DE60312261D1 - Lösung zur stromlosen Nickel-Plattierung - Google Patents

Lösung zur stromlosen Nickel-Plattierung

Info

Publication number
DE60312261D1
DE60312261D1 DE60312261T DE60312261T DE60312261D1 DE 60312261 D1 DE60312261 D1 DE 60312261D1 DE 60312261 T DE60312261 T DE 60312261T DE 60312261 T DE60312261 T DE 60312261T DE 60312261 D1 DE60312261 D1 DE 60312261D1
Authority
DE
Germany
Prior art keywords
nickel plating
plating solutions
nickel
hypophosphite
electroless nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60312261T
Other languages
English (en)
Other versions
DE60312261T2 (de
Inventor
George E Shahin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of DE60312261D1 publication Critical patent/DE60312261D1/de
Publication of DE60312261T2 publication Critical patent/DE60312261T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
DE60312261T 2002-06-18 2003-06-16 Lösung zur stromlosen Nickel-Plattierung Expired - Lifetime DE60312261T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/174,185 US6800121B2 (en) 2002-06-18 2002-06-18 Electroless nickel plating solutions
US174185 2002-06-18

Publications (2)

Publication Number Publication Date
DE60312261D1 true DE60312261D1 (de) 2007-04-19
DE60312261T2 DE60312261T2 (de) 2007-11-22

Family

ID=29720380

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60312261T Expired - Lifetime DE60312261T2 (de) 2002-06-18 2003-06-16 Lösung zur stromlosen Nickel-Plattierung

Country Status (9)

Country Link
US (1) US6800121B2 (de)
EP (1) EP1378584B1 (de)
JP (1) JP2004019004A (de)
KR (1) KR101080061B1 (de)
AT (1) ATE356229T1 (de)
CA (1) CA2432580A1 (de)
DE (1) DE60312261T2 (de)
ES (1) ES2280652T3 (de)
TW (1) TWI248477B (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10052960C9 (de) * 2000-10-25 2008-07-03 AHC-Oberflächentechnik GmbH & Co. OHG Bleifreie Nickellegierung
US20040226407A1 (en) * 2003-05-14 2004-11-18 David Ericson Method and apparatus for converting metal ion in solution to the metal state
WO2005019939A1 (en) * 2003-08-19 2005-03-03 Mallinckrodt Baker Inc. Stripping and cleaning compositions for microelectronics
US20060225605A1 (en) * 2005-04-11 2006-10-12 Kloeckener James R Aqueous coating compositions and process for treating metal plated substrates
JP5301993B2 (ja) 2005-08-12 2013-09-25 モジュメタル エルエルシー 組成変調複合材料及びその形成方法
JP4965959B2 (ja) * 2005-10-25 2012-07-04 株式会社荏原製作所 無電解めっき装置
US7780772B2 (en) * 2005-11-25 2010-08-24 Lam Research Corporation Electroless deposition chemical system limiting strongly adsorbed species
JP2009210552A (ja) * 2008-02-07 2009-09-17 Seiko Epson Corp 接触部品および時計
CA2730229C (en) 2008-07-07 2017-02-14 John D. Whitaker Property modulated materials and methods of making the same
ATE503037T1 (de) * 2008-10-17 2011-04-15 Atotech Deutschland Gmbh Spannungsreduzierte ni-p/pd-stapel für waferoberfläche
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
EP2440691B1 (de) 2009-06-08 2019-10-23 Modumetal, Inc. Elektrolytische nanolaminatbeschichtungen und -plattierungen für korrosionsschutz
KR101635661B1 (ko) 2009-07-03 2016-07-01 엔쏜 인코포레이티드 베타-아미노산 함유 전해질 및 금속 층 침착 방법
CN101851752B (zh) * 2010-06-09 2013-01-09 济南德锡科技有限公司 一种长寿、高速的酸性环保光亮化学镀镍添加剂及其使用方法
EP2588645B1 (de) * 2010-06-30 2018-05-30 RDM Family Investments LLC Verfahren zur abscheidung einer nickel-metall-schicht
CN103261479B (zh) 2010-07-22 2015-12-02 莫杜美拓有限公司 纳米层压黄铜合金的材料及其电化学沉积方法
WO2012030566A2 (en) * 2010-09-03 2012-03-08 Omg Electronic Chemicals, Llc Electroless nickel alloy plating bath and process for depositing thereof
US20120061698A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US20120061710A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
JP2012087386A (ja) * 2010-10-21 2012-05-10 Toyota Motor Corp 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP3255176B1 (de) * 2011-01-11 2019-05-01 MacDermid Enthone America LLC Verfahren zur beschichtung eines teilchenförmigen materials
US20120247223A1 (en) * 2011-03-30 2012-10-04 Canada Pipeline Accessories, Co. Ltd. Electroless Plated Fluid Flow Conditioner and Pipe Assembly
KR101297774B1 (ko) * 2012-03-12 2013-08-20 포항공과대학교 산학협력단 선도장 강판 절단면 부식방지를 위한 비전해질 니켈-인 코팅
KR102014088B1 (ko) * 2012-03-20 2019-08-26 엘지이노텍 주식회사 메모리카드, 메모리 카드용 인쇄회로기판 및 이의 제조 방법
JP5890236B2 (ja) * 2012-04-10 2016-03-22 東洋鋼鈑株式会社 ハードディスク用基板の製造方法
US9752231B2 (en) * 2012-05-11 2017-09-05 Lam Research Corporation Apparatus for electroless metal deposition having filter system and associated oxygen source
TWI455750B (zh) * 2012-06-04 2014-10-11 Arps Inc 表面處理濕製程含磷無電鎳之鍍液成分的循環利用系統
US8936672B1 (en) 2012-06-22 2015-01-20 Accu-Labs, Inc. Polishing and electroless nickel compositions, kits, and methods
CN105283587B (zh) 2013-03-15 2019-05-10 莫杜美拓有限公司 纳米叠层涂层
BR112015022078B1 (pt) 2013-03-15 2022-05-17 Modumetal, Inc Aparelho e método para eletrodepositar um revestimento nanolaminado
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
WO2014145771A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
EP2823890A1 (de) * 2013-07-11 2015-01-14 FRANZ Oberflächentechnik GmbH & Co KG Verfahren und Anlage zum nasschemischen Abscheiden von Nickelschichten
US10246778B2 (en) * 2013-08-07 2019-04-02 Macdermid Acumen, Inc. Electroless nickel plating solution and method
US11685999B2 (en) * 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
EP3194163A4 (de) 2014-09-18 2018-06-27 Modumetal, Inc. Verfahren zur herstellung von artikeln durch elektroabscheidung und generativen fertigungsverfahren
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP3026143A1 (de) * 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten
CN104561948B (zh) * 2015-01-28 2015-08-05 哈尔滨三泳金属表面技术有限公司 一种环保型铝合金快速化学镀镍-磷添加剂
KR101980466B1 (ko) 2015-03-05 2019-05-20 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 삼차원 물체 생성 기법
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
US20200045831A1 (en) * 2018-08-03 2020-02-06 Hutchinson Technology Incorporated Method of forming material for a circuit using nickel and phosphorous
US11505867B1 (en) 2021-06-14 2022-11-22 Consolidated Nuclear Security, LLC Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953624A (en) 1974-05-06 1976-04-27 Rca Corporation Method of electrolessly depositing nickel-phosphorus alloys
US4397812A (en) 1974-05-24 1983-08-09 Richardson Chemical Company Electroless nickel polyalloys
US4483711A (en) 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US5221328A (en) 1991-11-27 1993-06-22 Mcgean-Rohco, Inc. Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
US5258061A (en) 1992-11-20 1993-11-02 Monsanto Company Electroless nickel plating baths
BR9707124A (pt) 1996-11-14 1999-07-20 Atotech Deutschland Gmbh Bando de niquelação sem corrente elétrica e processo aperfeiçoado que utiliza este banho
US5944879A (en) 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration
US6099624A (en) 1997-07-09 2000-08-08 Elf Atochem North America, Inc. Nickel-phosphorus alloy coatings
US6020021A (en) 1998-08-28 2000-02-01 Mallory, Jr.; Glenn O. Method for depositing electroless nickel phosphorus alloys

Also Published As

Publication number Publication date
ES2280652T3 (es) 2007-09-16
US20030232148A1 (en) 2003-12-18
ATE356229T1 (de) 2007-03-15
TWI248477B (en) 2006-02-01
US6800121B2 (en) 2004-10-05
CA2432580A1 (en) 2003-12-18
EP1378584A1 (de) 2004-01-07
DE60312261T2 (de) 2007-11-22
KR20040002613A (ko) 2004-01-07
TW200401051A (en) 2004-01-16
JP2004019004A (ja) 2004-01-22
EP1378584B1 (de) 2007-03-07
KR101080061B1 (ko) 2011-11-04

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Legal Events

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