DE60312261D1 - Lösung zur stromlosen Nickel-Plattierung - Google Patents

Lösung zur stromlosen Nickel-Plattierung

Info

Publication number
DE60312261D1
DE60312261D1 DE60312261T DE60312261T DE60312261D1 DE 60312261 D1 DE60312261 D1 DE 60312261D1 DE 60312261 T DE60312261 T DE 60312261T DE 60312261 T DE60312261 T DE 60312261T DE 60312261 D1 DE60312261 D1 DE 60312261D1
Authority
DE
Germany
Prior art keywords
nickel plating
plating solutions
nickel
hypophosphite
electroless nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60312261T
Other languages
English (en)
Other versions
DE60312261T2 (de
Inventor
George E Shahin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of DE60312261D1 publication Critical patent/DE60312261D1/de
Application granted granted Critical
Publication of DE60312261T2 publication Critical patent/DE60312261T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE60312261T 2002-06-18 2003-06-16 Lösung zur stromlosen Nickel-Plattierung Expired - Lifetime DE60312261T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/174,185 US6800121B2 (en) 2002-06-18 2002-06-18 Electroless nickel plating solutions
US174185 2002-06-18

Publications (2)

Publication Number Publication Date
DE60312261D1 true DE60312261D1 (de) 2007-04-19
DE60312261T2 DE60312261T2 (de) 2007-11-22

Family

ID=29720380

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60312261T Expired - Lifetime DE60312261T2 (de) 2002-06-18 2003-06-16 Lösung zur stromlosen Nickel-Plattierung

Country Status (9)

Country Link
US (1) US6800121B2 (de)
EP (1) EP1378584B1 (de)
JP (1) JP2004019004A (de)
KR (1) KR101080061B1 (de)
AT (1) ATE356229T1 (de)
CA (1) CA2432580A1 (de)
DE (1) DE60312261T2 (de)
ES (1) ES2280652T3 (de)
TW (1) TWI248477B (de)

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US20060225605A1 (en) * 2005-04-11 2006-10-12 Kloeckener James R Aqueous coating compositions and process for treating metal plated substrates
ES2422455T3 (es) 2005-08-12 2013-09-11 Modumetal Llc Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos
JP4965959B2 (ja) * 2005-10-25 2012-07-04 株式会社荏原製作所 無電解めっき装置
US7780772B2 (en) * 2005-11-25 2010-08-24 Lam Research Corporation Electroless deposition chemical system limiting strongly adsorbed species
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CA2730229C (en) 2008-07-07 2017-02-14 John D. Whitaker Property modulated materials and methods of making the same
DE602008005748D1 (de) * 2008-10-17 2011-05-05 Atotech Deutschland Gmbh Spannungsreduzierte Ni-P/Pd-Stapel für Waferoberfläche
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
BR122013014464B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodepósito para produção de um revestimento
WO2011003116A2 (en) 2009-07-03 2011-01-06 Enthone Inc. Beta-amino acid comprising electrolyte and method for the deposition of a metal layer
CN101851752B (zh) * 2010-06-09 2013-01-09 济南德锡科技有限公司 一种长寿、高速的酸性环保光亮化学镀镍添加剂及其使用方法
WO2012001134A2 (de) * 2010-06-30 2012-01-05 Schauenburg Ruhrkunststoff Gmbh Verfahren zur abscheidung einer nickel-metall-schicht
CN105386103B (zh) 2010-07-22 2018-07-31 莫杜美拓有限公司 纳米层压黄铜合金的材料及其电化学沉积方法
MY166049A (en) * 2010-09-03 2018-05-22 Omg Electronic Chemicals Llc Electroless nickel alloy plating bath and process for depositing thereof
US20120061698A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US20120061710A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
JP2012087386A (ja) * 2010-10-21 2012-05-10 Toyota Motor Corp 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP3255176B1 (de) * 2011-01-11 2019-05-01 MacDermid Enthone America LLC Verfahren zur beschichtung eines teilchenförmigen materials
US20120247223A1 (en) * 2011-03-30 2012-10-04 Canada Pipeline Accessories, Co. Ltd. Electroless Plated Fluid Flow Conditioner and Pipe Assembly
KR101297774B1 (ko) * 2012-03-12 2013-08-20 포항공과대학교 산학협력단 선도장 강판 절단면 부식방지를 위한 비전해질 니켈-인 코팅
KR102014088B1 (ko) * 2012-03-20 2019-08-26 엘지이노텍 주식회사 메모리카드, 메모리 카드용 인쇄회로기판 및 이의 제조 방법
JP5890236B2 (ja) * 2012-04-10 2016-03-22 東洋鋼鈑株式会社 ハードディスク用基板の製造方法
US9752231B2 (en) * 2012-05-11 2017-09-05 Lam Research Corporation Apparatus for electroless metal deposition having filter system and associated oxygen source
TWI455750B (zh) * 2012-06-04 2014-10-11 Arps Inc 表面處理濕製程含磷無電鎳之鍍液成分的循環利用系統
US8936672B1 (en) * 2012-06-22 2015-01-20 Accu-Labs, Inc. Polishing and electroless nickel compositions, kits, and methods
CN110273167A (zh) 2013-03-15 2019-09-24 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
WO2014145588A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nickel chromium nanolaminate coating having high hardness
EP2823890A1 (de) * 2013-07-11 2015-01-14 FRANZ Oberflächentechnik GmbH & Co KG Verfahren und Anlage zum nasschemischen Abscheiden von Nickelschichten
US10246778B2 (en) * 2013-08-07 2019-04-02 Macdermid Acumen, Inc. Electroless nickel plating solution and method
US11685999B2 (en) * 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
BR112017005464A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc método e aparelho para aplicar continuamente revestimentos de metal nanolaminado
EP3026143A1 (de) * 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten
CN104561948B (zh) * 2015-01-28 2015-08-05 哈尔滨三泳金属表面技术有限公司 一种环保型铝合金快速化学镀镍-磷添加剂
WO2016140670A1 (en) 2015-03-05 2016-09-09 Hewlett-Packard Development Company, L.P. Generating three-dimensional objects
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
CN109963966B (zh) 2016-09-14 2022-10-11 莫杜美拓有限公司 用于可靠、高通量、复杂电场生成的系统以及由其生产涂层的方法
WO2018085591A1 (en) 2016-11-02 2018-05-11 Modumetal, Inc. Topology optimized high interface packing structures
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CA3060619A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
CN112272717B (zh) 2018-04-27 2024-01-05 莫杜美拓有限公司 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法
US20200045831A1 (en) * 2018-08-03 2020-02-06 Hutchinson Technology Incorporated Method of forming material for a circuit using nickel and phosphorous
US11505867B1 (en) 2021-06-14 2022-11-22 Consolidated Nuclear Security, LLC Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore

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US3953624A (en) 1974-05-06 1976-04-27 Rca Corporation Method of electrolessly depositing nickel-phosphorus alloys
US4397812A (en) 1974-05-24 1983-08-09 Richardson Chemical Company Electroless nickel polyalloys
US4483711A (en) 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US5221328A (en) 1991-11-27 1993-06-22 Mcgean-Rohco, Inc. Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
US5258061A (en) 1992-11-20 1993-11-02 Monsanto Company Electroless nickel plating baths
JP2000503354A (ja) 1996-11-14 2000-03-21 アトテク ドイツェラント ゲーエムベーハー 無電解ニッケルめっき浴からのオルト亜燐酸塩イオンの除去
US5944879A (en) 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration
US6099624A (en) * 1997-07-09 2000-08-08 Elf Atochem North America, Inc. Nickel-phosphorus alloy coatings
US6020021A (en) 1998-08-28 2000-02-01 Mallory, Jr.; Glenn O. Method for depositing electroless nickel phosphorus alloys

Also Published As

Publication number Publication date
US20030232148A1 (en) 2003-12-18
TWI248477B (en) 2006-02-01
CA2432580A1 (en) 2003-12-18
ATE356229T1 (de) 2007-03-15
TW200401051A (en) 2004-01-16
EP1378584B1 (de) 2007-03-07
ES2280652T3 (es) 2007-09-16
KR20040002613A (ko) 2004-01-07
EP1378584A1 (de) 2004-01-07
KR101080061B1 (ko) 2011-11-04
US6800121B2 (en) 2004-10-05
DE60312261T2 (de) 2007-11-22
JP2004019004A (ja) 2004-01-22

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Legal Events

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