DE60320702D1 - Keramische Heizelemente - Google Patents

Keramische Heizelemente

Info

Publication number
DE60320702D1
DE60320702D1 DE60320702T DE60320702T DE60320702D1 DE 60320702 D1 DE60320702 D1 DE 60320702D1 DE 60320702 T DE60320702 T DE 60320702T DE 60320702 T DE60320702 T DE 60320702T DE 60320702 D1 DE60320702 D1 DE 60320702D1
Authority
DE
Germany
Prior art keywords
heating elements
ceramic heating
ceramic
elements
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320702T
Other languages
English (en)
Inventor
Yutaka Unno
Kazuhiro Nobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE60320702D1 publication Critical patent/DE60320702D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
DE60320702T 2002-03-18 2003-03-17 Keramische Heizelemente Expired - Lifetime DE60320702D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002073532A JP3925702B2 (ja) 2002-03-18 2002-03-18 セラミックヒーター

Publications (1)

Publication Number Publication Date
DE60320702D1 true DE60320702D1 (de) 2008-06-19

Family

ID=28035248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320702T Expired - Lifetime DE60320702D1 (de) 2002-03-18 2003-03-17 Keramische Heizelemente

Country Status (6)

Country Link
US (1) US6958462B2 (de)
EP (1) EP1351281B1 (de)
JP (1) JP3925702B2 (de)
KR (1) KR100512350B1 (de)
DE (1) DE60320702D1 (de)
TW (1) TW595244B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197074A (ja) 2004-01-07 2005-07-21 Ngk Insulators Ltd 抵抗発熱体およびヒーター
US7115836B2 (en) * 2004-06-29 2006-10-03 Ngk Spark Plug Co., Ltd. Glow plug
JP2006302887A (ja) * 2005-04-20 2006-11-02 Ngk Insulators Ltd 給電部材及び加熱装置
JP2007066542A (ja) * 2005-08-29 2007-03-15 Kyocera Corp ヒータおよびウェハ加熱装置ならびにこのヒータの製造方法
JP5807032B2 (ja) 2012-03-21 2015-11-10 日本碍子株式会社 加熱装置及び半導体製造装置
US9089007B2 (en) * 2012-04-27 2015-07-21 Applied Materials, Inc. Method and apparatus for substrate support with multi-zone heating
KR101463120B1 (ko) * 2013-05-13 2014-11-20 (주)티티에스 가열기 및 이를 구비하는 기판 처리 장치
DE102014112645A1 (de) 2014-09-03 2016-03-03 Aixtron Se Heizeinrichtung
JP6085073B2 (ja) 2015-01-20 2017-02-22 日本碍子株式会社 シャフト端部取付構造
KR102348108B1 (ko) 2015-10-05 2022-01-10 주식회사 미코세라믹스 온도 편차 특성이 개선된 기판 가열 장치
US10679873B2 (en) * 2016-09-30 2020-06-09 Ngk Spark Plug Co., Ltd. Ceramic heater
WO2019181500A1 (ja) * 2018-03-23 2019-09-26 日本碍子株式会社 マルチゾーンヒータ
KR102608397B1 (ko) * 2018-10-16 2023-12-01 주식회사 미코세라믹스 미들 영역 독립 제어 세라믹 히터
KR102630201B1 (ko) * 2019-01-23 2024-01-29 주식회사 미코세라믹스 세라믹 히터
KR102514749B1 (ko) * 2019-01-25 2023-03-27 엔지케이 인슐레이터 엘티디 세라믹 히터
JP6754514B1 (ja) * 2019-02-19 2020-09-09 日本碍子株式会社 セラミックヒータ及びその製法
WO2022203982A1 (en) * 2021-03-25 2022-09-29 Lam Research Corporation Conductive cooling of a low temperature pedestal operating in a high temperature deposition sequence
KR102437076B1 (ko) 2021-08-30 2022-08-29 주식회사 미코세라믹스 온도 편차 특성이 개선된 기판 가열 장치
CN116313878A (zh) * 2021-12-20 2023-06-23 中微半导体设备(上海)股份有限公司 一种基座、基座的制造方法及等离子体处理设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895219A (en) * 1973-11-23 1975-07-15 Norton Co Composite ceramic heating element
US4952783A (en) * 1989-03-20 1990-08-28 W. H. Brady Co. Light transmitting flexible film electrical heater panels
JP2642858B2 (ja) * 1993-12-20 1997-08-20 日本碍子株式会社 セラミックスヒーター及び加熱装置
JP2647799B2 (ja) * 1994-02-04 1997-08-27 日本碍子株式会社 セラミックスヒーター及びその製造方法
JP2813148B2 (ja) * 1994-03-02 1998-10-22 日本碍子株式会社 セラミックス製品
US6133557A (en) * 1995-01-31 2000-10-17 Kyocera Corporation Wafer holding member
US6423949B1 (en) * 1999-05-19 2002-07-23 Applied Materials, Inc. Multi-zone resistive heater
JP2001102157A (ja) 1999-10-01 2001-04-13 Ngk Insulators Ltd セラミックスヒータ

Also Published As

Publication number Publication date
KR100512350B1 (ko) 2005-09-02
US20030173349A1 (en) 2003-09-18
US6958462B2 (en) 2005-10-25
EP1351281A2 (de) 2003-10-08
EP1351281B1 (de) 2008-05-07
JP2003272805A (ja) 2003-09-26
KR20030076282A (ko) 2003-09-26
TW200304757A (en) 2003-10-01
EP1351281A3 (de) 2006-01-25
TW595244B (en) 2004-06-21
JP3925702B2 (ja) 2007-06-06

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Legal Events

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