DE69014059D1 - Apparat zum Herstellen von Halbleiteranordnungen. - Google Patents
Apparat zum Herstellen von Halbleiteranordnungen.Info
- Publication number
- DE69014059D1 DE69014059D1 DE69014059T DE69014059T DE69014059D1 DE 69014059 D1 DE69014059 D1 DE 69014059D1 DE 69014059 T DE69014059 T DE 69014059T DE 69014059 T DE69014059 T DE 69014059T DE 69014059 D1 DE69014059 D1 DE 69014059D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor devices
- manufacturing semiconductor
- manufacturing
- devices
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1254663A JP2588283B2 (ja) | 1989-09-29 | 1989-09-29 | 樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69014059D1 true DE69014059D1 (de) | 1994-12-15 |
DE69014059T2 DE69014059T2 (de) | 1995-04-27 |
Family
ID=17268138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69014059T Expired - Fee Related DE69014059T2 (de) | 1989-09-29 | 1990-09-28 | Apparat zum Herstellen von Halbleiteranordnungen. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0420267B1 (de) |
JP (1) | JP2588283B2 (de) |
KR (1) | KR930004254B1 (de) |
DE (1) | DE69014059T2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69637809D1 (de) * | 1996-11-28 | 2009-02-26 | Mitsubishi Electric Corp | Halbleiteranordnung |
KR101032342B1 (ko) * | 2009-04-24 | 2011-05-02 | 삼화콘덴서공업주식회사 | 임베디드 커패시터 및 이를 이용한 임베디드 커패시터 시트, 및 그의 제조방법 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4504435A (en) * | 1982-10-04 | 1985-03-12 | Texas Instruments Incorporated | Method for semiconductor device packaging |
-
1989
- 1989-09-29 JP JP1254663A patent/JP2588283B2/ja not_active Expired - Lifetime
-
1990
- 1990-09-28 KR KR1019900015503A patent/KR930004254B1/ko not_active IP Right Cessation
- 1990-09-28 EP EP90118679A patent/EP0420267B1/de not_active Expired - Lifetime
- 1990-09-28 DE DE69014059T patent/DE69014059T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0420267A2 (de) | 1991-04-03 |
EP0420267B1 (de) | 1994-11-09 |
DE69014059T2 (de) | 1995-04-27 |
JP2588283B2 (ja) | 1997-03-05 |
EP0420267A3 (en) | 1991-06-12 |
KR930004254B1 (ko) | 1993-05-22 |
JPH03116845A (ja) | 1991-05-17 |
KR910007113A (ko) | 1991-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |