DE69016471T2 - Leiterplatte, geeignet zur Vermeidung elektromagnetischer Interferenzen. - Google Patents
Leiterplatte, geeignet zur Vermeidung elektromagnetischer Interferenzen.Info
- Publication number
- DE69016471T2 DE69016471T2 DE69016471T DE69016471T DE69016471T2 DE 69016471 T2 DE69016471 T2 DE 69016471T2 DE 69016471 T DE69016471 T DE 69016471T DE 69016471 T DE69016471 T DE 69016471T DE 69016471 T2 DE69016471 T2 DE 69016471T2
- Authority
- DE
- Germany
- Prior art keywords
- conductive layer
- ground
- capacitance
- circuit board
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000012447 hatching Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989021878U JPH073660Y2 (ja) | 1989-02-27 | 1989-02-27 | Ｅｍｉ対策用回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69016471D1 DE69016471D1 (de) | 1995-03-16 |
| DE69016471T2 true DE69016471T2 (de) | 1995-09-07 |
Family
ID=12067381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69016471T Expired - Fee Related DE69016471T2 (de) | 1989-02-27 | 1990-02-26 | Leiterplatte, geeignet zur Vermeidung elektromagnetischer Interferenzen. |
Country Status (7)
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5473109A (en) * | 1990-12-21 | 1995-12-05 | Siemens Aktiengesellschaft | RF-shielding housing for a circuit, for example for the control circuit of a motor-vehicle air-bag |
| US5315069A (en) * | 1992-10-02 | 1994-05-24 | Compaq Computer Corp. | Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards |
| FI20070415L (fi) * | 2007-05-25 | 2008-11-26 | Elcoteq Se | Suojamaadoitus |
| KR101009152B1 (ko) * | 2009-06-23 | 2011-01-18 | 삼성전기주식회사 | 인쇄회로기판 |
| KR102032566B1 (ko) * | 2013-01-10 | 2019-10-16 | 엘에스전선 주식회사 | 전자기파차폐 케이블 |
| KR102531762B1 (ko) * | 2017-09-29 | 2023-05-12 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1936899A1 (de) * | 1969-07-19 | 1971-02-04 | Siemens Ag | Baugruppentraeger fuer Steuer- bzw. Regelanlagen |
| JPS5778674U (US20080094685A1-20080424-C00004.png) * | 1980-10-31 | 1982-05-15 | ||
| FR2527039A1 (fr) * | 1982-05-14 | 1983-11-18 | Inf Milit Spatiale Aeronaut | Dispositif de protection d'un dispositif electronique contre les tensions engendrees par un champ electromagnetique |
| JPS59188993A (ja) * | 1983-04-12 | 1984-10-26 | 株式会社東芝 | プリント配線基板 |
| JPS61115108A (ja) * | 1984-11-09 | 1986-06-02 | Purasutoron Kk | ホツトランナ多点ゲ−トの温度制御方法 |
| JPH0682890B2 (ja) * | 1986-03-13 | 1994-10-19 | 任天堂株式会社 | Ｅｍｉ対策用回路基板とその製造方法 |
| US4801489A (en) * | 1986-03-13 | 1989-01-31 | Nintendo Co., Ltd. | Printed circuit board capable of preventing electromagnetic interference |
| US4770921A (en) * | 1986-09-11 | 1988-09-13 | Insulating Materials Incorporated | Self-shielding multi-layer circuit boards |
| JPS63107187A (ja) * | 1986-10-24 | 1988-05-12 | 株式会社東芝 | 実装基板 |
| FI113937B (fi) * | 1989-02-21 | 2004-06-30 | Tatsuta Electric Wire & Gable | Painettu piirilevy ja menetelmä sen valmistamiseksi |
-
1989
- 1989-02-27 JP JP1989021878U patent/JPH073660Y2/ja not_active Expired - Lifetime
-
1990
- 1990-02-22 CA CA002010743A patent/CA2010743C/en not_active Expired - Fee Related
- 1990-02-23 FI FI900940A patent/FI111508B/fi not_active IP Right Cessation
- 1990-02-26 EP EP90302007A patent/EP0385689B1/en not_active Expired - Lifetime
- 1990-02-26 AU AU50183/90A patent/AU631185B2/en not_active Ceased
- 1990-02-26 DE DE69016471T patent/DE69016471T2/de not_active Expired - Fee Related
- 1990-02-27 KR KR1019900002522A patent/KR0137658B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FI900940A0 (fi) | 1990-02-23 |
| CA2010743A1 (en) | 1990-08-27 |
| EP0385689A1 (en) | 1990-09-05 |
| CA2010743C (en) | 2000-09-19 |
| KR910016227A (ko) | 1991-09-30 |
| JPH02113359U (US20080094685A1-20080424-C00004.png) | 1990-09-11 |
| DE69016471D1 (de) | 1995-03-16 |
| AU631185B2 (en) | 1992-11-19 |
| AU5018390A (en) | 1990-09-06 |
| FI111508B (fi) | 2003-07-31 |
| KR0137658B1 (ko) | 1998-06-15 |
| JPH073660Y2 (ja) | 1995-01-30 |
| EP0385689B1 (en) | 1995-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |