SE451468B - Apparat for kontinuerlig applicering av ett rems-, band- eller fleckformigt teckskikt av metall pa ett elektriskt ledande band - Google Patents
Apparat for kontinuerlig applicering av ett rems-, band- eller fleckformigt teckskikt av metall pa ett elektriskt ledande bandInfo
- Publication number
- SE451468B SE451468B SE7412329A SE7412329A SE451468B SE 451468 B SE451468 B SE 451468B SE 7412329 A SE7412329 A SE 7412329A SE 7412329 A SE7412329 A SE 7412329A SE 451468 B SE451468 B SE 451468B
- Authority
- SE
- Sweden
- Prior art keywords
- tape
- strap
- metal
- electrically conductive
- coat layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1421173A CH594067A5 (xx) | 1973-10-04 | 1973-10-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7412329L SE7412329L (xx) | 1975-04-07 |
SE451468B true SE451468B (sv) | 1987-10-12 |
Family
ID=4398873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7412329A SE451468B (sv) | 1973-10-04 | 1974-10-01 | Apparat for kontinuerlig applicering av ett rems-, band- eller fleckformigt teckskikt av metall pa ett elektriskt ledande band |
Country Status (10)
Country | Link |
---|---|
US (1) | US4264416A (xx) |
JP (1) | JPS6020476B2 (xx) |
BR (1) | BR7408263A (xx) |
CH (1) | CH594067A5 (xx) |
DE (1) | DE2447091C2 (xx) |
GB (1) | GB1477024A (xx) |
HK (1) | HK29280A (xx) |
MY (1) | MY8100211A (xx) |
NL (1) | NL176284C (xx) |
SE (1) | SE451468B (xx) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55156388A (en) * | 1979-05-24 | 1980-12-05 | Matsushita Electric Works Ltd | Method of forming electric path onto insulating substrate |
WO1981003187A1 (en) * | 1980-05-07 | 1981-11-12 | Kontakta A | Band-plating apparatus |
NL8101106A (nl) * | 1981-03-07 | 1982-10-01 | Galentan Ag | Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen. |
DE3343978A1 (de) * | 1983-12-06 | 1985-06-20 | Hoesch Ag, 4600 Dortmund | Verfahren zum kontinuierlichen elektrolytischen abscheiden von metallen |
JPS60257016A (ja) * | 1984-06-04 | 1985-12-18 | 日本電気株式会社 | リ−ドスイツチ接点メツキ方法 |
DE3708779A1 (de) | 1986-11-22 | 1988-06-01 | Schempp & Decker Maschinenbau | Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes |
GB2214930A (en) * | 1988-02-11 | 1989-09-13 | Twickenham Plating & Enamellin | Mask for use in electriplating on elongate substrate |
DE3937071A1 (de) * | 1989-11-07 | 1991-05-08 | Kopperschmidt Mueller & Co | Vorrichtung und verfahren zum beschichten von plattenfoermigen substraten, wie leiterplatten |
DE4425854C1 (de) * | 1994-07-07 | 1995-11-09 | Mannesmann Ag | Elektrolytisches Oberflächenbehandlungsverfahren und Anlage zur Durchführung des Verfahrens |
US20050176270A1 (en) * | 2004-02-11 | 2005-08-11 | Daniel Luch | Methods and structures for the production of electrically treated items and electrical connections |
US20100193367A1 (en) * | 2004-02-11 | 2010-08-05 | Daniel Luch | Methods and structures for the production of electrically treated items and electrical connections |
US7744732B2 (en) * | 2005-04-06 | 2010-06-29 | Leviton Manufacturing Company, Inc. | Continuous plating system and method with mask registration |
US7655117B2 (en) * | 2005-04-06 | 2010-02-02 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
US20070001802A1 (en) * | 2005-06-30 | 2007-01-04 | Hsieh Ching H | Electroplating method in the manufacture of the surface mount precision metal resistor |
US8377267B2 (en) * | 2009-09-30 | 2013-02-19 | National Semiconductor Corporation | Foil plating for semiconductor packaging |
WO2014203915A1 (ja) * | 2013-06-21 | 2014-12-24 | 東レエンジニアリング株式会社 | エレクトロスプレー装置 |
JP2018101798A (ja) * | 2018-02-13 | 2018-06-28 | 株式会社ニコン | 湿式処理方法 |
JP2023121244A (ja) * | 2022-02-21 | 2023-08-31 | Dowaメタルテック株式会社 | 部分めっき用マスク部材及び部分めっき方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2174071A (en) * | 1937-04-29 | 1939-09-26 | Chambon Corp | Can blank and method of producing same |
US3483113A (en) * | 1966-02-11 | 1969-12-09 | United States Steel Corp | Apparatus for continuously electroplating a metallic strip |
DE1816645B2 (de) * | 1968-12-23 | 1971-03-11 | Verfahren und vorrichtung zum kontinuierlichen selektiven galvanisieren von baendern | |
US3634223A (en) * | 1970-02-25 | 1972-01-11 | United States Steel Corp | Contact assembly |
US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
US3723283A (en) * | 1970-12-23 | 1973-03-27 | Select Au Matic | Selective plating system |
NL170027C (nl) * | 1971-05-25 | 1982-09-16 | Galentan Ag | Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting. |
-
1973
- 1973-10-04 CH CH1421173A patent/CH594067A5/xx not_active IP Right Cessation
- 1973-11-28 NL NLAANVRAGE7316244,A patent/NL176284C/xx not_active IP Right Cessation
-
1974
- 1974-10-01 SE SE7412329A patent/SE451468B/xx not_active IP Right Cessation
- 1974-10-02 GB GB4278774A patent/GB1477024A/en not_active Expired
- 1974-10-02 DE DE2447091A patent/DE2447091C2/de not_active Expired
- 1974-10-04 BR BR8263/74A patent/BR7408263A/pt unknown
- 1974-10-04 JP JP49114579A patent/JPS6020476B2/ja not_active Expired
-
1977
- 1977-04-28 US US05/792,088 patent/US4264416A/en not_active Expired - Lifetime
-
1980
- 1980-05-29 HK HK292/80A patent/HK29280A/xx unknown
-
1981
- 1981-12-30 MY MY211/81A patent/MY8100211A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
MY8100211A (en) | 1981-12-31 |
DE2447091A1 (de) | 1975-04-10 |
NL176284B (nl) | 1984-10-16 |
CH594067A5 (xx) | 1977-12-30 |
NL176284C (nl) | 1985-03-18 |
JPS6020476B2 (ja) | 1985-05-22 |
JPS5077230A (xx) | 1975-06-24 |
DE2447091C2 (de) | 1986-11-13 |
GB1477024A (en) | 1977-06-22 |
HK29280A (en) | 1980-06-06 |
SE7412329L (xx) | 1975-04-07 |
NL7316244A (nl) | 1975-04-08 |
US4264416A (en) | 1981-04-28 |
BR7408263A (pt) | 1975-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |
Ref document number: 7412329-0 Effective date: 19900706 Format of ref document f/p: F |