DE68910634T2 - Material für elektronische Komponente und Verfahren zur Herstellung dieser Komponente. - Google Patents
Material für elektronische Komponente und Verfahren zur Herstellung dieser Komponente.Info
- Publication number
- DE68910634T2 DE68910634T2 DE89420334T DE68910634T DE68910634T2 DE 68910634 T2 DE68910634 T2 DE 68910634T2 DE 89420334 T DE89420334 T DE 89420334T DE 68910634 T DE68910634 T DE 68910634T DE 68910634 T2 DE68910634 T2 DE 68910634T2
- Authority
- DE
- Germany
- Prior art keywords
- component
- making
- electronic component
- pure
- casings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0094—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with organic materials as the main non-metallic constituent, e.g. resin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
- C22C49/04—Light metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
- C22C49/04—Light metals
- C22C49/06—Aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8812548 | 1988-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68910634D1 DE68910634D1 (de) | 1993-12-16 |
DE68910634T2 true DE68910634T2 (de) | 1994-03-17 |
Family
ID=9370390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89420334T Expired - Lifetime DE68910634T2 (de) | 1988-09-13 | 1989-09-11 | Material für elektronische Komponente und Verfahren zur Herstellung dieser Komponente. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0363286B1 (de) |
AT (1) | ATE97171T1 (de) |
DE (1) | DE68910634T2 (de) |
NO (1) | NO893654L (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017216290A1 (de) * | 2017-09-14 | 2019-03-14 | Freie Universität Berlin | Verbundwerkstoff und Verfahren zu dessen Herstellung |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2590603B2 (ja) * | 1990-10-09 | 1997-03-12 | 三菱電機株式会社 | 電子部品塔載用基材 |
FR2695409B1 (fr) * | 1992-09-10 | 1994-11-25 | Aerospatiale | Matériau composite associant un alliage de magnésium contenant du zirconium à un renfort carbon, et son procédé de fabrication. |
US5528076A (en) * | 1995-02-01 | 1996-06-18 | Motorola, Inc. | Leadframe having metal impregnated silicon carbide mounting area |
AT408345B (de) * | 1999-11-17 | 2001-10-25 | Electrovac | Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper |
AT413704B (de) * | 2004-06-23 | 2006-05-15 | Arc Leichtmetallkompetenzzentrum Ranshofen Gmbh | Kohlenstofffaserverstärktes leichtmetallteil und verfahren zur herstellung desselben |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889348A (en) * | 1969-03-27 | 1975-06-17 | Jerome H Lemelson | Fiber reinforced composite material and method of making same |
US4492265A (en) * | 1980-08-04 | 1985-01-08 | Toyota Jidosha Kabushiki Kaisha | Method for production of composite material using preheating of reinforcing material |
EP0048768B1 (de) * | 1980-09-29 | 1986-01-22 | Kabushiki Kaisha Toshiba | Halbleiteranordnung mit einem auf einem metallischen Substrat gelöteten Halbleiterelement |
JPS5966966A (ja) * | 1982-10-09 | 1984-04-16 | Toyota Motor Corp | 耐熱性軽合金部材およびその製造方法 |
JPS59100235A (ja) * | 1982-11-27 | 1984-06-09 | Nippon Carbon Co Ltd | 炭化ケイ素繊維強化アルミニウム複合材の製造法 |
JPS617637A (ja) * | 1984-06-22 | 1986-01-14 | Furukawa Electric Co Ltd:The | 半導体 |
JPS619537A (ja) * | 1984-06-25 | 1986-01-17 | Mitsubishi Alum Co Ltd | 無機短繊維強化金属複合材の製造法 |
JPS60145340A (ja) * | 1984-08-06 | 1985-07-31 | Res Inst Iron Steel Tohoku Univ | シリコンカ−バイド繊維強化アルミニウム複合材料の製造方法 |
GB2163179B (en) * | 1984-08-13 | 1988-07-20 | Ae Plc | The manufacture of aluminium/zirconia composites |
JPS62199740A (ja) * | 1986-02-27 | 1987-09-03 | Kobe Steel Ltd | Al合金複合材料 |
US4793883A (en) * | 1986-07-14 | 1988-12-27 | National Starch And Chemical Corporation | Method of bonding a semiconductor chip to a substrate |
JPS6483634A (en) * | 1987-09-25 | 1989-03-29 | Sumitomo Electric Industries | Aluminum composite material combining low thermal expansion property with high heat dissipation property |
-
1989
- 1989-09-11 DE DE89420334T patent/DE68910634T2/de not_active Expired - Lifetime
- 1989-09-11 EP EP89420334A patent/EP0363286B1/de not_active Expired - Lifetime
- 1989-09-11 AT AT89420334T patent/ATE97171T1/de not_active IP Right Cessation
- 1989-09-12 NO NO89893654A patent/NO893654L/no unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017216290A1 (de) * | 2017-09-14 | 2019-03-14 | Freie Universität Berlin | Verbundwerkstoff und Verfahren zu dessen Herstellung |
DE102017216290B4 (de) | 2017-09-14 | 2022-09-08 | Freie Universität Berlin | Verbundwerkstoff und Verfahren zu dessen Herstellung, Kühlkörper und elektronisches Bauteil |
Also Published As
Publication number | Publication date |
---|---|
NO893654L (no) | 1990-03-14 |
EP0363286B1 (de) | 1993-11-10 |
EP0363286A2 (de) | 1990-04-11 |
DE68910634D1 (de) | 1993-12-16 |
ATE97171T1 (de) | 1993-11-15 |
EP0363286A3 (en) | 1990-11-28 |
NO893654D0 (no) | 1989-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |