DE68915801D1 - Vorrichtung und Verfahren zur Verwendung einer Plattiermaske. - Google Patents

Vorrichtung und Verfahren zur Verwendung einer Plattiermaske.

Info

Publication number
DE68915801D1
DE68915801D1 DE68915801T DE68915801T DE68915801D1 DE 68915801 D1 DE68915801 D1 DE 68915801D1 DE 68915801 T DE68915801 T DE 68915801T DE 68915801 T DE68915801 T DE 68915801T DE 68915801 D1 DE68915801 D1 DE 68915801D1
Authority
DE
Germany
Prior art keywords
plating mask
plating
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68915801T
Other languages
English (en)
Inventor
Beverley Sewell
David John Hill
Edgar Charles Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Twickenham Plating & Enamellin
Original Assignee
Twickenham Plating & Enamellin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Twickenham Plating & Enamellin filed Critical Twickenham Plating & Enamellin
Application granted granted Critical
Publication of DE68915801D1 publication Critical patent/DE68915801D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DE68915801T 1988-02-11 1989-01-27 Vorrichtung und Verfahren zur Verwendung einer Plattiermaske. Expired - Lifetime DE68915801D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8803186A GB2214930A (en) 1988-02-11 1988-02-11 Mask for use in electriplating on elongate substrate

Publications (1)

Publication Number Publication Date
DE68915801D1 true DE68915801D1 (de) 1994-07-14

Family

ID=10631540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68915801T Expired - Lifetime DE68915801D1 (de) 1988-02-11 1989-01-27 Vorrichtung und Verfahren zur Verwendung einer Plattiermaske.

Country Status (4)

Country Link
US (1) US4921583A (de)
EP (1) EP0328278B1 (de)
DE (1) DE68915801D1 (de)
GB (1) GB2214930A (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994020223A1 (en) * 1989-01-05 1994-09-15 Tamglass Engineering Oy Method and system for applying a marking to a substrate, particularly a painted border adjacent to and around a windshield plate
DE4019643A1 (de) * 1990-06-20 1992-01-09 Duerrwaechter E Dr Doduco Vorrichtung zur selektiven, fortlaufenden, galvanischen beschichtung eines bandes
US5114557A (en) * 1991-02-20 1992-05-19 Tooltek Engineering Corp. Selective plating apparatus with optical alignment sensor
NL9101544A (nl) * 1991-09-13 1993-04-01 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van uit metaal bestaande bedekkingen op producten.
FR2696478B1 (fr) * 1992-10-05 1994-10-28 Commissariat Energie Atomique Procédé de dépôt électrolytique d'un métal sur un substrat souple faiblement conducteur, dispositif de dépôt électrolytique permettant la réalisation de ce procédé et produit obtenu par ce procédé.
GB2283497B (en) * 1993-11-04 1997-07-30 Electroplating Engineers Eesa Electroplating apparatus
AU3426697A (en) * 1996-02-09 1997-08-28 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College, The High aspect ratio, microstructure-covered, macroscopic surfaces
CA2572786A1 (en) * 1997-04-04 1998-10-15 University Of Southern California Method for electrochemical fabrication including etching to remove flash
WO2000006806A2 (de) * 1998-07-27 2000-02-10 Siemens Electromechanical Components Gmbh & Co. Kg Vorrichtung zum galvanischen abscheiden und abtragen von metall
US7097755B2 (en) * 1998-12-01 2006-08-29 Asm Nutool, Inc. Electrochemical mechanical processing with advancible sweeper
US6454916B1 (en) * 2000-01-05 2002-09-24 Advanced Micro Devices, Inc. Selective electroplating with direct contact chemical polishing
FR2828890B1 (fr) * 2001-08-24 2004-02-13 Itt Mfg Enterprises Inc Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition
US9614266B2 (en) 2001-12-03 2017-04-04 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
AU2002360464A1 (en) * 2001-12-03 2003-06-17 Memgen Corporation Miniature rf and microwave components and methods for fabricating such components
US20030168344A1 (en) * 2002-03-08 2003-09-11 Applied Materials, Inc. Selective metal deposition for electrochemical plating
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US10297421B1 (en) 2003-05-07 2019-05-21 Microfabrica Inc. Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures
TWI297045B (en) * 2003-05-07 2008-05-21 Microfabrica Inc Methods and apparatus for forming multi-layer structures using adhered masks
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US8734421B2 (en) * 2003-06-30 2014-05-27 Johnson & Johnson Consumer Companies, Inc. Methods of treating pores on the skin with electricity
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US7655117B2 (en) * 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US20080128019A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Method of metallizing a solar cell substrate
US7799182B2 (en) * 2006-12-01 2010-09-21 Applied Materials, Inc. Electroplating on roll-to-roll flexible solar cell substrates
US20080127490A1 (en) * 2006-12-01 2008-06-05 Lotes Co., Ltd. Manufacture process of connector
CN101368284B (zh) * 2007-08-15 2010-10-06 富葵精密组件(深圳)有限公司 电镀装置
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
US20100209515A1 (en) * 2007-09-28 2010-08-19 Jeannette Chantalat Electricity-generating particulates and the use thereof
US20120089232A1 (en) 2009-03-27 2012-04-12 Jennifer Hagyoung Kang Choi Medical devices with galvanic particulates
US9583125B1 (en) * 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US20110236491A1 (en) * 2010-03-25 2011-09-29 Jeannette Chantalat Topical anti-inflammatory composition
US9303328B2 (en) * 2014-01-09 2016-04-05 Teledyne Instruments, Inc. System and method for electroplating of hole surfaces
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746630A (en) * 1970-12-08 1973-07-17 Auric Corp Apparatus for selective electroplating of strips
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
DE2324834C2 (de) * 1973-05-17 1978-09-07 Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren
US4132617A (en) * 1973-10-04 1979-01-02 Galentan, A.G. Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
CH594067A5 (de) * 1973-10-04 1977-12-30 Galentan Ag
GB1463431A (en) * 1975-06-16 1977-02-02 Standard Telephones Cables Ltd Selective plating or coating
WO1981003187A1 (en) * 1980-05-07 1981-11-12 Kontakta A Band-plating apparatus
DE3165132D1 (en) * 1980-12-23 1984-08-30 Owen S G Ltd Improvements in or relating to selective plating
NL8101105A (nl) * 1981-03-07 1982-10-01 Galentan Ag Werkwijze voor het aanbrengen van al dan niet geheel gesloten lusvormige bedekkingen.
NL8101106A (nl) * 1981-03-07 1982-10-01 Galentan Ag Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen.
US4431500A (en) * 1981-12-15 1984-02-14 Vanguard Research Associates, Inc. Selective electroplating apparatus
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
DE3212152C2 (de) * 1982-04-01 1985-01-17 Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim Vorrichtung zum selektiven galvanischen Beschichten eines Bandes
JPS60190596A (ja) * 1984-03-09 1985-09-28 Sonitsukusu:Kk 部分メツキ用フイルムマスク
US4582583A (en) * 1984-12-07 1986-04-15 National Semiconductor Corporation Continuous stripe plating apparatus
NL8600838A (nl) * 1986-04-02 1987-11-02 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg aanbrengen van een metaalbedekking op in een band samenhangende langwerpige metalen en /of gemetalliseerde voorwerpen.

Also Published As

Publication number Publication date
EP0328278B1 (de) 1994-06-08
US4921583A (en) 1990-05-01
EP0328278A1 (de) 1989-08-16
GB2214930A (en) 1989-09-13
GB8803186D0 (en) 1988-03-09

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Legal Events

Date Code Title Description
8332 No legal effect for de