CH594067A5 - - Google Patents

Info

Publication number
CH594067A5
CH594067A5 CH1421173A CH1421173A CH594067A5 CH 594067 A5 CH594067 A5 CH 594067A5 CH 1421173 A CH1421173 A CH 1421173A CH 1421173 A CH1421173 A CH 1421173A CH 594067 A5 CH594067 A5 CH 594067A5
Authority
CH
Switzerland
Application number
CH1421173A
Original Assignee
Galentan Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Galentan Ag filed Critical Galentan Ag
Priority to CH1421173A priority Critical patent/CH594067A5/xx
Priority to NLAANVRAGE7316244,A priority patent/NL176284C/xx
Priority to SE7412329A priority patent/SE451468B/xx
Priority to GB4278774A priority patent/GB1477024A/en
Priority to DE2447091A priority patent/DE2447091C2/de
Priority to JP49114579A priority patent/JPS6020476B2/ja
Priority to BR8263/74A priority patent/BR7408263A/pt
Priority to US05/781,825 priority patent/US4132617A/en
Priority to US05/792,088 priority patent/US4264416A/en
Publication of CH594067A5 publication Critical patent/CH594067A5/xx
Priority to HK292/80A priority patent/HK29280A/xx
Priority to MY211/81A priority patent/MY8100211A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
CH1421173A 1973-10-04 1973-10-04 CH594067A5 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
CH1421173A CH594067A5 (de) 1973-10-04 1973-10-04
NLAANVRAGE7316244,A NL176284C (nl) 1973-10-04 1973-11-28 Inrichting voor het door middel van elektrolyse aanbrengen van een of meer streepvormige of vlekvormige metaalbedekkingen.
SE7412329A SE451468B (sv) 1973-10-04 1974-10-01 Apparat for kontinuerlig applicering av ett rems-, band- eller fleckformigt teckskikt av metall pa ett elektriskt ledande band
GB4278774A GB1477024A (en) 1973-10-04 1974-10-02 Continuous application of coatings by electrolysis
DE2447091A DE2447091C2 (de) 1973-10-04 1974-10-02 Vorrichtung zum kontinuierlichen Galvanisieren eines Bandes
JP49114579A JPS6020476B2 (ja) 1973-10-04 1974-10-04 導電性ストリツプ部材上に所定形状の貴金属被覆層を連続的に形成する方法及び装置
BR8263/74A BR7408263A (pt) 1973-10-04 1974-10-04 Processo e dispositivo para a aplicacao continua de camadas de revestimento em forma de tiras faixas ou manchas sobre uma fita metalica
US05/781,825 US4132617A (en) 1973-10-04 1977-03-28 Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
US05/792,088 US4264416A (en) 1973-10-04 1977-04-28 Method for continuous application of strip ribbon or patch-shaped coatings to a metal tape
HK292/80A HK29280A (en) 1973-10-04 1980-05-29 Improvements in and relating to the continuous application of coatings by electrolysis
MY211/81A MY8100211A (en) 1973-10-04 1981-12-30 Improvements in and relating to the continous application of coatings by electrolysis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1421173A CH594067A5 (de) 1973-10-04 1973-10-04

Publications (1)

Publication Number Publication Date
CH594067A5 true CH594067A5 (de) 1977-12-30

Family

ID=4398873

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1421173A CH594067A5 (de) 1973-10-04 1973-10-04

Country Status (10)

Country Link
US (1) US4264416A (de)
JP (1) JPS6020476B2 (de)
BR (1) BR7408263A (de)
CH (1) CH594067A5 (de)
DE (1) DE2447091C2 (de)
GB (1) GB1477024A (de)
HK (1) HK29280A (de)
MY (1) MY8100211A (de)
NL (1) NL176284C (de)
SE (1) SE451468B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156388A (en) * 1979-05-24 1980-12-05 Matsushita Electric Works Ltd Method of forming electric path onto insulating substrate
WO1981003187A1 (en) * 1980-05-07 1981-11-12 Kontakta A Band-plating apparatus
NL8101106A (nl) * 1981-03-07 1982-10-01 Galentan Ag Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen.
DE3343978A1 (de) * 1983-12-06 1985-06-20 Hoesch Ag, 4600 Dortmund Verfahren zum kontinuierlichen elektrolytischen abscheiden von metallen
JPS60257016A (ja) * 1984-06-04 1985-12-18 日本電気株式会社 リ−ドスイツチ接点メツキ方法
DE3708779A1 (de) 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate
DE3937071A1 (de) * 1989-11-07 1991-05-08 Kopperschmidt Mueller & Co Vorrichtung und verfahren zum beschichten von plattenfoermigen substraten, wie leiterplatten
DE4425854C1 (de) * 1994-07-07 1995-11-09 Mannesmann Ag Elektrolytisches Oberflächenbehandlungsverfahren und Anlage zur Durchführung des Verfahrens
US20100193367A1 (en) * 2004-02-11 2010-08-05 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US20050176270A1 (en) * 2004-02-11 2005-08-11 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US7655117B2 (en) * 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US20070001802A1 (en) * 2005-06-30 2007-01-04 Hsieh Ching H Electroplating method in the manufacture of the surface mount precision metal resistor
US8377267B2 (en) * 2009-09-30 2013-02-19 National Semiconductor Corporation Foil plating for semiconductor packaging
WO2014203915A1 (ja) * 2013-06-21 2014-12-24 東レエンジニアリング株式会社 エレクトロスプレー装置
JP2018101798A (ja) * 2018-02-13 2018-06-28 株式会社ニコン 湿式処理方法
JP2023121244A (ja) * 2022-02-21 2023-08-31 Ｄｏｗａメタルテック株式会社 部分めっき用マスク部材及び部分めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2174071A (en) * 1937-04-29 1939-09-26 Chambon Corp Can blank and method of producing same
US3483113A (en) * 1966-02-11 1969-12-09 United States Steel Corp Apparatus for continuously electroplating a metallic strip
DE1816645B2 (de) * 1968-12-23 1971-03-11 Verfahren und vorrichtung zum kontinuierlichen selektiven galvanisieren von baendern
US3634223A (en) * 1970-02-25 1972-01-11 United States Steel Corp Contact assembly
US3746630A (en) * 1970-12-08 1973-07-17 Auric Corp Apparatus for selective electroplating of strips
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
NL170027C (nl) * 1971-05-25 1982-09-16 Galentan Ag Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.

Also Published As

Publication number Publication date
MY8100211A (en) 1981-12-31
NL176284C (nl) 1985-03-18
HK29280A (en) 1980-06-06
DE2447091C2 (de) 1986-11-13
JPS5077230A (de) 1975-06-24
DE2447091A1 (de) 1975-04-10
GB1477024A (en) 1977-06-22
NL7316244A (nl) 1975-04-08
US4264416A (en) 1981-04-28
NL176284B (nl) 1984-10-16
JPS6020476B2 (ja) 1985-05-22
SE7412329L (de) 1975-04-05
BR7408263A (pt) 1975-11-04
SE451468B (sv) 1987-10-12

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Legal Events

Date Code Title Description
PUE Assignment

Owner name: MECO EQUIPMENT ENGINEERS B.V.

PL Patent ceased