DE60322926D1 - Photopolymerisierbare zusammensetzung und verwendung davon - Google Patents
Photopolymerisierbare zusammensetzung und verwendung davonInfo
- Publication number
- DE60322926D1 DE60322926D1 DE60322926T DE60322926T DE60322926D1 DE 60322926 D1 DE60322926 D1 DE 60322926D1 DE 60322926 T DE60322926 T DE 60322926T DE 60322926 T DE60322926 T DE 60322926T DE 60322926 D1 DE60322926 D1 DE 60322926D1
- Authority
- DE
- Germany
- Prior art keywords
- photopolymerizable composition
- photopolymerizable
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/343—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate in the form of urethane links
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/03—Viewing layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/03—Viewing layer characterised by chemical composition
- C09K2323/035—Ester polymer, e.g. polycarbonate, polyacrylate or polyester
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/055—Epoxy
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/059—Unsaturated aliphatic polymer, e.g. vinyl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002219573 | 2002-07-29 | ||
JP2003119417 | 2003-04-24 | ||
PCT/JP2003/009065 WO2004011511A1 (ja) | 2002-07-29 | 2003-07-17 | 光重合性組成物およびその用途 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60322926D1 true DE60322926D1 (de) | 2008-09-25 |
Family
ID=31190315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60322926T Expired - Lifetime DE60322926D1 (de) | 2002-07-29 | 2003-07-17 | Photopolymerisierbare zusammensetzung und verwendung davon |
Country Status (8)
Country | Link |
---|---|
US (1) | US7307107B2 (de) |
EP (1) | EP1548039B1 (de) |
JP (1) | JP4164493B2 (de) |
KR (1) | KR100634066B1 (de) |
CN (1) | CN1296399C (de) |
AU (1) | AU2003281687A1 (de) |
DE (1) | DE60322926D1 (de) |
WO (1) | WO2004011511A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100776721B1 (ko) * | 2005-10-05 | 2007-11-28 | 주식회사 두산 | 액정표시소자용 실란트 조성물 및 이를 이용한 씰제 |
JP2010524036A (ja) * | 2007-04-11 | 2010-07-15 | バイエル・マテリアルサイエンス・アクチェンゲゼルシャフト | 屈折率の高い芳香族ウレタンアクリレート |
US7802883B2 (en) * | 2007-12-20 | 2010-09-28 | Johnson & Johnson Vision Care, Inc. | Cosmetic contact lenses having a sparkle effect |
PL2286298T3 (pl) * | 2008-06-02 | 2017-05-31 | Koninklijke Philips N.V. | System optyczny i zawierające go autostereoskopowe urządzenie do wyświetlania |
KR100993317B1 (ko) * | 2008-08-26 | 2010-11-09 | 삼성전기주식회사 | 발광 다이오드 패키지의 렌즈 제조방법 |
EP2417210B1 (de) * | 2009-04-10 | 2013-03-06 | Pixeloptics Inc. | Härtbare klebezusammensetzungen |
US9074040B2 (en) | 2010-12-20 | 2015-07-07 | Mitsui Chemicals, Inc. | Curable adhesive compositions |
CN102751420A (zh) * | 2011-04-19 | 2012-10-24 | 菱生精密工业股份有限公司 | 发光二极管封装结构 |
WO2014133052A1 (ja) * | 2013-02-28 | 2014-09-04 | 昭和電工株式会社 | 硬化性組成物、透明耐熱材料及びその用途 |
BR112016001744A2 (pt) * | 2013-08-02 | 2017-08-01 | Mitsui Chemicals Inc | composição polimerizável para material ótico fotocrômico |
JP6369932B2 (ja) * | 2014-06-25 | 2018-08-08 | 株式会社ジーシー | 歯科用補綴物の作製方法 |
US9874811B2 (en) * | 2015-09-10 | 2018-01-23 | Samsung Electronics Co., Ltd. | Photopolymer composition for holographic recording |
KR102239212B1 (ko) * | 2018-12-14 | 2021-04-12 | 주식회사 엘지화학 | 포토폴리머 조성물 |
CN112646185B (zh) * | 2020-11-30 | 2023-04-28 | 益丰新材料股份有限公司 | 一种具有高折射率的改性聚硫醇及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61194401A (ja) | 1985-02-25 | 1986-08-28 | Canon Inc | プラスチツクレンズ |
EP0273710B2 (de) | 1986-12-26 | 1996-10-16 | Nippon Shokubai Kagaku Kogyo Co., Ltd | Harz mit hohem Brechungsindex, Verfahren zu seiner Herstellung und optische Materialien aus diesem Harz |
JPH0625232B2 (ja) | 1987-04-28 | 1994-04-06 | 株式会社日本触媒 | 高屈折率樹脂の製造方法 |
JPH0791262B2 (ja) | 1987-02-02 | 1995-10-04 | 三井東圧化学株式会社 | 新規な含硫脂肪族(メタ)アクリレ−ト |
JPH0720670B2 (ja) | 1987-02-25 | 1995-03-08 | ホ−ヤ株式会社 | プラスチックレンズの製造方法およびその装置 |
JPH02120305A (ja) | 1988-10-31 | 1990-05-08 | Showa Denko Kk | 硬化性組成物 |
JP3091976B2 (ja) | 1990-11-15 | 2000-09-25 | 三菱化学株式会社 | 光学部品用硬化性組成物 |
US5767212A (en) | 1992-06-30 | 1998-06-16 | Toray Industries, Inc. | Method of producing sulfur containing color-free transparent (metha) acrylate polymer having high visible light transmittance |
JP2871398B2 (ja) | 1992-06-30 | 1999-03-17 | 東レ株式会社 | 透明ポリマーの製造方法 |
JPH0691694A (ja) | 1992-07-28 | 1994-04-05 | Nippon Zeon Co Ltd | 成形品とその製造方法 |
JP3218480B2 (ja) | 1992-10-09 | 2001-10-15 | 株式会社シード | ウレタン系高屈折率レンズ |
WO1996011964A1 (fr) * | 1994-10-18 | 1996-04-25 | Mitsubishi Rayon Co., Ltd. | Composition actinique radiodurcissable et lentilles en feuille |
JPH08113616A (ja) | 1994-10-18 | 1996-05-07 | Mitsubishi Rayon Co Ltd | 活性エネルギー線硬化性組成物およびレンズシート |
JPH09107128A (ja) | 1995-10-09 | 1997-04-22 | Mitsubishi Chem Corp | 樹脂封止高輝度発光ダイオード及びその製造方法 |
JPH09309923A (ja) | 1996-05-23 | 1997-12-02 | Mitsubishi Rayon Co Ltd | 活性エネルギー線硬化性組成物、レンズシートおよびバックライト |
AUPO395896A0 (en) * | 1996-12-03 | 1997-01-02 | Sola International Holdings Ltd | Acrylic thio monomers |
JPH10330442A (ja) | 1997-05-28 | 1998-12-15 | Nippon Kayaku Co Ltd | レンズ用樹脂組成物及びその硬化物 |
FR2777008B1 (fr) | 1998-04-03 | 2000-05-12 | Essilor Int | Composition polymerisable pour la fabrication de lentille optique a haut indice de refraction et haut nombre d'abbe, et lentille obtenue |
JP2001124903A (ja) | 1999-10-26 | 2001-05-11 | Seed Co Ltd | 光硬化性樹脂製レンズ |
JP2004536933A (ja) * | 2001-07-25 | 2004-12-09 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 高屈折率光学樹脂組成物 |
-
2003
- 2003-07-17 DE DE60322926T patent/DE60322926D1/de not_active Expired - Lifetime
- 2003-07-17 JP JP2004524112A patent/JP4164493B2/ja not_active Expired - Lifetime
- 2003-07-17 KR KR1020057001609A patent/KR100634066B1/ko active IP Right Grant
- 2003-07-17 US US10/522,532 patent/US7307107B2/en not_active Expired - Lifetime
- 2003-07-17 WO PCT/JP2003/009065 patent/WO2004011511A1/ja active IP Right Grant
- 2003-07-17 EP EP03741440A patent/EP1548039B1/de not_active Expired - Fee Related
- 2003-07-17 CN CNB038182718A patent/CN1296399C/zh not_active Expired - Fee Related
- 2003-07-17 AU AU2003281687A patent/AU2003281687A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1548039B1 (de) | 2008-08-13 |
EP1548039A4 (de) | 2006-06-28 |
CN1296399C (zh) | 2007-01-24 |
EP1548039A1 (de) | 2005-06-29 |
US7307107B2 (en) | 2007-12-11 |
WO2004011511A1 (ja) | 2004-02-05 |
CN1671758A (zh) | 2005-09-21 |
AU2003281687A1 (en) | 2004-02-16 |
JP4164493B2 (ja) | 2008-10-15 |
JPWO2004011511A1 (ja) | 2005-11-24 |
KR100634066B1 (ko) | 2006-10-16 |
KR20050033634A (ko) | 2005-04-12 |
US20060003261A1 (en) | 2006-01-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |