DE68915801D1 - Vorrichtung und Verfahren zur Verwendung einer Plattiermaske. - Google Patents
Vorrichtung und Verfahren zur Verwendung einer Plattiermaske.Info
- Publication number
- DE68915801D1 DE68915801D1 DE68915801T DE68915801T DE68915801D1 DE 68915801 D1 DE68915801 D1 DE 68915801D1 DE 68915801 T DE68915801 T DE 68915801T DE 68915801 T DE68915801 T DE 68915801T DE 68915801 D1 DE68915801 D1 DE 68915801D1
- Authority
- DE
- Germany
- Prior art keywords
- plating mask
- plating
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8803186A GB2214930A (en) | 1988-02-11 | 1988-02-11 | Mask for use in electriplating on elongate substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE68915801D1 true DE68915801D1 (de) | 1994-07-14 |
Family
ID=10631540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68915801T Expired - Lifetime DE68915801D1 (de) | 1988-02-11 | 1989-01-27 | Vorrichtung und Verfahren zur Verwendung einer Plattiermaske. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4921583A (de) |
EP (1) | EP0328278B1 (de) |
DE (1) | DE68915801D1 (de) |
GB (1) | GB2214930A (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994020223A1 (en) * | 1989-01-05 | 1994-09-15 | Tamglass Engineering Oy | Method and system for applying a marking to a substrate, particularly a painted border adjacent to and around a windshield plate |
DE4019643A1 (de) * | 1990-06-20 | 1992-01-09 | Duerrwaechter E Dr Doduco | Vorrichtung zur selektiven, fortlaufenden, galvanischen beschichtung eines bandes |
US5114557A (en) * | 1991-02-20 | 1992-05-19 | Tooltek Engineering Corp. | Selective plating apparatus with optical alignment sensor |
NL9101544A (nl) * | 1991-09-13 | 1993-04-01 | Meco Equip Eng | Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten. |
FR2696478B1 (fr) * | 1992-10-05 | 1994-10-28 | Commissariat Energie Atomique | Procédé de dépôt électrolytique d'un métal sur un substrat souple faiblement conducteur, dispositif de dépôt électrolytique permettant la réalisation de ce procédé et produit obtenu par ce procédé. |
GB2283497B (en) * | 1993-11-04 | 1997-07-30 | Electroplating Engineers Eesa | Electroplating apparatus |
AU3426697A (en) * | 1996-02-09 | 1997-08-28 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College, The | High aspect ratio, microstructure-covered, macroscopic surfaces |
CA2572499A1 (en) * | 1997-04-04 | 1998-10-15 | University Of Southern California | Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials |
WO2000006806A2 (de) * | 1998-07-27 | 2000-02-10 | Siemens Electromechanical Components Gmbh & Co. Kg | Vorrichtung zum galvanischen abscheiden und abtragen von metall |
US7097755B2 (en) * | 1998-12-01 | 2006-08-29 | Asm Nutool, Inc. | Electrochemical mechanical processing with advancible sweeper |
US6454916B1 (en) * | 2000-01-05 | 2002-09-24 | Advanced Micro Devices, Inc. | Selective electroplating with direct contact chemical polishing |
FR2828890B1 (fr) * | 2001-08-24 | 2004-02-13 | Itt Mfg Enterprises Inc | Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition |
US9614266B2 (en) | 2001-12-03 | 2017-04-04 | Microfabrica Inc. | Miniature RF and microwave components and methods for fabricating such components |
US20050023145A1 (en) * | 2003-05-07 | 2005-02-03 | Microfabrica Inc. | Methods and apparatus for forming multi-layer structures using adhered masks |
US7259640B2 (en) | 2001-12-03 | 2007-08-21 | Microfabrica | Miniature RF and microwave components and methods for fabricating such components |
US20030168344A1 (en) * | 2002-03-08 | 2003-09-11 | Applied Materials, Inc. | Selective metal deposition for electrochemical plating |
US8613846B2 (en) * | 2003-02-04 | 2013-12-24 | Microfabrica Inc. | Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
US10297421B1 (en) | 2003-05-07 | 2019-05-21 | Microfabrica Inc. | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures |
US9671429B2 (en) | 2003-05-07 | 2017-06-06 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
US8734421B2 (en) * | 2003-06-30 | 2014-05-27 | Johnson & Johnson Consumer Companies, Inc. | Methods of treating pores on the skin with electricity |
US10641792B2 (en) | 2003-12-31 | 2020-05-05 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
US7655117B2 (en) * | 2005-04-06 | 2010-02-02 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
US7744732B2 (en) * | 2005-04-06 | 2010-06-29 | Leviton Manufacturing Company, Inc. | Continuous plating system and method with mask registration |
US20080128019A1 (en) * | 2006-12-01 | 2008-06-05 | Applied Materials, Inc. | Method of metallizing a solar cell substrate |
US7799182B2 (en) * | 2006-12-01 | 2010-09-21 | Applied Materials, Inc. | Electroplating on roll-to-roll flexible solar cell substrates |
US20080127490A1 (en) * | 2006-12-01 | 2008-06-05 | Lotes Co., Ltd. | Manufacture process of connector |
CN101368284B (zh) * | 2007-08-15 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
US8182655B2 (en) * | 2007-09-05 | 2012-05-22 | Leviton Manufacturing Co., Inc. | Plating systems and methods |
ES2552731T3 (es) * | 2007-09-28 | 2015-12-01 | Johnson & Johnson Consumer Companies, Inc. | Partículas de generación de electricidad y el uso de las mismas |
US20120089232A1 (en) | 2009-03-27 | 2012-04-12 | Jennifer Hagyoung Kang Choi | Medical devices with galvanic particulates |
US9583125B1 (en) * | 2009-12-16 | 2017-02-28 | Magnecomp Corporation | Low resistance interface metal for disk drive suspension component grounding |
US20110236491A1 (en) * | 2010-03-25 | 2011-09-29 | Jeannette Chantalat | Topical anti-inflammatory composition |
US9303328B2 (en) * | 2014-01-09 | 2016-04-05 | Teledyne Instruments, Inc. | System and method for electroplating of hole surfaces |
US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
US12078657B2 (en) | 2019-12-31 | 2024-09-03 | Microfabrica Inc. | Compliant pin probes with extension springs, methods for making, and methods for using |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
US3723283A (en) * | 1970-12-23 | 1973-03-27 | Select Au Matic | Selective plating system |
DE2324834C2 (de) * | 1973-05-17 | 1978-09-07 | Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim | Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren |
US4132617A (en) * | 1973-10-04 | 1979-01-02 | Galentan, A.G. | Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape |
CH594067A5 (de) * | 1973-10-04 | 1977-12-30 | Galentan Ag | |
GB1463431A (en) * | 1975-06-16 | 1977-02-02 | Standard Telephones Cables Ltd | Selective plating or coating |
WO1981003187A1 (en) * | 1980-05-07 | 1981-11-12 | Kontakta A | Band-plating apparatus |
DE3165132D1 (en) * | 1980-12-23 | 1984-08-30 | Owen S G Ltd | Improvements in or relating to selective plating |
NL8101106A (nl) * | 1981-03-07 | 1982-10-01 | Galentan Ag | Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen. |
NL8101105A (nl) * | 1981-03-07 | 1982-10-01 | Galentan Ag | Werkwijze voor het aanbrengen van al dan niet geheel gesloten lusvormige bedekkingen. |
US4431500A (en) * | 1981-12-15 | 1984-02-14 | Vanguard Research Associates, Inc. | Selective electroplating apparatus |
US4376017A (en) * | 1982-01-04 | 1983-03-08 | Western Electric Co., Inc. | Methods of electrolytically treating portions of digitated strips and treating cell |
DE3212152C2 (de) * | 1982-04-01 | 1985-01-17 | Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim | Vorrichtung zum selektiven galvanischen Beschichten eines Bandes |
JPS60190596A (ja) * | 1984-03-09 | 1985-09-28 | Sonitsukusu:Kk | 部分メツキ用フイルムマスク |
US4582583A (en) * | 1984-12-07 | 1986-04-15 | National Semiconductor Corporation | Continuous stripe plating apparatus |
NL8600838A (nl) * | 1986-04-02 | 1987-11-02 | Meco Equip Eng | Werkwijze en inrichting voor het langs electrolytische weg aanbrengen van een metaalbedekking op in een band samenhangende langwerpige metalen en /of gemetalliseerde voorwerpen. |
-
1988
- 1988-02-11 GB GB8803186A patent/GB2214930A/en not_active Withdrawn
-
1989
- 1989-01-27 DE DE68915801T patent/DE68915801D1/de not_active Expired - Lifetime
- 1989-01-27 US US07/303,616 patent/US4921583A/en not_active Expired - Lifetime
- 1989-01-27 EP EP89300841A patent/EP0328278B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0328278A1 (de) | 1989-08-16 |
EP0328278B1 (de) | 1994-06-08 |
US4921583A (en) | 1990-05-01 |
GB8803186D0 (en) | 1988-03-09 |
GB2214930A (en) | 1989-09-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |