DE69126773D1 - Herstellungsverfahren für elektronische packungen - Google Patents

Herstellungsverfahren für elektronische packungen

Info

Publication number
DE69126773D1
DE69126773D1 DE69126773T DE69126773T DE69126773D1 DE 69126773 D1 DE69126773 D1 DE 69126773D1 DE 69126773 T DE69126773 T DE 69126773T DE 69126773 T DE69126773 T DE 69126773T DE 69126773 D1 DE69126773 D1 DE 69126773D1
Authority
DE
Germany
Prior art keywords
preform
filler material
infiltration
spontaneously
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69126773T
Other languages
English (en)
Inventor
Steven Keck
Michael Rocazella
Peter Engelgau
Gregory Hannon
Danny White
Alan Nagelberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lanxide Technology Co LP
Original Assignee
Lanxide Technology Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27048059&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69126773(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lanxide Technology Co LP filed Critical Lanxide Technology Co LP
Priority claimed from PCT/US1991/001247 external-priority patent/WO1991013462A1/en
Application granted granted Critical
Publication of DE69126773D1 publication Critical patent/DE69126773D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • C04B35/65Reaction sintering of free metal- or free silicon-containing compositions
    • C04B35/652Directional oxidation or solidification, e.g. Lanxide process
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/10Alloys containing non-metals
    • C22C1/1005Pretreatment of the non-metallic additives
    • C22C1/1015Pretreatment of the non-metallic additives by preparing or treating a non-metallic additive preform
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/10Alloys containing non-metals
    • C22C1/1036Alloys containing non-metals starting from a melt
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/10Alloys containing non-metals
    • C22C1/1036Alloys containing non-metals starting from a melt
    • C22C1/1057Reactive infiltration
    • C22C1/1063Gas reaction, e.g. lanxide
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C47/00Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02Pretreatment of the fibres or filaments
    • C22C47/06Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Structural Engineering (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Liquid Crystal Substances (AREA)
  • Formation Of Insulating Films (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Glass Compositions (AREA)
  • Packages (AREA)
DE69126773T 1990-02-23 1991-02-25 Herstellungsverfahren für elektronische packungen Expired - Lifetime DE69126773D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48457590A 1990-02-23 1990-02-23
US07/520,936 US5163499A (en) 1988-11-10 1990-05-09 Method of forming electronic packages
PCT/US1991/001247 WO1991013462A1 (en) 1990-02-23 1991-02-25 Methods of forming electronic packages

Publications (1)

Publication Number Publication Date
DE69126773D1 true DE69126773D1 (de) 1997-08-14

Family

ID=27048059

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69126773T Expired - Lifetime DE69126773D1 (de) 1990-02-23 1991-02-25 Herstellungsverfahren für elektronische packungen

Country Status (8)

Country Link
US (1) US5163499A (de)
EP (1) EP0516765B1 (de)
JP (1) JPH05504659A (de)
AT (1) ATE155287T1 (de)
AU (1) AU651822B2 (de)
BR (1) BR9106055A (de)
CA (1) CA2076637A1 (de)
DE (1) DE69126773D1 (de)

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US5614043A (en) 1992-09-17 1997-03-25 Coors Ceramics Company Method for fabricating electronic components incorporating ceramic-metal composites
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US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
US5657811A (en) * 1993-06-04 1997-08-19 Pcc Composites, Inc. Cast-in hermetic electrical feed-throughs
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US5480727A (en) * 1994-02-03 1996-01-02 Motorola, Inc. Electronic device assembly and method for making
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Also Published As

Publication number Publication date
AU651822B2 (en) 1994-08-04
BR9106055A (pt) 1993-06-15
ATE155287T1 (de) 1997-07-15
WO1991013462A2 (en) 1991-09-05
JPH05504659A (ja) 1993-07-15
US5163499A (en) 1992-11-17
AU7685191A (en) 1991-09-18
EP0516765B1 (de) 1997-07-09
CA2076637A1 (en) 1991-08-24
WO1991013462A3 (en) 1991-10-17
EP0516765A1 (de) 1992-12-09

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Legal Events

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