ATE155287T1 - Herstellungsverfahren für elektronische packungen - Google Patents

Herstellungsverfahren für elektronische packungen

Info

Publication number
ATE155287T1
ATE155287T1 AT91907909T AT91907909T ATE155287T1 AT E155287 T1 ATE155287 T1 AT E155287T1 AT 91907909 T AT91907909 T AT 91907909T AT 91907909 T AT91907909 T AT 91907909T AT E155287 T1 ATE155287 T1 AT E155287T1
Authority
AT
Austria
Prior art keywords
preform
filler material
infiltration
spontaneously
metal
Prior art date
Application number
AT91907909T
Other languages
English (en)
Inventor
Steven David Keck
Michael Angelo Rocazella
Peter Michael Engelgau
Gregory Eugene Hannon
Danny Ray White
Alan Scott Nagelberg
Original Assignee
Lanxide Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27048059&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE155287(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lanxide Technology Co Ltd filed Critical Lanxide Technology Co Ltd
Application granted granted Critical
Publication of ATE155287T1 publication Critical patent/ATE155287T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/65—Reaction sintering of free metal- or free silicon-containing compositions
    • C04B35/652—Directional oxidation or solidification, e.g. Lanxide process
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1005—Pretreatment of the non-metallic additives
    • C22C1/1015—Pretreatment of the non-metallic additives by preparing or treating a non-metallic additive preform
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1057—Reactive infiltration
    • C22C1/1063—Gas reaction, e.g. lanxide
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02—Pretreatment of the fibres or filaments
    • C22C47/06—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Liquid Crystal Substances (AREA)
  • Packages (AREA)
  • Glass Compositions (AREA)
  • Formation Of Insulating Films (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
AT91907909T 1990-02-23 1991-02-25 Herstellungsverfahren für elektronische packungen ATE155287T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48457590A 1990-02-23 1990-02-23
US07/520,936 US5163499A (en) 1988-11-10 1990-05-09 Method of forming electronic packages

Publications (1)

Publication Number Publication Date
ATE155287T1 true ATE155287T1 (de) 1997-07-15

Family

ID=27048059

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91907909T ATE155287T1 (de) 1990-02-23 1991-02-25 Herstellungsverfahren für elektronische packungen

Country Status (9)

Country Link
US (1) US5163499A (de)
EP (1) EP0516765B1 (de)
JP (1) JPH05504659A (de)
AT (1) ATE155287T1 (de)
AU (1) AU651822B2 (de)
BR (1) BR9106055A (de)
CA (1) CA2076637A1 (de)
DE (1) DE69126773D1 (de)
WO (1) WO1991013462A2 (de)

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Also Published As

Publication number Publication date
WO1991013462A3 (en) 1991-10-17
US5163499A (en) 1992-11-17
EP0516765A1 (de) 1992-12-09
AU651822B2 (en) 1994-08-04
CA2076637A1 (en) 1991-08-24
AU7685191A (en) 1991-09-18
EP0516765B1 (de) 1997-07-09
JPH05504659A (ja) 1993-07-15
DE69126773D1 (de) 1997-08-14
WO1991013462A2 (en) 1991-09-05
BR9106055A (pt) 1993-06-15

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