DE60330578D1 - Poliermittelzusammensetzung und Polierverfahren - Google Patents

Poliermittelzusammensetzung und Polierverfahren

Info

Publication number
DE60330578D1
DE60330578D1 DE60330578T DE60330578T DE60330578D1 DE 60330578 D1 DE60330578 D1 DE 60330578D1 DE 60330578 T DE60330578 T DE 60330578T DE 60330578 T DE60330578 T DE 60330578T DE 60330578 D1 DE60330578 D1 DE 60330578D1
Authority
DE
Germany
Prior art keywords
polishing
compound
circuit board
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60330578T
Other languages
German (de)
English (en)
Inventor
Hiroyuki Kamiya
Katsuyuki Tsugita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seimi Chemical Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Seimi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Seimi Chemical Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of DE60330578D1 publication Critical patent/DE60330578D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Disintegrating Or Milling (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE60330578T 2002-09-25 2003-09-25 Poliermittelzusammensetzung und Polierverfahren Expired - Lifetime DE60330578D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002279193 2002-09-25
PCT/JP2003/012258 WO2004030062A1 (ja) 2002-09-25 2003-09-25 研磨剤組成物、その製造方法及び研磨方法

Publications (1)

Publication Number Publication Date
DE60330578D1 true DE60330578D1 (de) 2010-01-28

Family

ID=32040447

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60330578T Expired - Lifetime DE60330578D1 (de) 2002-09-25 2003-09-25 Poliermittelzusammensetzung und Polierverfahren

Country Status (10)

Country Link
US (1) US20050194565A1 (https=)
EP (1) EP1544901B1 (https=)
JP (1) JPWO2004030062A1 (https=)
KR (1) KR20050057209A (https=)
CN (1) CN1682354B (https=)
AT (1) ATE452422T1 (https=)
AU (1) AU2003266619A1 (https=)
DE (1) DE60330578D1 (https=)
TW (1) TW200409808A (https=)
WO (1) WO2004030062A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4759219B2 (ja) * 2003-11-25 2011-08-31 株式会社フジミインコーポレーテッド 研磨用組成物
KR20060101396A (ko) * 2005-03-17 2006-09-22 후지 샤신 필름 가부시기가이샤 금속 연마액 및 연마방법
WO2006120727A1 (ja) * 2005-05-06 2006-11-16 Asahi Glass Company, Limited 銅配線研磨用組成物および半導体集積回路表面の研磨方法
US7955519B2 (en) * 2005-09-30 2011-06-07 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
WO2007102138A2 (en) * 2007-01-02 2007-09-13 Freescale Semiconductor, Inc. Barrier slurry compositions and barrier cmp methods
WO2008004579A1 (fr) * 2006-07-05 2008-01-10 Hitachi Chemical Co., Ltd. Liquide de polissage pour cmp et procédé de polissage
US20080020680A1 (en) * 2006-07-24 2008-01-24 Cabot Microelectronics Corporation Rate-enhanced CMP compositions for dielectric films
JP2008091569A (ja) * 2006-09-29 2008-04-17 Fujifilm Corp 研磨用組成物及び研磨方法
CN102528638A (zh) * 2010-12-29 2012-07-04 中芯国际集成电路制造(上海)有限公司 一种铜化学机械研磨方法及设备
CN103503118B (zh) * 2011-06-03 2016-01-20 旭硝子株式会社 研磨剂及研磨方法
US9644274B2 (en) * 2011-07-04 2017-05-09 Mitsubishi Gas Chemical Company, Inc. Etching solution for copper or a compound comprised mainly of copper
JPWO2014175397A1 (ja) * 2013-04-25 2017-02-23 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
CN103484866B (zh) * 2013-09-23 2016-05-18 无锡阳工机械制造有限公司 一种抛光防腐浆料
CN103484865B (zh) * 2013-09-23 2016-04-13 无锡阳工机械制造有限公司 一种金属抛光防腐浆料
US9281210B2 (en) 2013-10-10 2016-03-08 Cabot Microelectronics Corporation Wet-process ceria compositions for polishing substrates, and methods related thereto
EP3227098B1 (en) * 2014-12-05 2022-06-15 3M Innovative Properties Company Abrasive composition
US10685935B2 (en) 2017-11-15 2020-06-16 Taiwan Semiconductor Manufacturing Company, Ltd. Forming metal bonds with recesses
KR102773634B1 (ko) * 2022-04-13 2025-02-25 에스케이엔펄스 주식회사 반도체 공정용 조성물 및 이를 이용한 반도체 소자의 연마방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190237B1 (en) * 1997-11-06 2001-02-20 International Business Machines Corporation pH-buffered slurry and use thereof for polishing
US6063306A (en) * 1998-06-26 2000-05-16 Cabot Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrate
JP2001023940A (ja) * 1999-07-09 2001-01-26 Seimi Chem Co Ltd 半導体集積回路の平坦化方法及びそのための化学的機械研磨スラリ
JP4156137B2 (ja) * 1999-07-19 2008-09-24 株式会社トクヤマ 金属膜用研磨剤
JP4683681B2 (ja) * 1999-10-29 2011-05-18 日立化成工業株式会社 金属用研磨液及びそれを用いた基板の研磨方法
TWI268286B (en) * 2000-04-28 2006-12-11 Kao Corp Roll-off reducing agent
JP4195212B2 (ja) * 2000-10-23 2008-12-10 花王株式会社 研磨液組成物
US6740589B2 (en) * 2000-11-30 2004-05-25 Showa Denko Kabushiki Kaisha Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same
JP2002170790A (ja) * 2000-11-30 2002-06-14 Showa Denko Kk 半導体基板研磨用組成物、半導体配線基板およびその製造方法
US6612911B2 (en) * 2001-01-16 2003-09-02 Cabot Microelectronics Corporation Alkali metal-containing polishing system and method
JP2002270546A (ja) * 2001-03-07 2002-09-20 Hitachi Chem Co Ltd 導体用研磨液及びこれを用いた研磨方法
US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
WO2003036705A1 (en) * 2001-10-26 2003-05-01 Asahi Glass Company, Limited Polishing compound, method for production thereof and polishing method

Also Published As

Publication number Publication date
WO2004030062A1 (ja) 2004-04-08
ATE452422T1 (de) 2010-01-15
CN1682354B (zh) 2010-10-06
TW200409808A (en) 2004-06-16
EP1544901B1 (en) 2009-12-16
KR20050057209A (ko) 2005-06-16
EP1544901A4 (en) 2007-04-11
AU2003266619A1 (en) 2004-04-19
AU2003266619A8 (en) 2004-04-19
CN1682354A (zh) 2005-10-12
JPWO2004030062A1 (ja) 2006-01-26
US20050194565A1 (en) 2005-09-08
EP1544901A1 (en) 2005-06-22
TWI294456B (https=) 2008-03-11

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