DE69005075T2 - Hybrider Schalter mit GaAs-MMIC-FET und PIN-Diode. - Google Patents

Hybrider Schalter mit GaAs-MMIC-FET und PIN-Diode.

Info

Publication number
DE69005075T2
DE69005075T2 DE90114294T DE69005075T DE69005075T2 DE 69005075 T2 DE69005075 T2 DE 69005075T2 DE 90114294 T DE90114294 T DE 90114294T DE 69005075 T DE69005075 T DE 69005075T DE 69005075 T2 DE69005075 T2 DE 69005075T2
Authority
DE
Germany
Prior art keywords
mmic
gaas
fet
pin diode
hybrid switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90114294T
Other languages
English (en)
Other versions
DE69005075D1 (de
Inventor
Joel P Dunsmore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69005075D1 publication Critical patent/DE69005075D1/de
Application granted granted Critical
Publication of DE69005075T2 publication Critical patent/DE69005075T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/10—Auxiliary devices for switching or interrupting
    • H01P1/15—Auxiliary devices for switching or interrupting by semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE90114294T 1989-10-13 1990-07-25 Hybrider Schalter mit GaAs-MMIC-FET und PIN-Diode. Expired - Fee Related DE69005075T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/420,973 US5103195A (en) 1989-10-13 1989-10-13 Hybrid gaas mmic fet-pin diode switch

Publications (2)

Publication Number Publication Date
DE69005075D1 DE69005075D1 (de) 1994-01-20
DE69005075T2 true DE69005075T2 (de) 1994-04-21

Family

ID=23668654

Family Applications (1)

Application Number Title Priority Date Filing Date
DE90114294T Expired - Fee Related DE69005075T2 (de) 1989-10-13 1990-07-25 Hybrider Schalter mit GaAs-MMIC-FET und PIN-Diode.

Country Status (4)

Country Link
US (1) US5103195A (de)
EP (1) EP0423442B1 (de)
JP (1) JPH03140001A (de)
DE (1) DE69005075T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4016640C2 (de) * 1990-05-23 1996-02-22 Siemens Ag Sende-Empfangs-Weiche mit PIN-Diode
WO1995013668A1 (en) * 1993-11-09 1995-05-18 Motorola Inc. Electronic antenna switching system
US5488649A (en) 1994-05-06 1996-01-30 Motorola, Inc. Method for validating a communication link
JP3216419B2 (ja) * 1994-05-24 2001-10-09 三菱電機株式会社 移相器
US6070059A (en) * 1995-12-05 2000-05-30 Murata Manufacturing Co., Ltd. High-frequency switch
US6433445B1 (en) 2000-01-06 2002-08-13 International Business Machines Corporation Active mating connector
US6920407B2 (en) * 2000-09-18 2005-07-19 Agilent Technologies, Inc. Method and apparatus for calibrating a multiport test system for measurement of a DUT
EP1320763A4 (de) * 2000-09-18 2005-07-27 Agilent Technologies Inc Verfahren und vorrichtung zur charakterisierung von symmetrischen oder asymmetrischen vorrichtungen mit mehreren anschlüssen
DE10060332B4 (de) * 2000-12-04 2005-02-24 Eads Deutschland Gmbh Verfahren und Vorrichtung zur Millimeterwellen-Leistungsregelung bei einem V-Band-TR-Modul
JP4029169B2 (ja) * 2003-07-07 2008-01-09 株式会社村田製作所 高周波スイッチ回路
KR20070108229A (ko) * 2005-03-05 2007-11-08 이노베이션 엔지니어링, 엘엘씨 전자적 가변 커패시터 어레이
DE102007009815B4 (de) * 2006-09-28 2015-10-22 Rohde & Schwarz Gmbh & Co. Kg Umschaltanordnung
CN101552645A (zh) * 2008-04-02 2009-10-07 鸿富锦精密工业（深圳）有限公司 多路测试装置
WO2009137239A2 (en) * 2008-04-15 2009-11-12 Coto Technology, Inc. Improved form c relay and package using same
US9720060B2 (en) 2011-05-23 2017-08-01 Koninklijke Philips N.V. FET switch as detune circuit for MRI RF coils
CN102437844B (zh) * 2011-10-31 2013-07-31 中国兵器工业集团第二一四研究所苏州研发中心 隔离匹配开关电路
CN104466974B (zh) * 2014-10-13 2016-06-29 福州大学 基于分相控制技术的组合式同步开关
CN105183060A (zh) * 2015-06-16 2015-12-23 中国兵器工业集团第二一四研究所苏州研发中心 一种通用多路输出可调稳压电源接口板
US10145930B1 (en) * 2015-09-30 2018-12-04 Keysight Technologies, Inc. Method and system for phase synchronization and calibration of a multiport vector network analyzer using a single phase reference
US11043944B1 (en) 2019-08-14 2021-06-22 Lockheed Martin Corporation System and method employing low distortion and low loss switch with anti-series diodes
CN115913203B (zh) * 2023-02-21 2023-06-09 成都天大仪器股份有限公司 一种新型固态开关

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4031488A (en) * 1976-04-05 1977-06-21 The United States Of America As Represented By The Secretary Of The Navy Multiple polarization switch
DE2855173C2 (de) * 1978-12-20 1980-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen PIN-Dioden-Hochfrequenzschalter für Sekundärradar-Abfragegeräte mit Nebenzipfelsignalunterdrückung oder -Transponder mit Antennendiversity
GB2121239B (en) * 1982-05-13 1985-10-02 Standard Telephones Cables Ltd A solid state changeover switch for microwave signals
US4556808A (en) * 1982-06-03 1985-12-03 Texas Instruments Incorporated Microwave monolithic spot FET switch configuration
JPS6052101A (ja) * 1983-08-31 1985-03-25 Nippon Chiyoutanpa Kk 高周波切替回路
US4843354A (en) * 1987-12-28 1989-06-27 Motorola, Inc. Broad band microwave biasing networks suitable for being provided in monolithic integrated circuit form
US4897563A (en) * 1988-08-01 1990-01-30 Itt Corporation N-way MMIC redundant switch
US4929855A (en) * 1988-12-09 1990-05-29 Grumman Corporation High frequency switching device

Also Published As

Publication number Publication date
EP0423442B1 (de) 1993-12-08
DE69005075D1 (de) 1994-01-20
JPH03140001A (ja) 1991-06-14
EP0423442A1 (de) 1991-04-24
US5103195A (en) 1992-04-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee