DE60314353D1 - Leiterplatte und Methode um eine Leiterplatte an einem elektrisch leitenden Gehäuse anzubringen - Google Patents

Leiterplatte und Methode um eine Leiterplatte an einem elektrisch leitenden Gehäuse anzubringen

Info

Publication number
DE60314353D1
DE60314353D1 DE60314353T DE60314353T DE60314353D1 DE 60314353 D1 DE60314353 D1 DE 60314353D1 DE 60314353 T DE60314353 T DE 60314353T DE 60314353 T DE60314353 T DE 60314353T DE 60314353 D1 DE60314353 D1 DE 60314353D1
Authority
DE
Germany
Prior art keywords
circuit board
attach
electrically conductive
conductive housing
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60314353T
Other languages
English (en)
Other versions
DE60314353T2 (de
Inventor
Tadao Kishimoto
Yutaka Igarashi
Hironobu Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Application granted granted Critical
Publication of DE60314353D1 publication Critical patent/DE60314353D1/de
Publication of DE60314353T2 publication Critical patent/DE60314353T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE60314353T 2002-11-06 2003-10-29 Leiterplatte und Methode um eine Leiterplatte an einem elektrisch leitenden Gehäuse anzubringen Expired - Lifetime DE60314353T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002322327 2002-11-06
JP2002322327A JP2004158605A (ja) 2002-11-06 2002-11-06 プリント配線基板、及びプリント配線基板の導電性筐体への取付方法

Publications (2)

Publication Number Publication Date
DE60314353D1 true DE60314353D1 (de) 2007-07-26
DE60314353T2 DE60314353T2 (de) 2008-02-14

Family

ID=32105449

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60314353T Expired - Lifetime DE60314353T2 (de) 2002-11-06 2003-10-29 Leiterplatte und Methode um eine Leiterplatte an einem elektrisch leitenden Gehäuse anzubringen

Country Status (4)

Country Link
US (1) US7088591B2 (de)
EP (1) EP1418798B1 (de)
JP (1) JP2004158605A (de)
DE (1) DE60314353T2 (de)

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JP4780318B2 (ja) 2006-04-28 2011-09-28 日本電気株式会社 プリント基板搭載筐体解析システムと方法、これによるプリント基板搭載筐体構造、プログラムおよび記録媒体
CA2711620A1 (en) 2008-01-08 2009-07-16 Bluesky Medical Group Inc. Sustained variable negative pressure wound treatment and method of controlling same
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WO2009114624A2 (en) 2008-03-12 2009-09-17 Bluesky Medical Group Inc. Negative pressure dressing and method of using same
JP5234331B2 (ja) * 2008-05-12 2013-07-10 株式会社ジェイテクト 車両用操舵装置
JP4421663B1 (ja) * 2008-09-10 2010-02-24 株式会社東芝 プリント配線板、電子機器
JP4489133B2 (ja) * 2008-09-10 2010-06-23 株式会社東芝 プリント配線板、電子機器
CN101730377A (zh) * 2008-10-29 2010-06-09 鸿富锦精密工业（深圳）有限公司 耦合层及具有该耦合层的印刷电路板
DE102009018663A1 (de) 2009-04-23 2010-10-28 Kathrein-Werke Kg Elektrische Verbindungseinrichtung
CN103442935B (zh) * 2011-03-31 2015-11-25 本田技研工业株式会社 电动车辆控制装置
CN103782665B (zh) * 2011-08-15 2017-04-26 艾思玛太阳能技术股份公司 在电路板的支持物中包括电容器的电子设备及其生产方法
TW201316895A (zh) * 2011-10-14 2013-04-16 Hon Hai Prec Ind Co Ltd 可抑制電磁干擾的電路板
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JP2017191902A (ja) * 2016-04-15 2017-10-19 ルネサスエレクトロニクス株式会社 電子装置
EP3454918A1 (de) 2016-05-13 2019-03-20 Smith & Nephew PLC Sensoraktivierte wundüberwachungs- und therapievorrichtung
US11511021B2 (en) 2016-09-29 2022-11-29 Smith & Nephew Plc Protection of electronics in negative pressure wound therapy systems
US9768678B1 (en) 2016-11-16 2017-09-19 Silanna Asia Pte Ltd Switching regulator synchronous node snubber circuit
US11690570B2 (en) 2017-03-09 2023-07-04 Smith & Nephew Plc Wound dressing, patch member and method of sensing one or more wound parameters
WO2018162732A1 (en) 2017-03-09 2018-09-13 Smith & Nephew Plc Apparatus and method for imaging blood in a target region of tissue
JP7235673B2 (ja) 2017-04-11 2023-03-08 スミス アンド ネフュー ピーエルシー センサ対応型創傷被覆材のための構成要素配置および応力緩和
US10798818B2 (en) 2017-04-13 2020-10-06 Astec International Limited Power supplies including shielded multilayer power transmission boards
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EP3687380A1 (de) 2017-09-27 2020-08-05 Smith & Nephew plc Ph-fühler für sensoraktivierte unterdruck-wundkontroll- und therapiegeräte
WO2019072531A1 (en) 2017-09-28 2019-04-18 Smith & Nephew Plc NEUROSTIMULATION AND MONITORING USING A SENSOR ACTIVATED WOUND SURVEILLANCE AND TREATMENT APPARATUS
JP2021502845A (ja) 2017-11-15 2021-02-04 スミス アンド ネフュー ピーエルシーＳｍｉｔｈ ＆ Ｎｅｐｈｅｗ Ｐｕｂｌｉｃ Ｌｉｍｉｔｅｄ Ｃｏｍｐａｎｙ 統合センサ対応型創傷モニタリングおよび／または治療被覆材ならびにシステム
JP6490255B1 (ja) * 2018-01-16 2019-03-27 三菱電機株式会社 車載電子装置
JP7373705B2 (ja) * 2018-02-15 2023-11-06 パナソニックＩｐマネジメント株式会社 回路基板、電子機器
KR102454815B1 (ko) * 2018-02-21 2022-10-17 삼성전자주식회사 브라켓과 용량성 결합을 형성하고, 상기 브라켓에 배치된 복수의 회로 기판들의 접지부들과 전기적으로 연결된 도전성 부재를 포함하는 전자 장치
JP6584569B1 (ja) * 2018-04-06 2019-10-02 三菱電機株式会社 プリント基板
GB2592508B (en) 2018-09-12 2022-08-31 Smith & Nephew Device, apparatus and method of determining skin perfusion pressure
GB201820927D0 (en) 2018-12-21 2019-02-06 Smith & Nephew Wound therapy systems and methods with supercapacitors
JP2021028934A (ja) * 2019-08-09 2021-02-25 キヤノン株式会社 プリント基板
EP4200935A1 (de) * 2020-08-19 2023-06-28 Telefonaktiebolaget LM Ericsson (publ) Elektronische anordnung für eine mobilkommunikationsantenne, mobilkommunikationsantenne und verfahren zur herstellung der elektronischen anordnung
CN114845491B (zh) * 2021-02-02 2024-04-02 台达电子工业股份有限公司 电子装置及其接地模块

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Also Published As

Publication number Publication date
JP2004158605A (ja) 2004-06-03
US20040090748A1 (en) 2004-05-13
EP1418798B1 (de) 2007-06-13
EP1418798A2 (de) 2004-05-12
EP1418798A3 (de) 2005-06-29
US7088591B2 (en) 2006-08-08
DE60314353T2 (de) 2008-02-14

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