DE69006809D1 - Vorrichtung für die Verdampfung und Bereitstellung von Organometallverbindungen. - Google Patents
Vorrichtung für die Verdampfung und Bereitstellung von Organometallverbindungen.Info
- Publication number
- DE69006809D1 DE69006809D1 DE90117498T DE69006809T DE69006809D1 DE 69006809 D1 DE69006809 D1 DE 69006809D1 DE 90117498 T DE90117498 T DE 90117498T DE 69006809 T DE69006809 T DE 69006809T DE 69006809 D1 DE69006809 D1 DE 69006809D1
- Authority
- DE
- Germany
- Prior art keywords
- provision
- evaporation
- organometallic compounds
- organometallic
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1234767A JP2611009B2 (ja) | 1989-09-12 | 1989-09-12 | 有機金属化合物の気化供給装置 |
JP1234766A JP2611008B2 (ja) | 1989-09-12 | 1989-09-12 | 有機金属化合物の気化供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69006809D1 true DE69006809D1 (de) | 1994-03-31 |
DE69006809T2 DE69006809T2 (de) | 1994-09-15 |
Family
ID=26531743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69006809T Expired - Fee Related DE69006809T2 (de) | 1989-09-12 | 1990-09-11 | Vorrichtung für die Verdampfung und Bereitstellung von Organometallverbindungen. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5160542A (de) |
EP (1) | EP0419939B1 (de) |
DE (1) | DE69006809T2 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2626925B2 (ja) * | 1990-05-23 | 1997-07-02 | 三菱電機株式会社 | 基板処理装置および基板処理方法 |
US5308433A (en) * | 1991-04-11 | 1994-05-03 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for vapor growth |
US6004885A (en) | 1991-12-26 | 1999-12-21 | Canon Kabushiki Kaisha | Thin film formation on semiconductor wafer |
US5447568A (en) * | 1991-12-26 | 1995-09-05 | Canon Kabushiki Kaisha | Chemical vapor deposition method and apparatus making use of liquid starting material |
JP2797233B2 (ja) * | 1992-07-01 | 1998-09-17 | 富士通株式会社 | 薄膜成長装置 |
JP2000252269A (ja) * | 1992-09-21 | 2000-09-14 | Mitsubishi Electric Corp | 液体気化装置及び液体気化方法 |
JPH06196419A (ja) * | 1992-12-24 | 1994-07-15 | Canon Inc | 化学気相堆積装置及びそれによる半導体装置の製造方法 |
JP2889098B2 (ja) * | 1993-10-13 | 1999-05-10 | 株式会社本山製作所 | 特定ガスの供給制御装置 |
US5451258A (en) * | 1994-05-11 | 1995-09-19 | Materials Research Corporation | Apparatus and method for improved delivery of vaporized reactant gases to a reaction chamber |
US5614247A (en) * | 1994-09-30 | 1997-03-25 | International Business Machines Corporation | Apparatus for chemical vapor deposition of aluminum oxide |
US5648113A (en) * | 1994-09-30 | 1997-07-15 | International Business Machines Corporation | Aluminum oxide LPCVD system |
US5620524A (en) * | 1995-02-27 | 1997-04-15 | Fan; Chiko | Apparatus for fluid delivery in chemical vapor deposition systems |
US6039809A (en) * | 1998-01-27 | 2000-03-21 | Mitsubishi Materials Silicon Corporation | Method and apparatus for feeding a gas for epitaxial growth |
EP1073777A2 (de) | 1998-04-14 | 2001-02-07 | CVD Systems, Inc. | Filmabscheidungssystem |
US6136725A (en) * | 1998-04-14 | 2000-10-24 | Cvd Systems, Inc. | Method for chemical vapor deposition of a material on a substrate |
US6296711B1 (en) | 1998-04-14 | 2001-10-02 | Cvd Systems, Inc. | Film processing system |
US6217937B1 (en) | 1998-07-15 | 2001-04-17 | Cornell Research Foundation, Inc. | High throughput OMVPE apparatus |
JP3582437B2 (ja) * | 1999-12-24 | 2004-10-27 | 株式会社村田製作所 | 薄膜製造方法及びそれに用いる薄膜製造装置 |
JP2002035572A (ja) * | 2000-05-18 | 2002-02-05 | Ulvac Japan Ltd | 真空処理装置と多室型真空処理装置 |
US20040025787A1 (en) * | 2002-04-19 | 2004-02-12 | Selbrede Steven C. | System for depositing a film onto a substrate using a low pressure gas precursor |
JP3821227B2 (ja) * | 2002-09-19 | 2006-09-13 | 信越化学工業株式会社 | 有機金属化合物の気化供給装置 |
TW200407328A (en) * | 2002-09-19 | 2004-05-16 | Shinetsu Chemical Co | Liquid organometallic compound vaporizing/feeding system |
US20050000428A1 (en) * | 2003-05-16 | 2005-01-06 | Shero Eric J. | Method and apparatus for vaporizing and delivering reactant |
JP2005079141A (ja) * | 2003-08-28 | 2005-03-24 | Asm Japan Kk | プラズマcvd装置 |
CN102154628B (zh) * | 2004-08-02 | 2014-05-07 | 维高仪器股份有限公司 | 用于化学气相沉积反应器的多气体分配喷射器 |
JP4689324B2 (ja) * | 2005-04-04 | 2011-05-25 | 東京エレクトロン株式会社 | 成膜装置、成膜方法および記録媒体 |
JP4605790B2 (ja) | 2006-06-27 | 2011-01-05 | 株式会社フジキン | 原料の気化供給装置及びこれに用いる圧力自動調整装置。 |
JP4762835B2 (ja) * | 2006-09-07 | 2011-08-31 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、プログラムおよびプログラム記録媒体 |
US8741062B2 (en) * | 2008-04-22 | 2014-06-03 | Picosun Oy | Apparatus and methods for deposition reactors |
US20100266765A1 (en) * | 2009-04-21 | 2010-10-21 | White Carl L | Method and apparatus for growing a thin film onto a substrate |
US9117773B2 (en) * | 2009-08-26 | 2015-08-25 | Asm America, Inc. | High concentration water pulses for atomic layer deposition |
KR101084275B1 (ko) * | 2009-09-22 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 소스 가스 공급 유닛, 이를 구비하는 증착 장치 및 방법 |
WO2012071661A1 (en) * | 2010-11-30 | 2012-06-07 | Socpra Sciences Et Genie S.E.C. | Epitaxial deposition apparatus, gas injectors, and chemical vapor management system associated therewith |
US9454158B2 (en) | 2013-03-15 | 2016-09-27 | Bhushan Somani | Real time diagnostics for flow controller systems and methods |
CN103922257B (zh) * | 2014-04-25 | 2016-05-04 | 安徽亚格盛电子新材料有限公司 | 直接充装mo源的装置 |
US10983538B2 (en) | 2017-02-27 | 2021-04-20 | Flow Devices And Systems Inc. | Systems and methods for flow sensor back pressure adjustment for mass flow controller |
US11939668B2 (en) * | 2022-04-26 | 2024-03-26 | Applied Materials, Inc. | Gas delivery for tungsten-containing layer |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US787076A (en) * | 1902-01-30 | 1905-04-11 | Crane Co | Valve. |
GB787076A (en) * | 1954-10-20 | 1957-12-04 | Ohio Commw Eng Co | Improvements in or relating to gas plating |
US4066481A (en) * | 1974-11-11 | 1978-01-03 | Rockwell International Corporation | Metalorganic chemical vapor deposition of IVA-IVA compounds and composite |
JPS5211176A (en) * | 1975-07-18 | 1977-01-27 | Toshiba Corp | Activation gas reaction apparatus |
GB8428032D0 (en) * | 1984-11-06 | 1984-12-12 | Secr Defence | Growth of crystalline layers |
JPS61254242A (ja) * | 1985-05-01 | 1986-11-12 | Sumitomo Electric Ind Ltd | 原料供給装置 |
EP0236308A1 (de) * | 1985-09-16 | 1987-09-16 | J.C. Schumacher Company | Vakuumdampftransportkontrolle |
US4844006A (en) * | 1988-03-07 | 1989-07-04 | Akzo America Inc. | Apparatus to provide a vaporized reactant for chemical-vapor deposition |
US4904337A (en) * | 1988-06-06 | 1990-02-27 | Raytheon Company | Photo-enhanced pyrolytic MOCVD growth of group II-VI materials |
-
1990
- 1990-09-11 DE DE69006809T patent/DE69006809T2/de not_active Expired - Fee Related
- 1990-09-11 EP EP90117498A patent/EP0419939B1/de not_active Expired - Lifetime
- 1990-09-11 US US07/580,587 patent/US5160542A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0419939A1 (de) | 1991-04-03 |
DE69006809T2 (de) | 1994-09-15 |
US5160542A (en) | 1992-11-03 |
EP0419939B1 (de) | 1994-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |