DE68908752T2 - Ausgleichsanordnung zur Untersuchung von möglicherweise gekrümmten Leiterplatten. - Google Patents

Ausgleichsanordnung zur Untersuchung von möglicherweise gekrümmten Leiterplatten.

Info

Publication number
DE68908752T2
DE68908752T2 DE89302224T DE68908752T DE68908752T2 DE 68908752 T2 DE68908752 T2 DE 68908752T2 DE 89302224 T DE89302224 T DE 89302224T DE 68908752 T DE68908752 T DE 68908752T DE 68908752 T2 DE68908752 T2 DE 68908752T2
Authority
DE
Germany
Prior art keywords
examining
circuit boards
compensation arrangement
curved circuit
possibly curved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE89302224T
Other languages
English (en)
Other versions
DE68908752D1 (de
Inventor
Gordon I Robertson
Abe Abramovich Abe Abramovich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMERICAN CIMFLEX CORP
Original Assignee
AMERICAN CIMFLEX CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMERICAN CIMFLEX CORP filed Critical AMERICAN CIMFLEX CORP
Application granted granted Critical
Publication of DE68908752D1 publication Critical patent/DE68908752D1/de
Publication of DE68908752T2 publication Critical patent/DE68908752T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
DE89302224T 1988-03-04 1989-03-06 Ausgleichsanordnung zur Untersuchung von möglicherweise gekrümmten Leiterplatten. Expired - Lifetime DE68908752T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16422688A 1988-03-04 1988-03-04
US07/198,156 US4978220A (en) 1988-03-04 1988-05-24 Compensating system for inspecting potentially warped printed circuit boards

Publications (2)

Publication Number Publication Date
DE68908752D1 DE68908752D1 (de) 1993-10-07
DE68908752T2 true DE68908752T2 (de) 1994-03-24

Family

ID=26860365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89302224T Expired - Lifetime DE68908752T2 (de) 1988-03-04 1989-03-06 Ausgleichsanordnung zur Untersuchung von möglicherweise gekrümmten Leiterplatten.

Country Status (6)

Country Link
US (1) US4978220A (de)
EP (1) EP0336563B1 (de)
JP (1) JP3026981B2 (de)
KR (1) KR890015660A (de)
CA (1) CA1301947C (de)
DE (1) DE68908752T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051825A (en) * 1989-04-07 1991-09-24 Pressco, Inc. Dual image video inspection apparatus
US4972093A (en) * 1987-10-09 1990-11-20 Pressco Inc. Inspection lighting system
US5072127A (en) * 1987-10-09 1991-12-10 Pressco, Inc. Engineered video inspecting lighting array
US5204912A (en) * 1990-02-26 1993-04-20 Gerber Systems Corporation Defect verification and marking system for use with printed circuit boards
US5184217A (en) * 1990-08-02 1993-02-02 Doering John W System for automatically inspecting a flat sheet part
US5172005A (en) * 1991-02-20 1992-12-15 Pressco Technology, Inc. Engineered lighting system for tdi inspection comprising means for controlling lighting elements in accordance with specimen displacement
US5657075A (en) * 1993-02-05 1997-08-12 Teradyne, Inc. Method and apparatus for locating and facilitating the repair of defects on a printed circuit board
US5406372A (en) * 1993-04-16 1995-04-11 Modular Vision Systems Inc. QFP lead quality inspection system and method
US5517235A (en) * 1993-11-03 1996-05-14 Control Automation, Inc. Method and apparatus for inspecting printed circuit boards at different magnifications
US5550583A (en) * 1994-10-03 1996-08-27 Lucent Technologies Inc. Inspection apparatus and method
US5880772A (en) * 1994-10-11 1999-03-09 Daimlerchrysler Corporation Machine vision image data acquisition system
US5555090A (en) * 1994-10-24 1996-09-10 Adaptive Optics Associates System for dimensioning objects
JP3376179B2 (ja) * 1995-08-03 2003-02-10 キヤノン株式会社 面位置検出方法
US5815018A (en) * 1996-07-16 1998-09-29 Systech Solutions, Inc. Pulse modulator circuit for an illuminator system
US5760893A (en) * 1996-12-24 1998-06-02 Teradyne, Inc. Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture
US5862973A (en) * 1997-01-30 1999-01-26 Teradyne, Inc. Method for inspecting solder paste in printed circuit board manufacture
US6118540A (en) * 1997-07-11 2000-09-12 Semiconductor Technologies & Instruments, Inc. Method and apparatus for inspecting a workpiece
US5956134A (en) * 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
DE69926885T2 (de) * 1998-06-10 2006-03-30 Landrex Technologies Co., Ltd. Messung und kompensation der durchbiegung bei der inspektion von bestückten leiterplatten
US5969752A (en) * 1998-06-15 1999-10-19 Electro Scientific Industries Multi-function viewer/tester for miniature electric components
US6222630B1 (en) 1998-08-26 2001-04-24 Teradyne, Inc. Measuring and compensating for warp in the inspection of printed circuit board assemblies
KR100304254B1 (ko) * 1998-12-08 2002-03-21 윤종용 모듈외관검사설비
US6678062B2 (en) 2000-12-08 2004-01-13 Cyberoptics Corporation Automated system with improved height sensing
JP4907783B2 (ja) * 2001-05-30 2012-04-04 株式会社岡村製作所 移動式パネルにおける遮蔽構造
US7436524B2 (en) * 2004-11-26 2008-10-14 Olympus Corporation Apparatus and method for three-dimensional measurement and program for allowing computer to execute method for three-dimensional measurement
KR101132779B1 (ko) * 2010-03-19 2012-04-09 주식회사 고영테크놀러지 검사방법
TWI482944B (zh) * 2011-11-08 2015-05-01 Acer Inc 電路板曲度偵測裝置以及方法
TWI472741B (zh) * 2012-05-22 2015-02-11 Machvision Inc Auxiliary Alignment Method and Its System
KR101893831B1 (ko) 2016-10-20 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판 검사방법
CN111288905B (zh) * 2020-03-11 2021-06-15 江苏理工学院 一种散热器铜管检测装置
CN112748113B (zh) * 2020-12-21 2022-08-05 杭州电子科技大学 一种集成激光测量与超声探伤的测头装置及其测量方法
CN113635813B (zh) * 2021-07-30 2023-03-21 天长市荣达电子有限公司 一种用于电动车充电器的电路板组件
CN115066107B (zh) * 2022-06-30 2024-04-05 昆山鸿仕达智能科技股份有限公司 一种电子元件贴装过程中压合行程控制方法
CN116030053B (zh) * 2023-03-27 2023-06-16 中江立江电子有限公司 一种连接器引脚缺陷检测方法、装置、设备及介质

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4230940A (en) * 1977-07-22 1980-10-28 Tokyo Shibaura Denki Kabushiki Kaisha Automatic focusing apparatus
US4331409A (en) * 1981-03-30 1982-05-25 Polaroid Corporation Photographic apparatus with dual function sonic transducer
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
JPS58153327A (ja) * 1982-03-08 1983-09-12 Toshiba Corp パタ−ン検査装置
US4677302A (en) * 1985-03-29 1987-06-30 Siemens Corporate Research & Support, Inc. Optical system for inspecting printed circuit boards wherein a ramp filter is disposed between reflected beam and photodetector

Also Published As

Publication number Publication date
US4978220A (en) 1990-12-18
JPH0221274A (ja) 1990-01-24
EP0336563A3 (de) 1991-02-20
CA1301947C (en) 1992-05-26
EP0336563B1 (de) 1993-09-01
EP0336563A2 (de) 1989-10-11
KR890015660A (ko) 1989-10-30
JP3026981B2 (ja) 2000-03-27
DE68908752D1 (de) 1993-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee