DE69026059D1 - Verfahren zur Herstellung eines SiO2 Films mit einer Polysiloxan/Ozonreaktion - Google Patents
Verfahren zur Herstellung eines SiO2 Films mit einer Polysiloxan/OzonreaktionInfo
- Publication number
- DE69026059D1 DE69026059D1 DE69026059T DE69026059T DE69026059D1 DE 69026059 D1 DE69026059 D1 DE 69026059D1 DE 69026059 T DE69026059 T DE 69026059T DE 69026059 T DE69026059 T DE 69026059T DE 69026059 D1 DE69026059 D1 DE 69026059D1
- Authority
- DE
- Germany
- Prior art keywords
- polysiloxane
- production
- sio2 film
- ozone reaction
- ozone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 title 1
- 229910052681 coesite Inorganic materials 0.000 title 1
- 229910052906 cristobalite Inorganic materials 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- -1 polysiloxane Polymers 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
- 239000000377 silicon dioxide Substances 0.000 title 1
- 235000012239 silicon dioxide Nutrition 0.000 title 1
- 229910052682 stishovite Inorganic materials 0.000 title 1
- 229910052905 tridymite Inorganic materials 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31608—Deposition of SiO2
- H01L21/31612—Deposition of SiO2 on a silicon body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31625—Deposition of boron or phosphorus doped silicon oxide, e.g. BSG, PSG, BPSG
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1339071A JPH03198338A (ja) | 1989-12-27 | 1989-12-27 | 気相成長膜の形成方法および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69026059D1 true DE69026059D1 (de) | 1996-04-25 |
DE69026059T2 DE69026059T2 (de) | 1996-08-22 |
Family
ID=18323985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69026059T Expired - Fee Related DE69026059T2 (de) | 1989-12-27 | 1990-12-19 | Verfahren zur Herstellung eines SiO2 Films mit einer Polysiloxan/Ozonreaktion |
Country Status (4)
Country | Link |
---|---|
US (1) | US5231058A (de) |
EP (1) | EP0436185B1 (de) |
JP (1) | JPH03198338A (de) |
DE (1) | DE69026059T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719777B2 (ja) * | 1990-08-10 | 1995-03-06 | 株式会社半導体プロセス研究所 | 半導体装置の製造方法 |
US5043002A (en) * | 1990-08-16 | 1991-08-27 | Corning Incorporated | Method of making fused silica by decomposing siloxanes |
JPH04152640A (ja) * | 1990-10-17 | 1992-05-26 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型半導体装置の作製方法 |
EP0497541A1 (de) * | 1991-01-28 | 1992-08-05 | Kawasaki Steel Corporation | Halbleiterbauelement mit einer Bor-Phosphorsilikat-Glasschicht und ihr Herstellungsverfahren |
JP2588447B2 (ja) * | 1991-06-29 | 1997-03-05 | 信越石英株式会社 | エキシマレーザー用石英ガラス部材の製造方法 |
DE4202652C2 (de) * | 1992-01-30 | 1996-03-28 | Fraunhofer Ges Forschung | Verfahren zum Aufbringen einer UV- und/oder elektronenstrahlempfindlichen Lackschicht |
EP0572704B1 (de) * | 1992-06-05 | 2000-04-19 | Semiconductor Process Laboratory Co., Ltd. | Verfahren zur Herstellung einer Halbleiteranordnung mittels eines Verfahren zur Reformierung einer Isolationsschicht die bei niederiger Temperatur durch CVD hergestellt ist |
US5387546A (en) * | 1992-06-22 | 1995-02-07 | Canon Sales Co., Inc. | Method for manufacturing a semiconductor device |
EP0582724A1 (de) * | 1992-08-04 | 1994-02-16 | Siemens Aktiengesellschaft | Verfahren zur lokal und global planarisierenden CVD-Abscheidung von SiO2-Schichten auf strukturierten Siliziumsubstraten |
EP0642167A3 (de) * | 1993-08-05 | 1995-06-28 | Matsushita Electronics Corp | Halbleiterbauelement mit Kondensator und Herstellungsverfahren. |
US5489553A (en) * | 1995-05-25 | 1996-02-06 | Industrial Technology Research Institute | HF vapor surface treatment for the 03 teos gap filling deposition |
US6489255B1 (en) * | 1995-06-05 | 2002-12-03 | International Business Machines Corporation | Low temperature/low dopant oxide glass film |
US6489213B1 (en) | 1996-01-05 | 2002-12-03 | Integrated Device Technology, Inc. | Method for manufacturing semiconductor device containing a silicon-rich layer |
AU6332296A (en) * | 1996-02-02 | 1997-08-22 | Micron Technology, Inc. | Reducing fixed charge in semiconductor device layers |
US5710079A (en) * | 1996-05-24 | 1998-01-20 | Lsi Logic Corporation | Method and apparatus for forming dielectric films |
US6013583A (en) * | 1996-06-25 | 2000-01-11 | International Business Machines Corporation | Low temperature BPSG deposition process |
US5990513A (en) * | 1996-10-08 | 1999-11-23 | Ramtron International Corporation | Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion |
AU4802297A (en) * | 1996-10-08 | 1998-05-05 | Corning Incorporated | Method of inhibiting gelling of siloxane feedstocks and a gel inhibited feedstock |
US6159870A (en) * | 1998-12-11 | 2000-12-12 | International Business Machines Corporation | Borophosphosilicate glass incorporated with fluorine for low thermal budget gap fill |
US6165905A (en) * | 1999-01-20 | 2000-12-26 | Philips Electronics, North America Corp. | Methods for making reliable via structures having hydrophobic inner wall surfaces |
US6242299B1 (en) | 1999-04-01 | 2001-06-05 | Ramtron International Corporation | Barrier layer to protect a ferroelectric capacitor after contact has been made to the capacitor electrode |
US6465044B1 (en) * | 1999-07-09 | 2002-10-15 | Silicon Valley Group, Thermal Systems Llp | Chemical vapor deposition of silicon oxide films using alkylsiloxane oligomers with ozone |
EP1123991A3 (de) * | 2000-02-08 | 2002-11-13 | Asm Japan K.K. | Materialen mit niedrieger Dielektrizitätskonstante und Verfahren |
US6905981B1 (en) | 2000-11-24 | 2005-06-14 | Asm Japan K.K. | Low-k dielectric materials and processes |
US6572923B2 (en) * | 2001-01-12 | 2003-06-03 | The Boc Group, Inc. | Asymmetric organocyclosiloxanes and their use for making organosilicon polymer low-k dielectric film |
US8723654B2 (en) | 2010-07-09 | 2014-05-13 | Cypress Semiconductor Corporation | Interrupt generation and acknowledgment for RFID |
US9846664B2 (en) | 2010-07-09 | 2017-12-19 | Cypress Semiconductor Corporation | RFID interface and interrupt |
US9092582B2 (en) | 2010-07-09 | 2015-07-28 | Cypress Semiconductor Corporation | Low power, low pin count interface for an RFID transponder |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4168330A (en) * | 1977-10-13 | 1979-09-18 | Rca Corporation | Method of depositing a silicon oxide layer |
CA1333146C (en) * | 1987-04-10 | 1994-11-22 | Andre Lagendijk | Method of forming silicon dioxide glass films |
US5028566A (en) * | 1987-04-10 | 1991-07-02 | Air Products And Chemicals, Inc. | Method of forming silicon dioxide glass films |
JP2624254B2 (ja) * | 1987-05-22 | 1997-06-25 | 東京応化工業株式会社 | シリカ系被膜の膜質改善方法 |
JPH0682650B2 (ja) * | 1987-06-10 | 1994-10-19 | 東京エレクトロン株式会社 | 酸化膜形成方法 |
JPH07120734B2 (ja) * | 1987-09-25 | 1995-12-20 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH01212442A (ja) * | 1988-02-19 | 1989-08-25 | Fujitsu Ltd | 気相成長方法 |
US4894352A (en) * | 1988-10-26 | 1990-01-16 | Texas Instruments Inc. | Deposition of silicon-containing films using organosilicon compounds and nitrogen trifluoride |
-
1989
- 1989-12-27 JP JP1339071A patent/JPH03198338A/ja active Pending
-
1990
- 1990-12-14 US US07/628,237 patent/US5231058A/en not_active Expired - Fee Related
- 1990-12-19 EP EP90124838A patent/EP0436185B1/de not_active Expired - Lifetime
- 1990-12-19 DE DE69026059T patent/DE69026059T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03198338A (ja) | 1991-08-29 |
EP0436185A1 (de) | 1991-07-10 |
EP0436185B1 (de) | 1996-03-20 |
US5231058A (en) | 1993-07-27 |
DE69026059T2 (de) | 1996-08-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |