GB8303980D0 - Forming substrates - Google Patents

Forming substrates

Info

Publication number
GB8303980D0
GB8303980D0 GB838303980A GB8303980A GB8303980D0 GB 8303980 D0 GB8303980 D0 GB 8303980D0 GB 838303980 A GB838303980 A GB 838303980A GB 8303980 A GB8303980 A GB 8303980A GB 8303980 D0 GB8303980 D0 GB 8303980D0
Authority
GB
United Kingdom
Prior art keywords
substrate
binder
moulding
mounting area
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB838303980A
Other versions
GB2136210B (en
GB2136210A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wiech R E
Original Assignee
Wiech R E
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wiech R E filed Critical Wiech R E
Priority to GB08303980A priority Critical patent/GB2136210B/en
Publication of GB8303980D0 publication Critical patent/GB8303980D0/en
Publication of GB2136210A publication Critical patent/GB2136210A/en
Priority to GB08620796A priority patent/GB2180409B/en
Application granted granted Critical
Publication of GB2136210B publication Critical patent/GB2136210B/en
Expired legal-status Critical Current

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Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Abstract

A substrate is formed by moulding a composition comprising a particulate material (e.g. alumina) and a binder to provide a planar mounting area for a heat producing element (2) (e.g. an integrated circuit chip) and a heat sink aperture (9) directly below the mounting area. The binder is then at least partly removed and the substrate sintered. A fluid may be circulated through the heat sink aperture (9) or a heat pipe system may be utilised. Conductive tracks (24) may be provided by moulding grooves in the substrate which are further filled with a conductive ink before firing. The grooves enable connecting wires (3) to cross the tracks (24) without the risk of short circuiting. A method of making a mould of reduced size from a master is described in which the uniform shrinkage of a ceramic when fired is used in a sequence of replicating steps. <IMAGE>
GB08303980A 1983-02-14 1983-02-14 Method of forming substrates Expired GB2136210B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB08303980A GB2136210B (en) 1983-02-14 1983-02-14 Method of forming substrates
GB08620796A GB2180409B (en) 1983-02-14 1986-08-28 Method of forming multilayer ceramic substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08303980A GB2136210B (en) 1983-02-14 1983-02-14 Method of forming substrates

Publications (3)

Publication Number Publication Date
GB8303980D0 true GB8303980D0 (en) 1983-03-16
GB2136210A GB2136210A (en) 1984-09-12
GB2136210B GB2136210B (en) 1987-09-23

Family

ID=10537934

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08303980A Expired GB2136210B (en) 1983-02-14 1983-02-14 Method of forming substrates

Country Status (1)

Country Link
GB (1) GB2136210B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
FR2633400B1 (en) * 1988-06-24 1990-11-09 Labo Electronique Physique AUTOMATIC INTEGRATED CIRCUIT CONTROL SYSTEM
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
FR2798000B1 (en) * 1999-08-27 2002-04-05 St Microelectronics Sa METHOD FOR PACKAGING A CHIP WITH PARTICULARLY OPTICAL SENSORS AND SEMICONDUCTOR DEVICE OR PACKAGE CONTAINING SUCH A CHIP
DE102014208526B4 (en) * 2014-05-07 2020-01-30 Infineon Technologies Ag ELECTRONICS ASSEMBLY

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107549A1 (en) * 1970-02-19 1971-09-02 Texas Instruments Inc Carrier of an electronic circuit with a collecting system with heat conduction properties for all directions
JPS5936827B2 (en) * 1979-01-12 1984-09-06 日本電信電話株式会社 Integrated circuit device cooling equipment

Also Published As

Publication number Publication date
GB2136210B (en) 1987-09-23
GB2136210A (en) 1984-09-12

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