DE68920613D1 - Mikrowellenplasmavorrichtung für ausgedehnte Oberfläche. - Google Patents

Mikrowellenplasmavorrichtung für ausgedehnte Oberfläche.

Info

Publication number
DE68920613D1
DE68920613D1 DE68920613T DE68920613T DE68920613D1 DE 68920613 D1 DE68920613 D1 DE 68920613D1 DE 68920613 T DE68920613 T DE 68920613T DE 68920613 T DE68920613 T DE 68920613T DE 68920613 D1 DE68920613 D1 DE 68920613D1
Authority
DE
Germany
Prior art keywords
microwave plasma
extended surface
plasma device
extended
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68920613T
Other languages
English (en)
Other versions
DE68920613T2 (de
Inventor
Joachim Doehler
Jeffrey M Krisko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Energy Conversion Devices Inc
Original Assignee
Canon Inc
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Energy Conversion Devices Inc filed Critical Canon Inc
Publication of DE68920613D1 publication Critical patent/DE68920613D1/de
Application granted granted Critical
Publication of DE68920613T2 publication Critical patent/DE68920613T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/02—Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma
    • H05H1/16—Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma using externally-applied electric and magnetic fields
    • H05H1/18—Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma using externally-applied electric and magnetic fields wherein the fields oscillate at very high frequency, e.g. in the microwave range, e.g. using cyclotron resonance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32238—Windows
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE68920613T 1988-03-29 1989-03-29 Mikrowellenplasmavorrichtung für ausgedehnte Oberfläche. Expired - Lifetime DE68920613T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/174,659 US4893584A (en) 1988-03-29 1988-03-29 Large area microwave plasma apparatus

Publications (2)

Publication Number Publication Date
DE68920613D1 true DE68920613D1 (de) 1995-03-02
DE68920613T2 DE68920613T2 (de) 1995-05-24

Family

ID=22637010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920613T Expired - Lifetime DE68920613T2 (de) 1988-03-29 1989-03-29 Mikrowellenplasmavorrichtung für ausgedehnte Oberfläche.

Country Status (8)

Country Link
US (1) US4893584A (de)
EP (1) EP0335675B1 (de)
JP (1) JP2828257B2 (de)
KR (1) KR960014436B1 (de)
CN (1) CN1031072C (de)
CA (1) CA1317644C (de)
DE (1) DE68920613T2 (de)
HK (1) HK1001069A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130170A (en) * 1989-06-28 1992-07-14 Canon Kabushiki Kaisha Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation
US5114770A (en) * 1989-06-28 1992-05-19 Canon Kabushiki Kaisha Method for continuously forming functional deposited films with a large area by a microwave plasma cvd method
US5231048A (en) * 1991-12-23 1993-07-27 United Solar Systems Corporation Microwave energized deposition process wherein the deposition is carried out at a pressure less than the pressure of the minimum point on the deposition system's paschen curve
JP3158715B2 (ja) * 1992-03-30 2001-04-23 株式会社ダイヘン プラズマ処理装置
AU5598194A (en) * 1992-11-13 1994-06-08 Energy Conversion Devices Inc. Microwave apparatus for depositing thin films
JPH07169740A (ja) * 1993-12-14 1995-07-04 Nec Corp マイクロ波プラズマ処理装置
US5753045A (en) * 1995-01-25 1998-05-19 Balzers Aktiengesellschaft Vacuum treatment system for homogeneous workpiece processing
EP0724026B1 (de) * 1995-01-25 1999-10-13 Balzers Aktiengesellschaft Verfahren zur reaktiven Schichtabscheidung
JP2967060B2 (ja) * 1997-02-21 1999-10-25 日本高周波株式会社 マイクロ波プラズマ発生装置
DE19726663A1 (de) * 1997-06-23 1999-01-28 Sung Spitzl Hildegard Dr Ing Vorrichtung zur Erzeugung von homogenen Mikrowellenplasmen
JPH11102799A (ja) * 1997-09-26 1999-04-13 Mitsubishi Electric Corp プラズマ発生装置
US6209482B1 (en) * 1997-10-01 2001-04-03 Energy Conversion Devices, Inc. Large area microwave plasma apparatus with adaptable applicator
US6186090B1 (en) * 1999-03-04 2001-02-13 Energy Conversion Devices, Inc. Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
FR2792854B1 (fr) * 1999-04-29 2001-08-03 Sidel Sa Dispositif pour le depot par plasma micro-ondes d'un revetement sur un recipient en materiau thermoplastique
DE19928876A1 (de) * 1999-06-24 2000-12-28 Leybold Systems Gmbh Vorrichtung zur lokalen Erzeugung eines Plasmas in einer Behandlungskammer durch Mikrowellenanregung
JP2001203099A (ja) * 2000-01-20 2001-07-27 Yac Co Ltd プラズマ生成装置およびプラズマ処理装置
JP4441038B2 (ja) * 2000-02-07 2010-03-31 東京エレクトロン株式会社 マイクロ波プラズマ処理装置
JP4173679B2 (ja) * 2002-04-09 2008-10-29 エム・イー・エス・アフティ株式会社 Ｅｃｒプラズマ源およびｅｃｒプラズマ装置
US6870124B2 (en) * 2002-05-08 2005-03-22 Dana Corporation Plasma-assisted joining
US20060228497A1 (en) * 2002-05-08 2006-10-12 Satyendra Kumar Plasma-assisted coating
US20060237398A1 (en) * 2002-05-08 2006-10-26 Dougherty Mike L Sr Plasma-assisted processing in a manufacturing line
US7432470B2 (en) 2002-05-08 2008-10-07 Btu International, Inc. Surface cleaning and sterilization
US6667466B1 (en) 2002-11-20 2003-12-23 Maytag Corporation Microwave delivery system for a cooking appliance
US6900424B2 (en) 2002-11-20 2005-05-31 Maytag Corporation Microwave delivery system for a cooking appliance
US7189940B2 (en) * 2002-12-04 2007-03-13 Btu International Inc. Plasma-assisted melting
GB0516695D0 (en) * 2005-08-15 2005-09-21 Boc Group Plc Microwave plasma reactor
FR2921388B1 (fr) * 2007-09-20 2010-11-26 Air Liquide Dispositif et procede de depot cvd assiste par plasma tres haute frequence a la pression atmospherique, et ses applications
EP2490801B1 (de) * 2009-10-23 2017-06-28 Advanced Microwave Technologies Ltd Verfahren zum behandeln eines fluiden mit mikrowellen
KR101932578B1 (ko) * 2010-04-30 2018-12-28 어플라이드 머티어리얼스, 인코포레이티드 수직 인라인 화학기상증착 시스템
JP6344437B2 (ja) * 2016-07-27 2018-06-20 トヨタ自動車株式会社 高周波供給構造
GB2576546A (en) * 2018-08-23 2020-02-26 Dyson Technology Ltd An apparatus
CN115100830B (zh) * 2022-07-01 2023-05-16 中国人民解放军国防科技大学 基于等离子体及光敏二极管的高功率微波探测告警平台

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374393A (en) * 1965-02-12 1968-03-19 Melpar Inc Intense incoherent light source obtained by quenching the higher excited states and concentrating the energy on the lower states
US3814983A (en) * 1972-02-07 1974-06-04 C Weissfloch Apparatus and method for plasma generation and material treatment with electromagnetic radiation
JPS55131175A (en) * 1979-03-30 1980-10-11 Toshiba Corp Surface treatment apparatus with microwave plasma
DE3147986C2 (de) * 1981-12-04 1992-02-27 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zur Erzeugung eines Mikrowellenplasmas für die Behandlung von Substraten, insbesondere zur Plasmapolymerisation von Monomeren
JPH0635323B2 (ja) * 1982-06-25 1994-05-11 株式会社日立製作所 表面処理方法
US4504518A (en) * 1982-09-24 1985-03-12 Energy Conversion Devices, Inc. Method of making amorphous semiconductor alloys and devices using microwave energy
US4517223A (en) * 1982-09-24 1985-05-14 Sovonics Solar Systems Method of making amorphous semiconductor alloys and devices using microwave energy
JPS6016424A (ja) * 1983-07-08 1985-01-28 Fujitsu Ltd マイクロ波プラズマ処理方法及びその装置
US4581100A (en) * 1984-10-29 1986-04-08 International Business Machines Corporation Mixed excitation plasma etching system
US4566403A (en) * 1985-01-30 1986-01-28 Sovonics Solar Systems Apparatus for microwave glow discharge deposition
US4729341A (en) * 1985-09-18 1988-03-08 Energy Conversion Devices, Inc. Method and apparatus for making electrophotographic devices
EP0264913B1 (de) * 1986-10-20 1994-06-22 Hitachi, Ltd. Plasmabearbeitungsgerät

Also Published As

Publication number Publication date
JPH0211772A (ja) 1990-01-16
KR960014436B1 (ko) 1996-10-15
JP2828257B2 (ja) 1998-11-25
CN1040122A (zh) 1990-02-28
CA1317644C (en) 1993-05-11
CN1031072C (zh) 1996-02-21
KR890015649A (ko) 1989-10-30
US4893584A (en) 1990-01-16
EP0335675B1 (de) 1995-01-18
EP0335675A3 (en) 1990-02-07
HK1001069A1 (en) 1998-05-22
DE68920613T2 (de) 1995-05-24
EP0335675A2 (de) 1989-10-04

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Legal Events

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8364 No opposition during term of opposition