DE69023990D1 - Verfahren zur Herstellung von gedruckten Leiterplatten. - Google Patents

Verfahren zur Herstellung von gedruckten Leiterplatten.

Info

Publication number
DE69023990D1
DE69023990D1 DE69023990T DE69023990T DE69023990D1 DE 69023990 D1 DE69023990 D1 DE 69023990D1 DE 69023990 T DE69023990 T DE 69023990T DE 69023990 T DE69023990 T DE 69023990T DE 69023990 D1 DE69023990 D1 DE 69023990D1
Authority
DE
Germany
Prior art keywords
weight
printed circuit
slurry
mediums
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69023990T
Other languages
English (en)
Other versions
DE69023990T2 (de
Inventor
Akikazu Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1229305A external-priority patent/JP2869094B2/ja
Priority claimed from JP22930689A external-priority patent/JP2813001B2/ja
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Publication of DE69023990D1 publication Critical patent/DE69023990D1/de
Application granted granted Critical
Publication of DE69023990T2 publication Critical patent/DE69023990T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Paper (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE69023990T 1989-09-06 1990-09-04 Verfahren zur Herstellung von gedruckten Leiterplatten. Expired - Fee Related DE69023990T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1229305A JP2869094B2 (ja) 1989-09-06 1989-09-06 スチレン系重合体組成物及び成形体の製造方法
JP22930689A JP2813001B2 (ja) 1989-09-06 1989-09-06 プリント配線板の製造方法及び該方法により得られたプリント配線板

Publications (2)

Publication Number Publication Date
DE69023990D1 true DE69023990D1 (de) 1996-01-18
DE69023990T2 DE69023990T2 (de) 1996-04-25

Family

ID=26528733

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69023990T Expired - Fee Related DE69023990T2 (de) 1989-09-06 1990-09-04 Verfahren zur Herstellung von gedruckten Leiterplatten.

Country Status (6)

Country Link
US (1) US5127158A (de)
EP (1) EP0416518B1 (de)
KR (1) KR970004754B1 (de)
AT (1) ATE131339T1 (de)
CA (1) CA2024688A1 (de)
DE (1) DE69023990T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5891951A (en) * 1987-09-14 1999-04-06 Idemitsu Kosan Co., Ltd. Styrene-based resin composition
US5395890A (en) * 1987-09-14 1995-03-07 Idemitsu Kosan Co., Ltd. Styrene-based resin composition
US6013726A (en) * 1987-04-12 2000-01-11 Idemitsu Kosan Co., Ltd. Composition of styrene resin, thermoplastic resin and rubber
US6093768A (en) * 1987-09-14 2000-07-25 Idemitsu Kosan Co., Ltd. Syndiotactic styrene resin, thermoplastic resin and rubber
US6008293A (en) * 1987-09-14 1999-12-28 Idemitsu Kosan Co., Ltd. Syndiotactic polystyrene and polycarbonate resin compositions
US6046275A (en) * 1987-09-14 2000-04-04 Idemitsu Kosan Co., Ltd. Styrene resin with rubber polymer particles
US5210941A (en) * 1991-07-19 1993-05-18 Poly Circuits, Inc. Method for making circuit board having a metal support
US5312691A (en) * 1991-09-10 1994-05-17 Glasteel Industrial Laminates, Inc. Copper-clad MC4 unsaturated polyester resin
US5256609A (en) * 1991-12-18 1993-10-26 W. R. Grace & Co.-Conn. Clean burning green ceramic tape cast system using atactic polypropylene binder
EP0554820B1 (de) * 1992-02-03 1998-07-08 Lanxide Technology Company, Lp Verfahren zur Herstellung von keramischen Blättern
EP0671371A1 (de) * 1994-02-14 1995-09-13 Rohm And Haas Company Schaumarme keramische Schlicker
JPH08104785A (ja) * 1994-10-05 1996-04-23 Idemitsu Kosan Co Ltd 耐衝撃性ポリスチレン系樹脂組成物
US6005050A (en) * 1994-11-28 1999-12-21 Idemitsu Petrochemical Co., Ltd. Impact resistant polystyrene composition
CN1140461A (zh) * 1994-12-07 1997-01-15 出光石油化学株式会社 苯乙烯属树脂组合物和聚苯乙烯取向薄膜
JPH08319385A (ja) * 1995-05-26 1996-12-03 Idemitsu Petrochem Co Ltd ポリスチレン系樹脂組成物及びその成形品
EP0767211B1 (de) 1995-09-08 1999-04-21 Idemitsu Petrochemical Co., Ltd. Harzzusammensetzung auf Styrolbasis
JPH09180689A (ja) * 1995-12-27 1997-07-11 Idemitsu Petrochem Co Ltd 密閉型二次電池用電槽材料及びそれを用いた密閉型二次電池用電槽
US5981076A (en) * 1996-12-09 1999-11-09 3M Innovative Properties Company UV protected syndiotactic polystyrene overlay films
BE1011624A4 (fr) * 1997-12-17 1999-11-09 Laude Lucien Diego Supports de circuit electrique.
US6274221B2 (en) 1999-01-29 2001-08-14 3M Innovative Properties Company Angular brightness microprismatic retroreflective film or sheeting incorporating a syndiotactic vinyl aromatic polymer
US6326072B1 (en) 1999-01-29 2001-12-04 3M Innovative Properties Company Release liner incorporating syndiotactic vinyl aromatic polymer
US6623824B1 (en) 1999-01-29 2003-09-23 3M Innovative Properties Company Method for making a microreplicated article using a substrate comprising a syndiotactic vinyl aromatic polymer
DE60020968T2 (de) 1999-06-04 2006-05-11 Dow Global Technologies, Inc., Midland Borsubstituierte cyclopentadiene und metallkomplexe dieser liganden
JP2001049228A (ja) * 1999-08-12 2001-02-20 Sony Chem Corp 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Ind Co Ltd Module with embedded electric elements and the manufacturing method thereof
KR100555915B1 (ko) 2003-12-22 2006-03-03 삼성전자주식회사 자동채널탐색을 병렬적으로 수행하는 디지털 방송수신장치및 그 채널탐색방법
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
KR102201795B1 (ko) 2016-12-16 2021-01-14 노보셋, 엘엘씨 수지 조성물

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2890147A (en) * 1954-12-23 1959-06-09 Owens Corning Fiberglass Corp Method of making metal-reinforced boards of mineral fibers
US2963748A (en) * 1957-05-27 1960-12-13 Young Lawrence John Printed circuits
GB961665A (en) * 1960-06-29 1964-06-24 Formica Ltd Improvements in or relating to the coating of glass fibrous materials with perfluorocarbon polymers
US3274328A (en) * 1963-06-06 1966-09-20 Polymer Corp Dielectric for circuit board and strip lines
FR1526480A (fr) * 1966-06-08 1968-05-24 Dynamit Nobel Ag Procédé d'application de circuits imprimés sur des matières stratifiées
US3770571A (en) * 1969-04-02 1973-11-06 Richardson Co Fabrication of printed circuit boards
US3937865A (en) * 1970-11-11 1976-02-10 Koninklijke Papierfabrieken Van Gelder Zonen N.V. Reinforced plastics carrier for printed circuits
GB1586167A (en) * 1976-09-24 1981-03-18 Bfg Glassgroup Moulding solid layers
US4518737A (en) * 1978-12-26 1985-05-21 Rogers Corporation Dielectric material and method of making the dielectric material
FR2493662A1 (fr) * 1980-11-05 1982-05-07 Rhone Poulenc Ind Substrats metallises pour circuits imprimes et leur procede de preparation
US4740340A (en) * 1984-04-30 1988-04-26 Federal-Mogul Corporation Method of making a PTFE based impregnated metal matrix
US4615854A (en) * 1984-04-30 1986-10-07 Federal-Mogul Corporation Method of making a PTFE based tape suitable for impregnation into a porous metal matrix
JPH06104337B2 (ja) * 1987-12-04 1994-12-21 出光興産株式会社 スチレン系樹脂延伸フィルム及びその製造方法
JPH089650B2 (ja) * 1986-10-16 1996-01-31 出光興産株式会社 スチレン系重合体の製造法
US4933208A (en) * 1987-11-16 1990-06-12 Motorola, Inc. Multilayer thermoplastic substrate and method of manufacture
JP2931597B2 (ja) * 1988-02-11 1999-08-09 ザ・ダウ・ケミカル・カンパニー 電気連結器具，その基材及び該基材からなる配線盤と配線コネクター
US4892695A (en) * 1988-06-10 1990-01-09 Manville Corporation Process for making a moldable fibrous mat
US4952420A (en) * 1988-10-12 1990-08-28 Advanced Dielectric Technologies, Inc. Vapor deposition patterning method

Also Published As

Publication number Publication date
EP0416518A2 (de) 1991-03-13
ATE131339T1 (de) 1995-12-15
EP0416518A3 (en) 1993-01-27
CA2024688A1 (en) 1991-03-07
EP0416518B1 (de) 1995-12-06
KR970004754B1 (ko) 1997-04-03
DE69023990T2 (de) 1996-04-25
KR910007396A (ko) 1991-04-30
US5127158A (en) 1992-07-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee