacturing vapor deposition mask | |
CN114433847A (zh) | 一种高洁净金属箔材制备方法以及金属掩模版条制备方法 | |
KR100778540B1 (ko) | 금속 마스크 제조 방법 및 금속 마스크 프레임 어셈블리제조 방법 | |
JP2024099678A (ja) | 蒸着マスクを製造するための金属板及び金属板の製造方法並びに蒸着マスク、蒸着マスクの製造方法及び蒸着マスクを備える蒸着マスク装置 | |
US20210407800A1 (en) | Method for manufacturing deposition mask, method for manufacturing display device, and deposition mask intermediate | |
JP2018111879A (ja) | 金属板、金属板の製造方法、マスクの製造方法およびマスク装置の製造方法 | |
CN116197680B (zh) | 一种精密金属掩模板条的制作方法 | |
CN116261380A (zh) | 一种高分辨率oled显示屏的制作方法及高分辨率oled显示屏 | |
CN116516325A (zh) | 一种涂层的处理方法、镍基高温材料及其应用 | |
KR20240044840A (ko) | 금속판 및 이를 포함하는 증착용 마스크 | |
CN116516324A (zh) | 一种涂层、涂层的处理方法和镍基高温材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |