DE68920370T2 - Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers. - Google Patents

Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers.

Info

Publication number
DE68920370T2
DE68920370T2 DE68920370T DE68920370T DE68920370T2 DE 68920370 T2 DE68920370 T2 DE 68920370T2 DE 68920370 T DE68920370 T DE 68920370T DE 68920370 T DE68920370 T DE 68920370T DE 68920370 T2 DE68920370 T2 DE 68920370T2
Authority
DE
Germany
Prior art keywords
manufacturing
piezoelectric composite
composite transducer
transducer
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920370T
Other languages
English (en)
Other versions
DE68920370D1 (de
Inventor
John Joseph Zola
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of DE68920370D1 publication Critical patent/DE68920370D1/de
Application granted granted Critical
Publication of DE68920370T2 publication Critical patent/DE68920370T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0633—Cylindrical array
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/02—Bending or folding
    • B29C53/04—Bending or folding of plates or sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S84/00—Music
    • Y10S84/24—Piezoelectrical transducers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
DE68920370T 1988-07-15 1989-07-10 Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers. Expired - Fee Related DE68920370T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/219,520 US4869768A (en) 1988-07-15 1988-07-15 Ultrasonic transducer arrays made from composite piezoelectric materials

Publications (2)

Publication Number Publication Date
DE68920370D1 DE68920370D1 (de) 1995-02-16
DE68920370T2 true DE68920370T2 (de) 1995-07-27

Family

ID=22819603

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920370T Expired - Fee Related DE68920370T2 (de) 1988-07-15 1989-07-10 Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers.

Country Status (4)

Country Link
US (1) US4869768A (de)
EP (1) EP0351015B1 (de)
JP (1) JPH0267099A (de)
DE (1) DE68920370T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022003089A1 (de) 2022-08-23 2024-02-29 Mercedes-Benz Group AG Signalausgabevorrichtung und Kraftfahrzeug mit einer solchen Signalausgabevorrichtung

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* Cited by examiner, † Cited by third party
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US5131382A (en) * 1989-03-27 1992-07-21 Meyer William F Endoscopic percutaneous discectomy device
US5065068A (en) * 1989-06-07 1991-11-12 Oakley Clyde G Ferroelectric ceramic transducer
DE3932959C1 (de) * 1989-10-03 1991-04-11 Richard Wolf Gmbh, 7134 Knittlingen, De
US5044053A (en) * 1990-05-21 1991-09-03 Acoustic Imaging Technologies Corporation Method of manufacturing a curved array ultrasonic transducer assembly
US5424596A (en) * 1992-10-05 1995-06-13 Trw Inc. Activated structure
US6252334B1 (en) 1993-01-21 2001-06-26 Trw Inc. Digital control of smart structures
US5525853A (en) * 1993-01-21 1996-06-11 Trw Inc. Smart structures for vibration suppression
US5423220A (en) * 1993-01-29 1995-06-13 Parallel Design Ultrasonic transducer array and manufacturing method thereof
US5412854A (en) * 1993-06-18 1995-05-09 Humphrey Instruments, Inc. Method of making a high frequency focused transducer
US5743855A (en) * 1995-03-03 1998-04-28 Acuson Corporation Broadband phased array transducer design with frequency controlled two dimension capability and methods for manufacture thereof
US5792058A (en) * 1993-09-07 1998-08-11 Acuson Corporation Broadband phased array transducer with wide bandwidth, high sensitivity and reduced cross-talk and method for manufacture thereof
US5415175A (en) * 1993-09-07 1995-05-16 Acuson Corporation Broadband phased array transducer design with frequency controlled two dimension capability and methods for manufacture thereof
EP0671221B1 (de) * 1994-03-11 2000-04-26 Intravascular Research Limited Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung
US5684884A (en) * 1994-05-31 1997-11-04 Hitachi Metals, Ltd. Piezoelectric loudspeaker and a method for manufacturing the same
US5730113A (en) * 1995-12-11 1998-03-24 General Electric Company Dicing saw alignment for array ultrasonic transducer fabrication
US7226417B1 (en) * 1995-12-26 2007-06-05 Volcano Corporation High resolution intravascular ultrasound transducer assembly having a flexible substrate
US5942137A (en) * 1997-08-29 1999-08-24 Scitex Corporation Ltd. Method and apparatus for laser scribing grooves on hard crystals
DE19954020C2 (de) * 1999-11-10 2002-02-28 Fraunhofer Ges Forschung Verfahren zur Herstellung eines piezoelektrischen Wandlers
US6726631B2 (en) * 2000-08-08 2004-04-27 Ge Parallel Designs, Inc. Frequency and amplitude apodization of transducers
US7867178B2 (en) 2003-02-26 2011-01-11 Sanuwave, Inc. Apparatus for generating shock waves with piezoelectric fibers integrated in a composite
US7348712B2 (en) * 2004-04-16 2008-03-25 Kabushiki Kaisha Toshiba Ultrasonic probe and ultrasonic diagnostic apparatus
JP4469928B2 (ja) * 2004-09-22 2010-06-02 ベックマン・コールター・インコーポレーテッド 攪拌容器
JPWO2007113907A1 (ja) * 2006-04-05 2009-08-13 住友金属工業株式会社 超音波探触子、超音波探傷方法及び超音波探傷装置
US8093782B1 (en) 2007-08-14 2012-01-10 University Of Virginia Patent Foundation Specialized, high performance, ultrasound transducer substrates and related method thereof
US7804228B2 (en) * 2007-12-18 2010-09-28 Boston Scientific Scimed, Inc. Composite passive materials for ultrasound transducers
US20100171395A1 (en) * 2008-10-24 2010-07-08 University Of Southern California Curved ultrasonic array transducers
US9364863B2 (en) * 2013-01-23 2016-06-14 Siemens Medical Solutions Usa, Inc. Method for forming an ultrasound transducer array
CN105702851B (zh) * 2014-11-28 2018-09-25 中国科学院深圳先进技术研究院 2-2型压电复合材料及其制备方法
DE102017111624A1 (de) * 2017-05-29 2018-11-29 Endress + Hauser Flowtec Ag Ultraschallwandler
CN109760243B (zh) * 2018-12-28 2021-04-27 广州瑞派医疗器械有限责任公司 凸阵式超声波换能器制造设备及方法
CN112008959B (zh) * 2020-08-18 2022-02-18 长安大学 一种用于现场弯折frp筋的装置及弯折方法
CN112206004B (zh) * 2020-09-25 2023-08-25 飞依诺科技股份有限公司 超声探头及其制造方法
CN116973458B (zh) * 2023-09-25 2023-12-15 中北大学 一种压电复合材料阵列结构的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3496617A (en) * 1967-11-08 1970-02-24 Us Navy Technique for curving piezoelectric ceramics
US4250603A (en) * 1979-04-30 1981-02-17 Honeywell Inc. Method of making electroded wafer for electro-optic devices
US4281550A (en) * 1979-12-17 1981-08-04 North American Philips Corporation Curved array of sequenced ultrasound transducers
JPS59229999A (ja) * 1983-06-10 1984-12-24 Matsushita Electric Ind Co Ltd 超音波探触子の製造方法
DE3437862A1 (de) * 1983-10-17 1985-05-23 Hitachi Medical Corp., Tokio/Tokyo Ultraschallwandler und verfahren zu seiner herstellung
SU1235431A1 (ru) * 1984-01-27 1987-10-07 Всесоюзный Научно-Исследовательский Институт По Разработке Неразрушающих Методов И Средств Контроля Качества Материалов Способ изготовлени фокусирующих акустических преобразователей
US4658176A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Ultrasonic transducer using piezoelectric composite
JPH0660896B2 (ja) * 1984-11-02 1994-08-10 株式会社日立製作所 超音波探触子
US4788096A (en) * 1985-06-06 1988-11-29 Hoechst Celanese Corporation Devices for making piezoelectric ceramic or ceramic-base composite sensors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022003089A1 (de) 2022-08-23 2024-02-29 Mercedes-Benz Group AG Signalausgabevorrichtung und Kraftfahrzeug mit einer solchen Signalausgabevorrichtung

Also Published As

Publication number Publication date
EP0351015A2 (de) 1990-01-17
EP0351015B1 (de) 1995-01-04
DE68920370D1 (de) 1995-02-16
JPH0267099A (ja) 1990-03-07
EP0351015A3 (de) 1991-09-25
US4869768A (en) 1989-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee