DE69015860T2 - Warmhärtende Harzzusammensetzung und warmhärtender trockener Film. - Google Patents

Warmhärtende Harzzusammensetzung und warmhärtender trockener Film.

Info

Publication number
DE69015860T2
DE69015860T2 DE1990615860 DE69015860T DE69015860T2 DE 69015860 T2 DE69015860 T2 DE 69015860T2 DE 1990615860 DE1990615860 DE 1990615860 DE 69015860 T DE69015860 T DE 69015860T DE 69015860 T2 DE69015860 T2 DE 69015860T2
Authority
DE
Germany
Prior art keywords
thermosetting
resin composition
dry film
thermosetting resin
thermosetting dry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1990615860
Other languages
English (en)
Other versions
DE69015860D1 (de
Inventor
Hiroshi Inoue
Tadao Muramatsu
Tetsuji Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Publication of DE69015860D1 publication Critical patent/DE69015860D1/de
Application granted granted Critical
Publication of DE69015860T2 publication Critical patent/DE69015860T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE1990615860 1989-04-18 1990-04-18 Warmhärtende Harzzusammensetzung und warmhärtender trockener Film. Expired - Fee Related DE69015860T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9625189A JP2597181B2 (ja) 1989-04-18 1989-04-18 熱硬化性樹脂組成物およびドライフィルム

Publications (2)

Publication Number Publication Date
DE69015860D1 DE69015860D1 (de) 1995-02-23
DE69015860T2 true DE69015860T2 (de) 1995-06-22

Family

ID=14159995

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990615860 Expired - Fee Related DE69015860T2 (de) 1989-04-18 1990-04-18 Warmhärtende Harzzusammensetzung und warmhärtender trockener Film.

Country Status (4)

Country Link
US (1) US5128444A (de)
EP (1) EP0393638B1 (de)
JP (1) JP2597181B2 (de)
DE (1) DE69015860T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03174427A (ja) * 1989-09-26 1991-07-29 Ube Ind Ltd 末端変性イミドオリゴマー組成物
JP2882114B2 (ja) * 1991-06-07 1999-04-12 宇部興産株式会社 末端変性イミドオリゴマ−組成物
JPH0632854A (ja) * 1992-07-20 1994-02-08 Ube Ind Ltd 末端変性イミドオリゴマーの組成物
CN102120825B (zh) * 2001-02-27 2012-12-19 钟渊化学工业株式会社 聚酰亚胺膜及其制造方法
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
EP1620495A4 (de) * 2003-05-05 2006-06-14 Advanced Applied Adhesives Imidverknüpfte maleinimid- und polymaleinimidverbindungen
US7994274B2 (en) 2003-09-02 2011-08-09 I.S.T. (Ma) Corporation Two-stage cure polyimide oligomers
JP4612292B2 (ja) * 2003-10-20 2011-01-12 株式会社ピーアイ技術研究所 接着性組成物及びその硬化方法
US8568867B2 (en) * 2006-06-26 2013-10-29 Sabic Innovative Plastics Ip B.V. Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8545975B2 (en) * 2006-06-26 2013-10-01 Sabic Innovative Plastics Ip B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US20080044639A1 (en) * 2006-06-26 2008-02-21 Kwok Pong Chan Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
JP5139986B2 (ja) * 2006-09-11 2013-02-06 三井化学株式会社 ポリイミド系樹脂組成物及びその製造方法、ならびに金属積層体
JP2008149549A (ja) * 2006-12-18 2008-07-03 Mitsui Chemicals Inc 金属積層体の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4061856A (en) * 1974-10-10 1977-12-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Trimerization of aromatic nitriles
US4173700A (en) * 1978-06-21 1979-11-06 Trw Inc. Bis (difluoromaleimide) capped propolymers and polymers
JPS56118421A (en) * 1980-02-25 1981-09-17 Nitto Electric Ind Co Ltd Heat-shrinkable polyimide film and production thereof
US4826927A (en) * 1986-01-13 1989-05-02 Ciba-Geigy Corporation Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide
JPH062828B2 (ja) * 1986-05-15 1994-01-12 宇部興産株式会社 ポリイミドフイルムの製造法
KR880014009A (ko) * 1987-05-04 1988-12-22 원본미기재 폴리이미드 올리고머 및 그 혼합체
JPS6454029A (en) * 1987-08-25 1989-03-01 Ube Industries Terminal-modified imide oligomer and its solution composition
US4963645A (en) * 1987-08-25 1990-10-16 Ube Industries, Ltd. Terminal-modified imide oligomer and solution composition of the same
JPH01188528A (ja) * 1988-01-22 1989-07-27 Ube Ind Ltd 末端変性イミドオリゴマー及びその弾性成形体
JPH01247430A (ja) * 1988-03-29 1989-10-03 Ube Ind Ltd 繊維強化ポリイミド複合材料の製造法
JPH0739451B2 (ja) * 1988-08-30 1995-05-01 宇部興産株式会社 末端変性イミドオリゴマー組成物

Also Published As

Publication number Publication date
EP0393638A3 (de) 1991-12-18
EP0393638B1 (de) 1995-01-11
DE69015860D1 (de) 1995-02-23
US5128444A (en) 1992-07-07
JP2597181B2 (ja) 1997-04-02
JPH02274762A (ja) 1990-11-08
EP0393638A2 (de) 1990-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee