DE68923582T2 - Kühlmodul hoher Leitfähigkeit mit internen Rippen und anpassbaren Stossflächen für VLSI Technologie. - Google Patents

Kühlmodul hoher Leitfähigkeit mit internen Rippen und anpassbaren Stossflächen für VLSI Technologie.

Info

Publication number
DE68923582T2
DE68923582T2 DE68923582T DE68923582T DE68923582T2 DE 68923582 T2 DE68923582 T2 DE 68923582T2 DE 68923582 T DE68923582 T DE 68923582T DE 68923582 T DE68923582 T DE 68923582T DE 68923582 T2 DE68923582 T2 DE 68923582T2
Authority
DE
Germany
Prior art keywords
high conductivity
cooling module
vlsi technology
internal fins
conductivity cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68923582T
Other languages
English (en)
Other versions
DE68923582D1 (de
Inventor
Joseph Louis Horvath
Robert Glenn Biskeborn
Joseph Matthew Harvilchuck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68923582D1 publication Critical patent/DE68923582D1/de
Application granted granted Critical
Publication of DE68923582T2 publication Critical patent/DE68923582T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE68923582T 1988-05-26 1989-04-25 Kühlmodul hoher Leitfähigkeit mit internen Rippen und anpassbaren Stossflächen für VLSI Technologie. Expired - Fee Related DE68923582T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/198,962 US5052481A (en) 1988-05-26 1988-05-26 High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology

Publications (2)

Publication Number Publication Date
DE68923582D1 DE68923582D1 (de) 1995-08-31
DE68923582T2 true DE68923582T2 (de) 1996-03-07

Family

ID=22735621

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68923582T Expired - Fee Related DE68923582T2 (de) 1988-05-26 1989-04-25 Kühlmodul hoher Leitfähigkeit mit internen Rippen und anpassbaren Stossflächen für VLSI Technologie.

Country Status (4)

Country Link
US (1) US5052481A (de)
EP (1) EP0344084B1 (de)
JP (1) JP2531787B2 (de)
DE (1) DE68923582T2 (de)

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US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
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US5574626A (en) * 1995-07-12 1996-11-12 Unisys Corporation Add-on heat sink
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US5696405A (en) * 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US5706171A (en) * 1995-11-20 1998-01-06 International Business Machines Corporation Flat plate cooling using a thermal paste retainer
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US6134783A (en) * 1997-10-29 2000-10-24 Bargman; Ronald D. Heat sink and process of manufacture
US6179047B1 (en) * 1998-12-10 2001-01-30 Unisys Corporation Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile
US6116331A (en) * 1998-12-10 2000-09-12 Unisys Corporation Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile
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US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
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US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6644395B1 (en) 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear
JP4415503B2 (ja) * 2000-05-12 2010-02-17 株式会社デンソー 半導体装置
JP3280954B2 (ja) * 2000-06-02 2002-05-13 株式会社東芝 回路モジュール及び回路モジュールを搭載した電子機器
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
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US7167379B2 (en) * 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
US6988531B2 (en) * 2002-01-11 2006-01-24 Intel Corporation Micro-chimney and thermosiphon die-level cooling
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
DE60229072D1 (de) * 2002-02-06 2008-11-06 Parker Hannifin Corp Wärmesteuerungsmaterialien mit phasenumwandlungsdispersion
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US6956739B2 (en) 2002-10-29 2005-10-18 Parker-Hannifin Corporation High temperature stable thermal interface material
US6910271B2 (en) * 2002-10-29 2005-06-28 Hewlett-Packard Development Company, L.P. Mechanical highly compliant thermal interface pad
US6778393B2 (en) * 2002-12-02 2004-08-17 International Business Machines Corporation Cooling device with multiple compliant elements
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US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
US20050248924A1 (en) * 2004-05-10 2005-11-10 International Business Machines Corporation Thermal interface for electronic equipment
US7408780B2 (en) * 2005-06-14 2008-08-05 International Business Machines Corporation Compliant thermal interface structure utilizing spring elements with fins
US7355855B2 (en) * 2005-06-14 2008-04-08 International Business Machines Corporation Compliant thermal interface structure utilizing spring elements
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
JP4868547B2 (ja) * 2006-06-08 2012-02-01 インターナショナル・ビジネス・マシーンズ・コーポレーション 熱伝導モジュールとその製造方法、並びに、高熱伝導で柔軟なシートの製造方法
US7447035B2 (en) * 2006-12-01 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device assembly
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US7405940B1 (en) * 2007-04-25 2008-07-29 International Business Machines Corporation Piston reset apparatus for a multichip module and method for resetting pistons in the same
US8289714B2 (en) * 2008-01-04 2012-10-16 APlus Mobile Inc. Ruggedized computer and aspects thereof
US20090194263A1 (en) * 2008-02-05 2009-08-06 Bernardes Marco Aurelio Dos Santos Methods and mechanisms for thermal semi conduction
US8411451B2 (en) * 2008-07-30 2013-04-02 Panasonic Corporation Power line communication apparatus
EP2247172B1 (de) * 2009-04-27 2013-01-30 Siemens Aktiengesellschaft Kühlsystem, Kühlplatte und Baugruppe mit Kühlsystem
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
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US8094453B2 (en) * 2009-09-30 2012-01-10 International Business Machines Corporation Compliant conduction rail assembly and method facilitating cooling of an electronics structure
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US9912107B2 (en) 2014-04-01 2018-03-06 Te Connectivity Corporation Plug and receptacle assembly having a thermally conductive interface
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US9496194B2 (en) 2014-11-07 2016-11-15 International Business Machines Corporation Customized module lid
CN206893612U (zh) * 2017-05-08 2018-01-16 爱美达（深圳）热能系统有限公司 一种用于高温真空焊接液冷板中的密封结构
CN108225070B (zh) * 2018-02-13 2019-06-11 山东大学 一种内部压力分配均衡的热管
CN108325747B (zh) * 2018-03-01 2019-03-29 山东大学 一种热管及基于脱硫废水处理的分区增湿干湿耦合的静电除尘系统
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US11486661B2 (en) * 2020-05-28 2022-11-01 Te Connectivity Solutions Gmbh Thermal bridge for an electrical component
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Also Published As

Publication number Publication date
EP0344084A2 (de) 1989-11-29
JP2531787B2 (ja) 1996-09-04
DE68923582D1 (de) 1995-08-31
EP0344084A3 (en) 1990-11-28
EP0344084B1 (de) 1995-07-26
JPH0220049A (ja) 1990-01-23
US5052481A (en) 1991-10-01

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